CLINTON, NY — The upcoming Electronics Packaging Technology Conference (EPTC) will feature presentations by two Indium Corporation experts. The conference, which takes place December 7–9 in Singapore, covers the complete spectrum of electronics packaging technology.

Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, will deliver a presentation titled Low-Temperature Material for First-Level Interconnect in Semiconductor Packaging, which is an initiative under the iNEMI Packaging TIG and co-authored with colleagues from IBM Corporation, Nihon Superior Co. LTD., and others. The focus of the presentation is whether low-temperature materials (LTM) being used in other levels of electronics assembly could also be used for first level interconnects in semiconductor packaging, and if there is enough driving force for implementing this use. It includes not only the interconnects to the processor but also those to all the functional elements in the package of which the processor is a part.

R&D Sintering Project Manager, Demi Yao, will present findings from a paper titled Pressure Copper Sintering Paste for High-Power Device Die-Attach Applications. This presentation focuses on the development of a copper (Cu) sintering paste with high shear strength, high thermal and electrical conductivity, and positive reliability for high-power device die-attach applications. The paste is suitable for different metallizations, e.g., Au, Ag, and Cu. After more than 1,000 hours (250°C) aging and 3,500 cycles TCT (-40–175°C), the joints exhibited excellent performance without delamination. Shear strength increased with increased TCT cycles. This Cu sintering paste can be used for both dispensing and printing applications.

WASHINGTON, MO ― SASinno Americas is pleased to announce that SMTVYS Technology is now the exclusive distributor for the company’s selective soldering business in Mexico.

“I am very pleased to have SMTVYS as our exclusive partner in Mexico for our Sasinno selective soldering machines,” stated Mike Young, SASinno Americas. “To help our customers achieve quality soldering products, both high quality machines and high quality support is necessary.”

SMTVYS was born out of the need for support and value for the manufacturing industry back in 2014. The leading professional group offers solutions ranging from industrial equipment, spare parts, technical support, consulting, world-known brands of industrial equipment, automation, peripheral devices, electrostatic and discharge (ESD) solutions.

Young added, “We are impressed by SMTVYS’ professionalism and how they put their customers first. We are excited to expand our partnership and for SMTVYS to offer the full range of Sasinno equipment in Mexico. Meanwhile, Sasinnno will do our best to support SMTVYS and service the market well.”

For more information about SMTVYS, contact Victor Madero at vhmadero@smtvys.com or visit www.smtvys.com.

For more information about SASInno Americas, visit www.sasinnoamericas.com.

HANOVER, GERMANY – Viscom AG’s Technology Forum has a reputation for offering participants wide-ranging content with valuable practical relevance in a compact format. Looking at the big picture is a key aspect as well. Held at the beginning of October, the event on Viscom’s campus in Hanover, Germany, again offered extensive opportunities to experience cutting-edge inspection solutions for electronics manufacturing live and discuss important topics with fellow specialists, just as before the pandemic. Those unable to attend the Forum in person had the chance to participate in the interactive online program.

How much can our experience help us in a time when changes are happening faster than we were used to in the past? Why do we need a culture today in which it’s also okay to make mistakes? In his talk “Never get lost – the art of making difficult decisions,” well-known keynote speaker Peter Brandl discussed at this year’s Viscom Technology Forum how we can establish more clarity and direction in order to actually achieve the goals we have set for ourselves. Brandl noted that many projects take on an incredible dynamic of their own. Discussions center on problems and difficulties, and everything goes around in circles without moving forwards.

Brandl is a consultant, pilot, author, and entrepreneur, and he highlighted various decision-making pitfalls to be avoided. Some examples include entrenched habits or the familiar bubble that happens online in particular, where we’re soon surrounded only by people who have opinions and attitudes similar to our own. Brandl urged his listeners to be more prepared to take risks and to build teams that bring together various strengths and affinities.

One hotly debated issue that requires clear decisions and rapid action in our current times is the question of which climate strategies are the right ones. Karsten Schischke from the Fraunhofer Institute for Reliability and Microintegration offered a fascinating insight into this issue at the Viscom Technology Forum. His talk focused on approaches that can be effectively put into action in companies today, from their own production through to the delivery chain. These considerations should take into account the company’s own vehicles, heating using fossil fuels, process emissions, electricity consumption, and upstream and downstream activities. At the same time, Schischke also specifically addressed PCB manufacturing and mentioned related influencing factors such as the number of layers in the product or the energy mix the company uses at its production site.

Both Brandl and Schischke as well as the speakers from Viscom presented their topics in the traditional way, live in front of an audience. In 2021, the Viscom Technology Forum had to be held completely online. It goes without saying that no one involved in the planning could be completely certain that COVID-19 wouldn’t put the in-person component of this year’s hybrid event at risk at the last minute. However, the provisions in place together with appropriate preventive measures made it possible to successfully link this event back to those held in the years prior to the pandemic, and Viscom was able to present a wide range of innovations in front of a large audience of interested attendees.

“We showed our best side and can be proud of how we’ve moved forward. That’s something that becomes particularly clear at an event like this,” says Carsten Salewski, Head of Sales, Marketing, and International Business at Viscom.

This year’s motto was “New Horizons in Electronics Production – an Innovative Approach to Automation with Smart Inspection, AI and Process Networking.” A corresponding English version of the two-day event was held online directly afterward.

The chosen motto intentionally brings to mind that quality control needs to always stay one step ahead of market requirements in the production of cutting-edge electronics, an area that never stands still. The Viscom Technology Forum responded by offering concrete solutions that open up new horizons. One example is a cleverly designed status monitoring solution for the inspection systems and associated peripheral equipment being used, such as offered by Viscom as part of its modular vConnect platform. This creates the conditions for forward-looking action in keeping with modern predictive maintenance. Central IT management and efficient handling of large quantities of data are other elements in this comprehensive toolbox which was examined from various perspectives during a presentation.

Artificial intelligence is one of many terms that comes up in connection with vConnect. The Viscom Technology Forum 2022 placed a separate focus on this topic. Customers had the chance to discover what AI is capable of on production lines today during one of the workshops on offer. Whether it’s verifying inspection results or segmenting voids – artificial intelligence can provide production staff with effective support in detecting errors and helps to make their work more flexible. Other topics covered in the wide range of talks, workshops, and meet-the-expert sessions included, for example, the use of ECAD data as the basis for creating inspection programs, 3D layer analyses and volumetric display in the area of manual and automated X-ray imaging, the right way to handle radiation loads in inline X-rays with the help of a special dosing server, ensuring the repeat accuracy of 3D AXI inspection results or rapidly transferring 3D AOI data via the open IPC CFX interface.

The industry itself wasn’t the only source of interest in the Viscom Technology Forum. The field of politics was also represented by well- known figures from Germany’s Social Democratic Party, with member of the Bundestag and party head Lars Klingbeil, member of the Bundestag Adis Ahmetovic, deputy chairman of the parliamentary group in the state parliament of Lower Saxony Stefan Politze, and president of the Hanover region Steffen Krach making a visit to the event. An intensive discussion focused on various aspects, including where policymakers can provide effective support to companies like Viscom. In addition, a short tour provided a vivid look at Viscom’s way of working and the special features of the inspection systems produced by its employees.

Those at the Viscom Technology Forum who were interested in taking a detailed look behind the scenes of the company had the chance to go on an extensive tour that offered an exclusive insight into production and logistics. Items on the agenda included, for example, a visit to the competence center for microfocus X-ray tubes, where a wide range of closely interlinked tasks have been located since June 2019, ranging from development, to production and final approval, and all the way to custom adaptations of the tubes. The center is home to three radiation shielding rooms for conducting fatigue and stress tests on the products. Meanwhile, tailored tours focusing on innovation at Viscom provided a compact look at the current highlights of the 3D SPI, 3D AOI, 3D AXI, 3D MXI, 3D Bond, and CCI inspection technologies. Key information was provided directly at each of the inspection systems in the form of a quick overview.

PENANG, MALAYSIA — ViTrox Technologies is honored to announce that our V510i Advanced 3D Optical Inspection (AOI) Solution has successfully passed the qualification audit for IPC-CFX-2591 Qualified Products Listing (QPL) and has received the mandatory IPC- CFX messages for classification.

The implementation of the IPC-CFX on a shop floor heavily relies on the equipment's ability to support the IPC-CFX-2591 standards. ViTrox’s 3D AOI solution's successful validation of IPC- CFX QPL strengthens the confidence of our global customers in the quality of ViTrox PCB SMT Vision Inspection solution and products, especially in connecting equipment and data with the standard IoT protocol for Industrial 4.0 applications, such as IPC-CFX-2951. The listing of V510i 3D AOI on the IPC-CFX QPL also signifies that ViTrox’s solution is compatible with the IPC- CFX-2591 standards. Hence, electronics manufacturers and OEMs planning to implement the IPC-CFX can be confident that ViTrox PCB SMT Vision Inspection solution is compatible with IPC-CFX, which is suitable to meet their requirements.

At the same time, ViTrox continues to develop the most innovative solution with machine-to- machine (M2M) connectivity to match the ever-changing demands in the electronics manufacturing industry, moving further into the era of Smart Manufacturing. Hence, ViTrox is actively collaborating with IPC to validate the full spectrum of its PCB SMT Vision Inspection Solution for the IPC CFX QPL. You can also find the validated ViTrox Solutions on the IPC- CFX-2591 QP Listing Portal at https://certification.connectedfactoryexchange.com/certification- directory.

ViTrox has also expanded its latest V510i 3D AOI detection capability to inspect beyond the SMT component packages that match the current market demand to improve the user experience. With Artificial Intelligent (A.I.) integration, the V510i 3D AOI AI Smart programming automates the AOI programming process using intelligent algorithm assignment compliant with the IPC Class parameters and covers up to 95% of component packages. Users can also enjoy up to 88% of programming time improvement for NPI. In addition, A.I. integrated VVTS provides the best-in-class A.I. model to support users with the automated post-inspection call analysis and judgment that can eliminate human judgment mistakes. Overall, the V510i 3D AOI solution provides high-resolution imaging with Industry 4.0 Manufacturing Solution to achieve humanless operation through reduced operator workload with minimal skill dependency.

Asides from the IPC-CFX standard, ViTrox Industry 4.0 Manufacturing Intelligence Solution (V- ONE ® ) provides M2M connectivity and big data analytical capabilities for users to monitor production performance using the real-time production process insights and data analysis with image traceability across ViTrox vision solutions. With V-ONE ® , manufacturers can have a strategic approach to oversee the production process to minimize production downtime and improve production efficiency.

Are you interested in implementing IPC-CFX compliant vision inspection solution to achieve Smart Factory? Contact ViTrox Sales Experts by emailing (sales_pca@vitrox.com) or reach out to ViTrox Authorized Local Support for more information and assistance.