BLAUBEUREN, GERMANY – For several years now, Motek/Bondexpo in Stuttgart has been a consistent part of Rehm Thermal Systems' trade fair calendar. The focused orientation of the trade fair on the process chain of joining/connecting through adhesive bonding, potting, sealing, and foaming makes it an ideal platform for Rehm, especially in the areas of Conformal Coating and Dispensing. At Bondexpo, in Hall 5, Booth 5505, a ProtectoXP with an integrated 3D height sensor will be showcased, enabling reliable dispensing on various shapes.

Motek/Bondexpo provides designers, investment decision-makers, and purchasers with a clear profile, strong themes, and practical solutions, giving them everything they need to enhance and make their manufacturing processes more cost-effective. In a pleasant atmosphere, suppliers and users come together to discuss practical and actionable solutions. On-site Rehm experts are available to answer all questions related to dispensing various materials for joining processes, as well as potting and securing components. At Hall 5, Booth 5505, you can witness live demonstrations on a ProtectoXP, showcasing the diverse application areas and the new integrated 3D height sensor of this coating and dispensing system.

The Protecto systems deliver secure, automated processes and precise outcomes for applying a wide range of materials. They excel with robust engineering and versatile applications in the fields of dispensing and adhesive technology. With up to 4 applicators usable simultaneously, users have various options: In addition to dispensing, the ProtectoX series stands out for its ability to create freely defined three-dimensional enclosure shapes through simple application. Instant curing of UV coatings is possible with ProtectoX systems, as well as potting or bonding different materials.

The systems are operated through the intuitively controlled ViCON Protecto, which is particularly user-friendly due to its newly developed touchscreen interface. It features numerous software capabilities, including the ability to directly import eCAD data and image files for optimizing the coating process through trimming. Furthermore, coating programs can be created directly on the machine or at an offline workstation.

Gianfranco Sinistra, Product Sales at Rehm Thermal Systems, will also provide information on "Smart Solutions for Dispensing Applications" in his presentation on Wednesday, October 11, at 09:40 AM in the Motek Exhibitor Forum, Hall 5, Booth 5435. He will discuss the possibilities of designing complete dispensing lines as well as their horizontal and vertical integration for automated application control.

BALTIMORE, MD – Zentech Manufacturing is pleased to announce that it has chosen Tim Facklam to be its Chief Operating Officer. Tim will be responsible for leading Zentech in a collaborative environment to continuously improve operational performance in predictability, quality, cost, and customer satisfaction, as well as supply chain and operational excellence functions. He will also serve as a key member of the Zentech Senior Leadership Team.

Tim brings over 30 years of experience in the electronics industry and has served in a variety of roles during his career - (supply chain, engineering and technology services program management, operations management). Most recently, Tim was the Group VP of Operations at Benchmark, where he managed four sites across the US. Tim is experienced in the high reliability electronics space and is committed to Zentech’s goal of Mission Critical Manufacturing.

Prior to joining Benchmark in 2011, Mr. Facklam served for 6 years as Bluegene Supercomputer Delivery and Operations Manager at IBM. Preceding IBM, Mr. Facklam was Director of SCM at Celestica, an EMS provider.

Mr. Facklam holds a BBA in Business Management and Computer Science from the University of Wisconsin – Eau Claire and holds APICS and Black Belt certifications

Mike Buseman, Zentech’s Chief Executive Officer, said: “We are thrilled to have someone of Tim’s caliber joining our team at Zentech. His experience and leadership in contract manufacturing, OEMs, and supply chain will have a positive impact on both our company and our customers. These are extraordinary times for US manufacturing, we will continue to partner with our customers as the trusted source to deliver their mission critical manufacturing solutions.”

Tim commented, "I am honored to lead Operations at Zentech and look forward to working with an outstanding leadership team and the talented and dedicated staff at each site. I am thrilled to be a part of an organization that is focused on growing manufacturing capabilities and capacity in the US, and look forward to driving solutions for our customers’ complex challenges."

CLINTON, NY – Indium Corporation Global Head of e-Mobility and Infrastructure and Chair of the IPC e-Mobility Quality & Reliability Advisory Council Brian O’Leary is set to hit the road, participating in two upcoming EV panel presentations hosted by IPC.

First, O’Leary will travel to Timisoara, Romania for IPC Day Romania: Build Electronics Better with Standards and Solutions, September 27-28, where he will participate as part of the e-Mobility Reliability Panel. The conference provides a unique opportunity to learn about the latest advancements in electronics manufacturing, participate in industry discussions, and network with a community of professionals dedicated to building electronics better.

The following month, O’Leary is set to present alongside colleagues from KYZEN and Dow as part of an expert EV panel, Revving Up Reliability: Connect, Clean & Coat for Electric Vehicle Excellence, at IPC’s High Reliability Forum October 17-19 in Baltimore, Maryland. The session will focus on durability issues pertaining to PCBAs in e-Mobility infrastructure while providing practical strategies for enhancing the reliability of e-Mobility components and optimizing the overall user experience.

“IPC is doing great work to assure design, materials, and process optimization and qualification to achieve reliability and quality in electronics for e-Mobility and related infrastructure,” said O’Leary. “Engagements like these provide invaluable opportunities for colleagues to collaborate on solutions for this important and rapidly evolving market.”

O’Leary is responsible for promoting Indium Corporation’s full range of products and services for e-Mobility, which includes electric cars, trucks, eVTOLs, charging stations, and battery energy storage systems. He joined Indium Corporation in 2014 and has more than 20 years of experience in the electronics industry. He authored two books on electronics manufacturing and currently serves as the chair of the IPC e-Mobility Quality & Reliability Advisory Council. In addition to regular technical conference participation, O’Leary co-hosts a free monthly webcast—EV InSIDER Live—with Loren McDonald of EVAdoption and a high-profile industry stakeholder as a guest. In the webcast, they discuss current pressing issues and hot topics in the rapidly evolving electric vehicle landscape.

To learn more about why over four million electric vehicles are on the road with Indium Corporation’s innovative materials, visit indium.com/emobility.

NEWMAN LAKE, WA – Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, component lead tinning and solderability test equipment, announces that it has added assembly and production staff members to its team to accommodate its recent increase in sales and order demand.

“As our business continues to grow, we have added new employees and created new positions within our organization,” said Reid Henry, President of Hentec/RPS. “After celebrating more than 25 years in the automated soldering industry we are continuing to expand our support team to provide the best service in the industry to our growing customer base. With this increased demand we have recently promoted Russel Eiris to Electrical Tech II as part of our internal expansion. Fortunately for Hentec/RPS, our automated selective soldering machines, component lead tinning machines and solderability test equipment are proudly made in the USA which minimizes the effect of an international trade war. In addition, the continued need for gold removal, component re- conditioning and BGA de-balling continues to increase the demand for our Odyssey robotic hot solder dip machines.”