NORTH BILLERICA, MA – BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, announced today the capability to manufacture reflow ovens in Mexico.

“Mexico is an extremely important part of our customer base,” said Rob DiMatteo, General Manager of BTU International. “By entering into an exclusive contract with an existing sub- contractor in Mexico, this allows us to be more responsive to our many customers in the region and has us shipping Pyramax reflow ovens rapidly – as soon as next month,” added DiMatteo.

BTU has partnered exclusively with a contract manufacturer in Mexico and has entered into a contractual agreement with standardized pricing and lead-times securing a stable forecast for reflow oven capacity in the region. The manufacturing facility holds ISO-9001 certification and has advanced manufacturing capabilities including electrostatic painting, welding, and laser cutting. The first units being produced in Mexico by BTU are Pyramax125 air capable units – as production ramps additional reflow oven models will be added based on customer demand.

BTU’s contract manufacturing partner in Mexico is an established, vertically integrated manufacturer located in central Mexico. In addition to the agreement with BTU, the manufacturer has existing business with other industrial and large automotive customers – necessitating compliance with international quality standards. In addition, within the contract manufacturing agreement, BTU’s partner is restricted from making products that directly compete with BTU. BTU will also leverage this agreement to enable greater capacity and cost savings in the supply chain for its other North American operations.

AYLESBURY, UNITED KINGDOM – Nordson TEST & INSPECTION today announced its participation in SEMICON Taiwan, one of the most anticipated events in the semiconductor industry. The company will be showcasing its state-of-the-art inspection and metrology solutions, including the CyberOptics SQ3000™+ Multi-Function system, the new Quadra 7 Pro Manual X-ray Inspection (MXI) System, and the revolutionary WaferSense® Auto Teaching System™ (ATS2). The event will take place from Sept. 6-8, 2023 at TaiNEX 1&2 in Taipei.

The new Quadra 7 Pro MXI system sets a new standard for 3D/2D manual inspection in back-end semiconductor applications. Powered by the revolutionary Onyx® detector technology, it delivers exceptional image clarity and reduced noise levels, elevating the inspection experience to new levels of precision and efficiency.

Equipped with the latest Dual Mode Quadra NT4® tube, the Quadra 7 Pro provides users with maximum flexibility. This innovative feature offers brightness and resolution modes, allowing operators to dynamically switch between them based on specific application requirements.

Enhancing the Quadra 7 Pro's capabilities is the newly developed Revalution™ software, tailored specifically for high-end semiconductor applications. With an intuitive interface, optimized workflow, and expanded functionality, Revalution™ software empowers operators to efficiently analyze and interpret inspection data, contributing to faster decision-making and improved overall productivity.

The CyberOptics SQ3000™+ Multi-Function system is designed for high-end applications, catering to industries such as advanced packaging, mini-LED, advanced SMT, and 008004/0201 SPI. This all- in-one solution offers unmatched accuracy and high speed, utilizing an even higher resolution Multi-Reflection Suppression® (MRS®) sensor that effectively eliminates reflection-based distortions caused by shiny components and specular surfaces.

The WaferSense® Auto Teaching System™ (ATS2) is a multi-camera sensor that, when used in conjunction with CyberSpectrum™ software, enables accurate wafer hand-off calibration for semiconductor tool alignment and setup for front-end semiconductor fab environments. With the ability to capture three-dimensional offset data (x, y, and z) in real-time, ATS2 simplifies wafer position teaching without the need to open the tools. This results in repeatable and reproducible setups, streamlined maintenance checks, accelerated troubleshooting, and reduced technician-to-technician variation, leading to significant yield improvements and enhanced productivity for semiconductor fabs worldwide.

To witness the future of advanced inspection and metrology technology, visit booth #L0800 on the 4 th floor at SEMICON Taiwan 2023, and explore Nordson TEST & INSPECTION's range of industry-leading solutions.

For more information, visit www.nordson.com

CLINTON, NY – Indium Corporation Senior Area Technical Manager Jason Chou will present at SEMICON Taiwan on September 7, in Taipei, Taiwan.

In his presentation, The Lead-Free Materials Evolution in Power Die-Attach Soldering Applications, Chou will provide an overview of the die-attach process and explore the ongoing evolution of materials used in the application including high-Pb, low-alpha solder paste, high-temperature, Pb-free paste, and sintering products.

As senior area technical manager in Taiwan, Chou provides technical support to customers with a focus on the semiconductor industry. He has 10 years of industry experience, including specialization in front-end wafer fabrication processes, thin-film modules, and defect analysis for wafer metrology. Chou earned a master’s degree in Chemistry from National Tsing Hua University and a bachelor’s degree in Chemistry from National Cheng Kung University. He served as the group leader for the National Nano Device Laboratory, Tainan, Taiwan, where he collaborated with university professors and industry professionals on special projects for semiconductor manufacturing.

TORRANCE, CA – Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is excited to announce an upcoming SMTA Technical Webinar titled "Effectiveness of Strain Gage Methodology for Durable Board Design." The webinar will be presented by Seika Machinery’s principal, James Hara, Principal at Kyowa Electronic Instruments Co., Ltd.

The webinar is scheduled to take place on Tuesday, Sept. 12th, 2023, from 1-2 p.m. Eastern Time. Mr. Hara, a renowned expert in the field of mechanical test and measurement, will delve into the crucial topic of ensuring the mechanical endurance and durability of printed circuit boards (PCBs) in challenging environments.

Printed circuit boards used in applications such as automobiles, commercial vehicles, and electronics are exposed to demanding conditions that require exceptional mechanical endurance. Even the slightest crack or failure in these boards can lead to the overall failure of electronic systems. To prevent such failures and achieve long-term stability, suppliers must assess and understand the mechanical strain and stress levels, identifying critical and high-risk points for potential breakage with stress concentration.

Hara will draw on his nearly 10 years of experience working with Kyowa Electronic Instruments Co., Ltd. and Kyowa Americas Inc. to explore the effectiveness of the strain gage methodology for designing durable and resilient PCBs. The webinar will feature specific case studies that highlight the benefits and real-world applications of this methodology.

Hara has established himself as a leading expert in mechanical test and measurement. Over the past decade, he has provided technical support to industrial engineers using Kyowa's cutting-edge strain gages, signal transducers, and data acquisition technology in various applications. Based in the Michigan area, Hara currently serves as a sales engineer, offering his expertise to support test and measurement projects in both academic and industrial institutions across North America.

Seika Machinery invites professionals in the manufacturing industry to join this insightful webinar and gain valuable insights into ensuring the durability and reliability of printed circuit boards. Registration for the webinar is now open, and participants can reserve their spots by visiting the SMTA website.

For more information, contact Michelle Ogihara at 310-540-7310; e-mail michelle@seikausa.com; or visit www.seikausa.com