Managing a surface-mount assembly line, or factory floor, through a centralised software environment makes perfect sense, in theory. In practice, however, high-level third-party line- management packages can struggle to collect and aggregate data coming in dissimilar, proprietary formats from machines produced by different brands.

Maintaining compatibility between the software and these different data-interface specifications is always difficult, as vendors publish updates independently without reference to the third-party software vendors. Although most support industry-standard equipment interfaces such as SECS/GEM, these allow only basic communication. Moreover, the most widely recognised line- management software is expensive and modules must usually be purchased individually.

Facing such challenges, some electronic manufacturing businesses see benefits in committing to one brand for printing, placement and inspection and may use the vendor’s own smart factory tools to gain overall visibility and control. On the other hand, some value the freedom to choose equipment from various brands and find their own way to manage and optimise the machines in their lines.

In either case, the landscape is changing. The world is becoming increasingly focused on Big Data to guide decision making and drive continuous improvement. It works because the computing power to handle vast quantities of process data is more affordable than ever, as is the bulk memory needed for data storage. In addition, the data science to generate actionable insights from the captured information is growing quickly. Manufacturing businesses need to take advantage of these tools to maximise equipment performance and minimise errors, and thus continue increasing their productivity.

The Value of SMT Management Software

An effective SMT line and factory management software package enables manufacturers to visualise operating quality status, monitor SMT lines in real-time, identify the causes of problems and failures, and resolve problems that may occur in any line.

Operators attending to machines in the factory need information at the line level to assess operating status, recover machine errors, and restore production. Team leaders, on the other hand, need information about all the factory’s SMT lines to monitor overall progress, stay appraised of Operational Equipment Effectiveness (OEE), and handle any machine issues, as well as dealing with defective products. Engineers and floor leaders acting at a strategic level need analytics applications to help them take the lead on OEE, identify the causes of any problems or failures, and continuously improve and optimize machine settings. Finally, business managers need high-level information to confirm the status of the line at any given time, give instructions, plan future capital investment, and report to the top management.

Yamaha’s printing, placement, and inspection systems collect and share data that enables cutting-edge analytics to reveal deeper insights into process performance when combined with advanced graphical user-interface design.

Working with this data, the YSUP Dashboard application provides easy visual access to line-level and floor-level performance data such as OEE indices. There are also more powerful analytics tools that provide deeper analysis of printing, placement, and soldering process performance. These enable users to view trends, as well as correlations between process metrics such as pickup and placement accuracy that can help fine-tune equipment and processes, as well as identifying any defects and quickly diagnosing the causes. Aided by powerful imaging tools, Dashboard can also help analyse exceptional incidents on an individual basis and determine the most appropriate corrective action.

Factory, Line, and Process Monitoring

The floor monitor tool shows individual availability, performance, and quality - the composite parts that make up the familiar Overall Equipment Effectiveness (OEE) metric - for each line in the factory. The OEE is calculated from these and displayed, as well as the pickup rate, defect rate, and the end of line yield. All are colour coded to allow easy at-a-glance assessment.

The line monitor view (figure 2) provides a more detailed picture of each line’s performance including batch progress and the job end time, with assembly ID and production-lot information. The ability to see pickup accuracy and placement accuracy simultaneously helps viewers determine the origin of component-placement defects, helping to direct remedial action such as feeder maintenance or nozzle cleaning.

Additionally, for the first time, printing and solder-paste inspection (SPI) analysis are integrated within the environment. At a glance, the user can view the results at line level. Subsequently, clicking through shows analysis of print condition and inspection results for each individual pad. It is also possible to view print trends such as alignment analysis, inspect the relationships between print results and parameters including pressure, squeegee speed, and separation speed in the same window, and examine the timing of print events such as paste replenishment, cleaning cycles, and print-error indicators. This information is available even when SPI data is not present. Together, these Dashboard features help users identify the causes of any printing defects extremely quickly and with pinpoint accuracy.

The Dashboard software helps users take advantage of inspection images to assist troubleshooting. All inspection images, for each unit produced, are stored and can be retrieved within Dashboard to assist the investigation of any defects. Viewing process data such as print and pickup information, alongside the image information, can help users identify the causes of defects that would otherwise require hours of manual analysis to track down. The following examples of failure analysis show how the use of Dashboard highlights process performance and enables operators to investigate or discount various events and focus their troubleshooting to deliver the greatest return.

Inspection-Assisted Failure analysis

Upon inspecting a production board after reflow, a surface- mounted connector was found to have rotated a few degrees during production. Analysis using Dashboard tools confirmed the shift in position, and helped pinpoint the cause by comparing the pickup rate for the connector against other components and identifying the time when the defect began to occur. This enabled the manufacturing team to cure the problem by readjusting the pickup offset. Subsequently, they were able to confirm that no further defects occurred.

Similarly, data from pre-reflow inspection identified alignment errors among 0402 chip resistors placed in a 2 x 4 array. Using solder mark recognition, the misalignment was detected as being greatest in the upper left portion of the array, becoming smaller towards the lower right. Using the All Image Tracer to assess the solder-mark image that was used as the reference to align the resistors, showed that the mark had been incorrectly recognised. Correcting the centre position of the mark cured the chip-resistor misalignment.

Using the All Image Tracer, the YSUP Dashboard tools also helped identify unusual problems such as the presence of foreign objects on the board surface and on the body of a component, as well as isolated issues such as a component supplied with a bent lead. Without these advanced tools, the causes of such defects would have taken a great deal of time and effort to find and rectify.

Conclusion

Big Data is ready to transform electronics manufacturing, with the potential to drive surface-mount assembly to higher levels of throughput and quality. However, some familiar barriers can hinder data exchange between manufacturing equipment and manufacturing management software. Yamaha, with its ONE STOP SMART SOLUTION, has shown how these barriers can be eliminated. Building on this, the latest generation of software tools are now emerging to deliver more valuable and actionable insights into factory, line, and process performance than ever before.

About Yamaha Robotics SMT Section

Yamaha Surface Mount Technology (SMT) Section, a subdivision of Yamaha Motor Robotics Business Unit in Yamaha Motor Corporation, produces a complete selection of equipment for high-speed inline electronic assembly. This 1 STOP SMART SOLUTION includes solder paste printers, component mounters, 3D solder paste inspection machines, 3D PCB inspection machines, flip-chip hybrid placers, dispensers, intelligent component storage, and management software.

Bringing the Yamaha way to electronics manufacturing, these systems prioritize intuitive operator interaction, efficient coordination between all inline processes, and modularity enabling users to meet the latest manufacturing demands. Group competencies in servo-motor control and image recognition for vision (camera) systems ensure extreme accuracy with high speed.

The current product line includes the latest YR equipment generation, with advanced automated features for programming, setup, and changeovers, and new YSUP management software with state-of-the-art graphics and built-in data analytics. Combining design and engineering, manufacture, sales, and service competencies, Yamaha SMT Section ensures operational efficiency and easy access to support for customers and partners. With regional offices in Japan, China, Southeast Asia, Europe and North America, the company provides truly global presence.

www.yamaha-motor-robotics.eu

STOCKHOLM — On 12 October, NOTE sent out a Press Release about a potential bad debt since one of NOTE's customer in the UK had applied for administration and that all the customer's operations were stopped in connection with this. In the third quarter, NOTE took a cost for the potential bad debt of SEK 30 million, which corresponded to the entire risk exposure that NOTE had towards the company.

The customer has now been acquired by another company in the same industry, electric vehicles charging. NOTE has had a productive dialogue with the new owner, who intends to resume production as soon as possible and continue the previous partnership with NOTE.

“This process has gone much faster than we expected. I look positively on the continued cooperation with the new owner. The company's principals have a long history in the industry and we look positively on deepening the cooperation between the companies. We also see good opportunities for a significantly lower bad debt than our previous assessment, something that we intend to communicate in the report for the fourth quarter”, says Johannes Lind-Widestam, CEO and President.

ATLANTA, GA — Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will discuss the benefits of combining IPC-DPMX with IPC-CFX to deliver data directly to machines and streamline the process. Mr. Ivan Aduna, Global MES Manager at Koh Young America, will present the whitepaper on Thursday, 03 November 2022, during the MFX5 Smart Factory & Automation Technical Session during SMTA International in Minneapolis, Minnesota.

The paper, a collaboration with Michael Ford from AEGIS Software and Hemant Shah, the IPC-DPMX Consortium Chair, will outline how to securely exchange data between design and manufacturing areas by using the Digital Product Model Exchange (IPC-2581 DPMX) and Connected Factory Exchange (IPC-2591 CFX) standards. This combination will help electronics manufacturers improve efficiency, security, and costs.

IPC-DPMX is a standard for transmitting information between a printed circuit board designer and a manufacturing or assembly facility. For nearly every step in the process, IPC-DPMX offers a standard to help companies ensure superior manufacturability, quality, reliability, and consistency. IPC-CFX is an industry-developed open standard forming the backbone of a smart factory. IPC-CFX is a plug-and-play solution that simplifies and standardizes machine-to-machine communication, while helping machine-to-business and business-to-machine applications.

Traditionally, it could take days for manufacturers to compile the necessary files needed for production. Worse, the outdated formats may exclude critical elements like stack-ups, materials, design intent, and more. With IPC-DPMX, what took days, now takes minutes thanks to an intelligent data exchange. “The IPC-DPMX and IPC-CFX combination provides production flexibility and security while driving the movement towards Industry 4.0,” said Ivan.

Description automatically generated with low confidenceTo learn more about how our solutions boost your quality, visit us at the SMTA International in booth 925. You can register to attend the in-person conference and exposition at https://smta.org/mpage/smtai-registration. If you cannot attend the panel, but still want to learn more about smart manufacturing and our best-in-class portfolio of True 3D solutions, visit our site at www.kohyoungamerica.com.

WASHINGTON — The U.S. Partnership for Assured Electronics (USPAE) is entering a new phase of rapid growth to better connect the electronics industry with government needs and opportunities. Effective immediately, membership dues are reduced to $1,000 for all organizations, and the process to join is streamlined.

USPAE membership entitles qualified companies to participate in the Defense Electronics Consortium (DEC), which is a Department of Defense contract vehicle targeted at non-traditional defense suppliers. The first DEC project is a $42 million effort that involves academia and large defense prime contractors along with small- and medium-sized companies.

“We anticipate a multi-project solicitation will be available to DEC members in the next few months,” said Chris Peters, USPAE Executive Director. “The business changes we’re making will help us be better positioned for that and other opportunities.”

Launched in 2020, USPAE is a DC-based nonprofit industry association dedicated to ensuring the U.S. government has access to resilient and trusted electronics supply chains. Membership is open to companies, academic institutions and nonprofit organizations based in the United States or its allies. Members from across the electronics supply chain participate in a variety of programs, such as conferences, networking events, and funded projects.

For further information, visit www.USPAE.org or send inquiries to info@uspae.org.