Press Releases
CONKLIN, NY – Universal Instruments will join parent company Delta, a global leading provider of IoT-based Smart Green Solutions, to exhibit a comprehensive portfolio of smart solutions for semiconductor processing, including Delta’s Wafer Inspection and Grinding solutions and Universal’s Multi-die Advanced Packaging solutions. Universal will also demonstrate its FuzionSC™ Platform equipped with a High-Speed Wafer Feeder (HSWF) while Delta will highlight its Wafer Edge Grinding, Edge Profile Measurement, Sorter, and IR Pinhole Inspection capabilities. Visit us at Booth Q5446 (TaiNEX 2) at the SEMICON Taiwan trade show in Taipei on September 6–8.
The FuzionSC Platform delivers precision accuracy, the widest component range and the highest flip chip throughput across the largest area. With the ability to handle all facets of flip chip assembly, FuzionSC reduces operating and capital costs by maximizing throughput per floor space. The HSWF is the world’s fastest rapid-exchange multi-die feeder. Combined with FuzionSC, it provides the highest utilization and best overall economics for advanced multi-die applications.
“With multi-die packages burgeoning, we introduced a solution capable of placing multiple die types in a single cell and eliminated the need to move product between cells, which compromises both accuracy and efficiency,” said Universal Instruments Vice President of Marketing, Glenn Farris. “The flexibility, accuracy and throughput of this system make it the world’s only all-in-one solution for heterogeneous integration and leading-edge applications such as EV power module assembly. We’re thrilled to be able to showcase it alongside Delta’s breadth of precision processing solutions to the semiconductor community at the exhibition.”
Along with visiting the booth, Universal encourages attendees join one or both technical presentations by Glenn Farris, Universal Instruments Vice President of Marketing. On Wednesday, September 6 at 3:30 pm CST at FLEX Taiwan, he will present “Advanced Packaging Technology Enabling Wearable Electronics”. On Friday, September 8 at 2:40 pm CST, he will present “Intelligent System Architectures for Heterogeneous Integration Assembly” at the HITECH Smart Manufacturing Forum.
To learn more about Universal’s solutions for any electronics manufacturing challenge, contact Universal Instruments at +1-800-432-2607 or +1-607-779-7522 or visit www.uic.com
TORRINGTON, CT – Dymax , a leading manufacturer of light-curing materials and equipment, is pleased to announce that their ground-breaking conformal coating, 9771 , has completed the rigorqualification testing for Military Specification MIL-I-46058C. This UL94V0 and UL746E recognized dual-cure coating has also been approved to the IPC-CC-830B standard and fully complies with RoHS2 Directives 2015/863/EU.
The MIL-I-46058C standard establishes conformal coating compliance requirements and evaluates them to an extensive list of properties, including curing time and temperature, material thickness, moisture resistance, funresistance, insulation resistance, flexibility, hydrolytic stability, and flame resistance. 9771 is now listed in the DOD QPL (Qualified Products Listing) database so military manufacturers know it is approved.
Along with this important recognition, 9771 coating passes NLow Outgassing ASTM E595 specification for cleaner PCBs during extreme conditions and meets low-ionic content compliance with Mil-Std 883 Method 5011. Additionally, 9771 is NMAPTIS listed and assigned material number 09841, so suppliers searching for low-outgassing coatings can easily find it in the database.
Dymax 9771 conformal coating is 100% solids with a blue fluorescing tracer. This high-performance, dual-cure reworkable conformal coating cures with UV/Visible light and moisture in shadow areas.
NEWMAN LAKE, WA – Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that DRI India Relay Pvt Ltd. has purchased Pulsar solderability testing and Photon steam aging systems for installation in their India facility.
The Pulsar utilizes the highly proven dip-and- look test method that is a qualitative type test performed by comparative analysis. The Pulsar solderability test system complies with all applicable solderability test standards including MIL-STD-883 Method 2003, IPC J-STD-002 and MIL-STD-202 Method 208. The Photon steam aging system is used for accelerated life testing to simulate elongated storage conditions for high-reliability applications. These steam aging systems complement component lead tinning machines designed to perform component re-tinning, tin whisker mitigation, gold removal and BGA de-balling for high reliability military and aerospace applications.
MANASSAS, VA – ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is excited to announce the next installment of the Advanced Packaging and Power Electronics webinar series, "Corrosion in Power Electronics" is set to take place on September 21, 2023, at 2:00 PM EST.
Power electronics manufacturers worldwide face an escalating challenge – failures induced by corrosion mechanisms, including the notorious electrochemical migration (ECM). As power electronics continue to evolve and play a pivotal role in various industries, it becomes imperative to address the reliability and durability of these essential components. This webinar aims to delve deep into the intricacies of corrosion-induced failures, offering insights and strategies to mitigate these challenges effectively.
The webinar is open to individuals across the electronics industry spectrum, including engineers, researchers, manufacturers, and anyone interested in advancing their knowledge of power electronics reliability. Registrants can engage with the speakers through a dedicated Q&A session at the end of the presentation.
To secure your spot and gain access to this insightful webinar, please register here.
For more information about ZESTRON and its comprehensive range of precision cleaning and surface preparation solutions, please visit www.zestron.com
HALFMOON, NY – PVA, a global supplier of automated dispensing and coating equipment, is excited to announce that Surf-Tech Manufacturing Corp. has made a strategic investment in PVA’s Delta 8 Selective Conformal Coating Machine with 5th Axis Tilt capability. Surf-Tech’s investment underscores its dedication to delivering top-notch quality and expanding its capabilities in selective conformal coating, potting, bead, and meter-mix dispensing applications.
“We are thrilled to incorporate the Delta 8 unit from PVA into our manufacturing capabilities,” stated Stephen Eggart, President of Surf- Tech Manufacturing. “The Delta 8’s remarkable flexibility, precision, and integrated features will empower us to offer even more efficient and reliable manufacturing solutions to our clients. By continuously investing in advanced technology and cutting-edge equipment, we are dedicated to maintaining our status as a trusted partner for our clients, delivering comprehensive and high-quality manufacturing solutions.”
PVA’s Delta 8 Selective Conformal Coating Machine is celebrated for its exceptional versatility and flexibility. Designed to accommodate a diverse array of assembly applications, the Delta 8 is perfectly aligned with Surf- Tech’s multifaceted manufacturing requirements. The machine comes with an array of options and integrated features, boasting a robotic system repeatability of ±25 microns and the capability to accommodate multiple dispensing applications or materials within a single cell, resulting in heightened precision and efficiency.
A standout feature of the Delta 8 unit is its 5th Axis Tilt capability. With this motorized programmable tilt, the machine can be adjusted to angles ranging from -50° to 50°. The added flexibility provided by this feature enables enhanced accessibility to components, ensuring more precise dispense and spray processes. By leveraging the 5th Axis Tilt capability of the Delta 8, Surf-Tech anticipates achieving superior outcomes and upholding the highest quality standards.
Surf-Tech Manufacturing Corp., renowned for its versatile contract manufacturing services across a range of industries, has solidified its position by acquiring the Delta 8 unit from PVA. With this strategic investment, Surf-Tech is poised to address evolving customer needs and deliver exceptional outcomes across a broad spectrum of manufacturing applications.
As a trusted innovator in precision application solutions, PVA is committed to providing cutting-edge technologies that enhance production processes and drive efficiency in various industries.
For more information about PVA, please contact PVA at info@pva.net or 518-371-2684.
NORTH BILLERICA, Mass., September 2023 — BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will highlight its TrueFlat™ reflow oven technology at SEMICON Taiwan in booth #M1039. The expo is scheduled to take place September 6-8, 2023 at TaiNEX 1 & 2 in Taipei.
“Very thin substrates represent a special challenge for thermal processing,” said Joe Yang, product manager at BTU. “Our TrueFlat technology ensures that even substrates as thin as 0.15 mm are kept flat throughout the entire reflow process.”
Part of the industry-leading Pyramax reflow oven platform, TrueFlat technology addresses the critical challenge of substrate warpage. One of the standout features of the TrueFlat is its exceptional thermal uniformity, made possible by integrating the Pyramax’s closed-loop convection heating system. By eliminating die tilt and accommodating substrate thicknesses ranging from 0.15-0.30 mm, TrueFlat technology maximizes process yield.
Easy to maintain with no vacuum pump, the system offers simple operation and full integration with BTU’s proprietary Wincon™ Windows-based software including factory host/MES interface for Industry 4.0 compliance. This innovative configuration enables manufacturers to achieve reliable and optimal results across a range of applications.
Visit BTU International's booth at SEMICON Taiwan 2023. To learn more visit www.btu.com.
About BTU International
BTU International, a wholly-owned subsidiary of Amtech Group (Nasdaq: ASYS), is a global supplier and technology leader of advanced thermal processing equipment in the electronics manufacturing market. BTU’s high-performance reflow ovens are used in the production of SMT printed circuit board assemblies and in semiconductor packaging processes. BTU also specializes in precision controlled, high-temperature belt furnaces for a wide range of custom applications, such as brazing, direct bond copper (DBC), diffusion and sintering. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia, and Europe. Information about BTU International is available at www.btu.com.
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