AUSTIN, TX ― Cetec ERP, a leading cloud ERP software provider, is pleased to announce that Jordan Jolly, Director of Sales and Implementation, will co-host a webinar with Zuken Americas entitled, “Connecting CAD Engineering to Your ERP System.” The webinar is scheduled to take place Wednesday, Jan. 18, 2023 at 2 p.m. EST. To register for the webinar, visit https://pages.zuken.com/webinar-connecting-cad- engineering-to-your-erp-system.html 

One of the joint pain points of manufacturing is being able to centralize data for multiple departments –particularly moving a BOM from an engineering CAD program such as Zuken's Harness Builder for E3.series into the ERP system for quoting, scheduling, procurement, inventory management and production. This slows down quote turnaround, causes multiple systems to have to be maintained, compromises traceability and reduces production visibility.

This webinar will cover pushing a BOM from Harness Builder for E3.series into Cetec ERP with the ability to trigger the production process with a push of a button.

Jolly helps oversee sales, marketing, product management, implementation and customer service. He has more than 10 years of experience in ERP, dealing specifically with manufacturing companies.

Cetec ERP’s leading-edge system helps customers handle stringent regulatory requirements and track dynamic production environments, all from a single, friendly web interface. All modules, support, maintenance and upgrades are included in the monthly subscription. To learn more about Cetec ERP, visit http://cetecerp.com/ 

CZECH REPUBLIC — PBT Works s.r.o., a leading manufacturer of cleaning technology for electronic assemblies and tooling, is pleased to announce that two of its newest cleaning machines, HyperSWASH and HyperCLEAN, offer excellent efficiency and low impact on the environment. They are similar in both name and appearance and yet, there is a difference between them according to cleaning application.

Both systems represent another approach to batch cleaning than large in-line cleaning machines. In practice, in-line cleaning machines are not fully utilized as well as demanding in terms of energy, water consumption and operator assistance in loading/unloading the assemblies.

The HyperSWASH III is designed for medium and large capacity factories with a highly flexible product range. It can clean very high-density assemblies up to the size of 29” x 29”. Direct spray with double row nozzles enables cleaning under the most challenging packages (large size flip- chip, QFN). The internal nozzle system can be replaced in three minutes with another designed for cleaning PCB baskets or magazines with assemblies. This configuration offers high capacity. An option of the automatic loading/unloading system can eliminate the operator between the assembly line and the cleaning station and following operations.

The HyperCLEAN III boasts a high-volume chamber. The machine is designed to clean boards in baskets or in magazines specially designed for cleaning, but also compatible with the loading/unloading units of the standard assembly lines. The HyperCLEAN can clean up to 5,5 m2 (59,20 sq ft) of assemblies in one process. This capacity roughly corresponds with half an hour up to one hour capacity of an inline system. The typical cleaning time for the HyperCLEAN is 60 to 90 minutes. This short cycle time can be achieved thanks to the new heat-recovery system in the dryer. The HyperCLEAN dryer achieves approximately twice the drying speed of other dryers.

HyperSWASH and HyperCLEAN represent a new platform of cleaning systems. They offer big performance in a minimal footprint. Both cleaners have unique rinsing. It consists of three subsequent rinse steps. The chemical stop with minimal waste-water volume, about 3-4 gallons/cycle. The first rinse and second rinse closed loops with deionized water reprocessing. Such a rinsing cascade enables us to utilize the maximum chemical filter capacity. Both machines represent a highly environmentally friendly approach to cleaning modern electronic assemblies.

PBT Works is EN ISO 9001 and EN ISO 14001 certified. For more information, visit www.pbt-works.com 

INDIANAPOLIS, IN — Specialty Coating Systems (SCS) will exhibit in Booth #2301 at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. The SCS team will showcase the Precisioncoat VI, PrecisionCure UVC (MUV) and conformal coating services.

With outstanding reliability and precision, the PrecisionCoat VI offers customers unmatched conformal coating and dispensing flexibility through a wide range of valves, tools and features.

SCS will have its industry-leading Automatic Quick Change (AQC) feature available for live demonstrations on the PrecisionCoat VI platform. The system will feature five programmable axes, servo motor position control and up to eight tools on a single machine to achieve exceptional accuracy, repeatability and high throughput for a wide range of automated material applications.

Additionally, SCS will exhibit its innovative curing system that features programmable curing profiles and the smallest footprint in the industry to maximize valuable production floor space. The PrecisionCure UVC microwave UV curing system provides customers with the flexibility needed to take their manufacturing operation to the next level.

The PrecisionCure UVC (MUV) utilizes Heraeus Noblelight ® microwave- activated UV lamps, the industry standard in microwave UV curing technology, and features a patent-pending lamp movement trolley that enables the UV lamp to move across the horizontal axis over a product on the conveyor. The curing system’s advanced lamp travel technology coupled with programmable curing profiles provides users with unparalleled control over the curing process.

With more than 50 years of experience in conformal coating engineering and applications, SCS is the world leader in Parylene, liquid, plasma polymerized, ALD and multilayer conformal coating technologies. The company is a direct descendant of the companies that originally developed Parylene, and leverages that expertise on every project – from initial planning to process application.

For more information, please visit www.scsequip.com

CLINTON, NY — Indium Corporation’s technical experts will share a variety of presentations on topics ranging from e-Mobility, achieving low voiding through solder preforms, high-performance metal thermal interface materials, low-temperature solder alloys, and low-temperature solder paste for wafer-level packaging at IPC APEX Expo, Jan. 24-26, San Diego, Calif., U.S.

Tuesday, Jan. 24

• Using Flux-Coated Preforms to Repeatably Achieve Low Voiding Under Power ICs: An Automotive Case Study by Regional Technical Manager and Technologist – Advanced Applications Andreas Karch

Wednesday, Jan. 25

• High-Performance Phase Change Metal TIMs by Product Development Specialist for Thermal Interface Materials Miloš Lazić

Thursday, Jan. 26

• e-Mobility/EV Automotive Technical Conference Special Session, co-chaired by Global Head of e-Mobility and Infrastructure Brian O’Leary.
• Energy Consumption Reduction Using Low-Temperature Solder Alloys by Senior Product Development Specialist Claire Hotvedt
• A Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application That Outperforms SAC305 by R&D Manager, Alloy Group Dr. HongWen Zhang

Karch provides technical support, including sharing process knowledge and making technical recommendations for the use of Indium Corporation’s materials for customers in Germany, Austria, and Switzerland. Products include solder paste, solder preforms, fluxes, and thermal management materials. He has more than 20 years of automotive industry experience in PCB assembly and power electronics, including the advanced development of customized electronics. He received an award for developing one of the top 10 innovative patents for automotive LED assembly. Andreas is an ECQA-certified integrated design engineer and earned his Six Sigma Yellow Belt. His thorough understanding of process technologies and project management skills reinforces Indium Corporation’s commitment to providing world-class service to our customers in Europe.

Lazić is responsible for developing new thermal materials and products, and providing solutions for customer challenges and applications. He also develops new testing methods to evaluate power and thermal products, and gathers data on new and existing products for marketing presentations. He joined Indium Corporation in March 2018 as a Technical Support Engineer, primarily responsible for servicing the troubleshooting and application needs of customers in the Northwest, California, and Rocky Mountain regions. In 2018, he took on the role of Coordinator for the Live@ Program—a global initiative designed to align Indium Corporation and its industry partners in the promotion of agile response, resource management, and efficiency improvement. Prior to joining Indium Corporation, he worked as the Deputy Technical Director at Radio-Television Nis in Serbia. He earned his master’s degree in electronics engineering and his bachelor’s degree in electrical engineering from the University of Nis in Serbia. He is an Energy Efficiency Engineer certified by the Serbian Chamber of Engineers in Belgrade; a Certified SMT Process Engineer; and is fluent in English, Serbian, Croatian, and Bosnian. Lazić was awarded the Silver Quill Best Paper Award in 2020.

Hotvedt plays a highly visible and critical role in the future of Indium Corporation’s solder paste business. This role exists in a cross-functional team environment in which she facilitates team initiatives to execute the new product development process and deliver fully scaled, launched, marketable product solutions for PCB Assembly solder pastes. Additionally, Claire provides training to the Sales & Tech teams about new products and is responsible for introducing these products to industry-leading customers. Hotvedt joined Indium Corporation in May 2018 as a Research Technologist. In 2019, she took on the role of Product Development Specialist, where she has been integral in the development and commercialization of the Durafuse™ LT technology and other high-reliability alloy offerings, including Indalloy®276 and Indalloy®292. Prior to joining Indium Corporation, she was employed as a product development engineer at a Rochester-based photoresist developer and as a validation engineer at a Syracuse-based firm. She was first introduced to Indium Corporation as a summer intern in 2014, where she researched the extraction of indium from LCD screens. She earned a bachelor’s degree in chemical engineering from the University of Rochester, with a minor in Mandarin Chinese. In college, she was a member of the Phi Beta Kappa and Tau Beta Pi Engineering Honor Societies. She is a Certified SMT Process Engineer (CSMTPE).

O’Leary is responsible for promoting Indium Corporation’s full range of products and services for e-Mobility, which includes electric cars, trucks, eVTOLs, charging stations, etc. He joined Indium Corporation in 2014 and has more than 20 years of experience in the electronics industry. He authored two books on thermal profiling called Profiling Guide for Profitability and Profiling Guide for Six Sigma. He currently serves as the chair of the IPC e-Mobility Quality & Reliability Advisory Council. In addition to regular technical conference participation, he co-hosts a free monthly webcast—EV InSIDER Live—with Loren McDonald of EVAdoption and a high-profile industry stakeholder as a guest. In the webcast, they discuss current pressing issues and hot topics in the rapidly evolving electric vehicle landscape.

Zhang is manager of the Alloy Group in Indium Corporation’s Research & Development Department. His focus is on the development of lead-free solder materials and the associated technologies for high-temperature and high-reliability applications. He and Dr. Ning-Cheng Lee invented the mixed-alloy solder technique to combine the merits of constituents to improve wetting, reduce processing temperatures, modify the bonding interface, and control the joint’s morphology, thus improving reliability. On the basis of this technique, the BiAgX® solder system was invented as an alternative high-temperature lead-free solder. Dr. Zhang has a bachelor’s degree in metallurgical physical chemistry from Central South University of China, a master’s degree in materials science and engineering from the Institute of Metal Research, Chinese Academy of Science, a master’s degree in mechanical engineering, and a Ph.D. in material science and engineering from Michigan Technological University. He has extensive experience in various aluminum (Al) alloys and fiber/particle-reinforced Al-based composite materials, and Al-rich and ZrHf-based amorphous alloys. Dr. HongWen Zhang co-authored two book chapters on high-temperature lead-free bonding materials. He and his colleagues had seven patents granted globally and numbers of patents filed. He has published approximately 20 journal publications in the field of metallurgy, materials science and engineering, physics, electronics materials, and mechanics. He has also been invited as a peer reviewer for numerous journals. Dr. Zhang has a Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College. He is also a certified IPC Specialist for IPC-A-600 and IPC-A-610D.