The global push to reduce a reliance on fossil fuels and promote electrification has created new designs and innovations that create new testing challenges. “EVs contain approximately three times the number of power electronic components as internal combustion vehicles,” said Ramon Hernandez, featured panelist and Head of Sales and Service for Mexico and South America at Koh Young. “EV electronics inspection poses new challenges with respect to the ever-increasing demands of the EV market, the test cases, and the testing procedures.”
The accelerated adoption of EVs has led to an increase in demand for reliable and comprehensive testing solutions for better performance, safety, and overall satisfaction to help EV manufacturers get their cars and trucks faster into the market. As EV systems evolve, a range of standards, systems, and criteria for maintaining reliability in harsh environments are being developed. This panel will discuss the current and future test landscape for EV. Register for the webinar here or at this url: https://us02web.zoom.us/webinar/register/WN_EYBifAZMS1OKwOYfrB46Cw.
If you cannot attend the webinar and LIVE Q&A session, the broadcast will be available within 24-hours at http://bit.ly/2JWRGCo. Plus, you can learn more about Koh Young and its best-in-class inspection solution technologies, including our Smart Factory Solutions by visiting our new regional website at kohyoungamerica.com.
About Koh Young Technology, Inc.
Established 20 years ago in 2002, Koh Young pioneered the market by launching the first 3D Solder Paste Inspection (SPI) system using a patented dual-projection Moiré technology. Since then, it has become the global leader in 3D measurement-based SPI and Automated Optical Inspection (AOI) equipment for the electronics industry. Based on its True3D™ measurement-based inspection technology, Koh Young has developed innovative inspection solutions for challenges with machined parts, press-fit and through-hole pins, conformal coatings, dispensed materials, and semiconductor packages. Through its constant innovation, Koh Young has secured over 3,500 global customers, and maintains the dominant global market share in the SPI and AOI markets with over 20,000 machine installations. By adopting a user-centric R&D focus, it continues to use its core competencies to develop innovative solutions for new and existing markets. Its activities stem from the corporate headquarters in Korea to its global sales and support offices in Europe, Asia, and the Americas. These local offices ensure it stays close to the market, and more importantly, its growing customer base. Learn why so many electronics manufacturers trust Koh Young for reliable inspection for a smart factory at www.kohyoungamerica.com.
PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com
Plymouth, WI — September 2022 — Kurtz Ersa Inc., a leading supplier of electronics production equipment, today announced the schedule for its next VERSAFLOW 3 Maintenance and Application Training Courses. The VERSAFLOW 3 Selective Soldering Level II Maintenance Training Course will be held from Monday, Oct. 10, 2022 at 1 p.m. to Wednesday, Oct. 12, 2022 at 12 p.m. The VERSAFLOW 3 Selective Soldering Level II Application Training Course will take place Wednesday, Oct. 12 22, 2022 at 1 p.m. to Friday, Oct. 14, 2022 at 12 p.m. at its Plymouth office.
The VERSAFLOW 3 series is the world’s most utilized in-line selective soldering machine. The system achieves the highest flexibility and throughput with the smallest possible required space. In order to satisfy all demands in regards to flexibility, the third generation of Ersa´s VERSAFLOW selective soldering systems is based on a modular platform.
The Maintenance Training Course will provide students with the ability to properly maintain the VERSAFLOW 3 and prevent downtime. In addition to an advanced machine overview, the course will provide training for preventative maintenance, troubleshooting, calibration and more.
The Application Course will provide the knowledge and hands-on experience for process application and programming on the VERSAFLOW 3 selective soldering machine. The goal of the course is to give the student the knowledge to properly maintain their process with minimal to zero defects with the highest throughput possible.
Attendees are encouraged to bring or ship any challenging products for Ersa’s application specialist to help fine tune to get the best process time achievable. For more information or to register for the courses, e-mail Chad Suckow at chad.suckow@kurtzersa.com.
For more information about Kurtz Ersa Inc., visit www.ersa.com.
Kurtz Ersa Inc.
1779 Pilgrim Road | Plymouth, WI 53073 | USA | Phone: + 1 920 893 1779 | Fax: + 1 920 893 1562 | e-mail: ernie.grice@kurtzersa.com | Web: www.ersa.com
PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com
BANNOCKBURN, Ill., USA, September 19, 2022 – IPC’s Validation Services program has awarded an IPC-1791, Trusted Electronics Designer Requirements Qualified Manufacturer Listing (QML) to Fralock, located in Valencia, Calif.
Following the initial IPC audit, Fralock passed stringent design requirements to optimize product quality, reliability, and consistency across the entire manufacturing operation, earning a place on IPC’s global network of rigorously vetted and trusted sources.
“Fralock provides product design, development, engineering, prototyping, and manufacturing services to customers that require a high level of quality and precision,” said Shibu Gangadharan, vice president of specialty engineered materials at Fralock. “This validation assures our customers that processes pertaining to IPC-1791 are adhered to throughout the manufacturing cycle.”
IPC's Validation Services QML program was developed to promote supply chain verification. It also provides auditing and qualification of electronics companies' products and identifies processes which conform to IPC standards.
"Different from other audit programs, IPC's Validation Services programs uniquely provide technical and in-depth assessments of products and processes in accordance with IPC standards," said Randy Cherry, IPC director of Validation Services. "We are pleased to recognize Fralock on becoming members of IPC's network of trusted QML suppliers.”
For more information about IPC's Validation Services QPL/QML program, visit www.ipcvalidation.org or contact Randy Cherry at RandyCherry@ipc.org or +1 847-597-2806.
PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com
HOUSTON, Sept. 19, 2022 /PRNewswire/ -- Alert Tech SMT welcomes Don Adam as their new Chief Financial Officer. The full-service electronics manufacturing service (EMS) provider, based in Houston, Texas, specializes in surface mount technology (SMT) for printed circuit board assembly.
Don Adam brings 30+ years' experience to drive reshoring growth for full-service electronics contract manufacturer.
As the newest addition to Alert Tech SMT's leadership team, Adam brings over 30 years of international financial and management experience to the role. Throughout his career, he has worked as a senior manager for KPMG International, a global network of professional audit and tax advisory services; controller for American Homestar Corporation, a manufacturer and retailer of mobile homes; CFO for Specialty Components, Inc., a manufacturer of specialty pipe fittings and flanges; and — most recently — CFO for Benchmark Electronics, a leading global EMS company. Now, he brings a wealth of expertise — from capital allocation to financial planning and analysis — to help Alert Tech SMT provide a streamlined domestic alternative to overseas electronic manufacturing.
"We couldn't be more thrilled about Don joining the team," said Brian Laney, vice president of sales and product. "His expertise and leadership will help us support our customers who are ready to reshore their production with a true partner who puts them first."
The addition to the leadership team couldn't come at a better time. As increasing supply chain and quality production issues plague emerging and established companies alike, many businesses are turning to contract manufacturers that understand the challenges of both reshoring — moving production from overseas to the U.S. — and establishing a relationship where they are more than just a number.
Alert Tech SMT understands the challenges firsthand. The company moved their own PCBA in house and reshored their manufacturing process — now, they provide the customized, customer-driven service they were looking for when they made the move. "We offer something different in terms of personalized attention and service," said Laney. "Our customers know they are our priority, and we are routinely shocking people with the value we bring."
This commitment to a customer-first approach combined with high quality processes is, in part, what drew Adam to the role. "Customer service drives the work Alert Tech SMT does," he said. "But that's not all. This is an extremely talented team, backed by strong fundamentals, systems and world-class equipment." With Adam joining the ranks, Alert Tech SMT continues to expand an impressive roster of experienced contract manufacturing and EMS professionals. As CFO, he will work closely with in-house engineers, tech industry experts and skilled manufacturers.
Looking ahead, Adam has a vision for growth that puts the customer front and center. "I am confident that as we grow, we will continue to serve as a trusted and truly valuable partner for our customers," he said. Â
Alert Tech SMT is located in Houston, Texas, just minutes from NASA Johnson Space Center and nearby the Texas Medical Center. To learn more about Alert Tech SMT's experience with domestic electronics manufacturing, customer service-driven approach and quality commitment, visit https://alerttechsmt.com/.
About ALERT TECH SMT
Alert Tech is a one-stop shop for printed circuit board assembly (PCBA) and surface mount technology (SMT) electronics manufacturing in Houston, Texas. As a full-service electronics manufacturing service (EMS) provider with a team of in-house engineers, they specialize in prototyping, low- to mid-volume production, sourcing and reshoring. For more information, visit https://alerttechsmt.com/.
PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com
EDEN PRAIRIE, MN – September 2022 – The Women’s Leadership Program (WLP), an SMTA-sponsored organization that strives to promote diversity and inclusion in engineering and manufacturing fields, announces that it will host invited presentations about technology innovations and career advancements on Tuesday, November 1, 2022. The free event will take place from 1-6 p.m. with an agenda designed to promote women in engineering fields. Everyone is welcome to attend.
The first event, co-chaired by Tanya Martin of the SMTA and Jessica Molloy of ZESTRON, will take place from 1-3:15 p.m. Three invited presentations focusing on technology innovations and career advancement will provide a valuable resource to attendees. Carolyn Duran, Ph.D. of Intel Corporation, will discuss the importance of lifelong learning, Loretta Renard of REMAP will focus on changing the perception of manufacturing, and Jayshree Seth, Ph.D. of 3M, will share information about leaders and ladders.
There will be a brief 15-minute refreshment break following the presentations.
Co-chaired by Debbie Carboni of KYZEN and Julie Silk of Keysight Technologies, the second event will take place from 3:30-4:30 p.m. During this quick-moving, interesting event, attendees will rotate through six tables hosted by the invited speakers as well as SMTA leaders on topics related to leadership skills, continuous learning, career development, innovation and more.
The day will end with a social that is co-chaired by Michelle Ogihara of Seika Machinery Inc. and Sherry Stepp of KYZEN from 4:30-6 p.m.
To find out more about the Women’s Leadership Program, visit www.smta.org/page/wlp.
PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com
As an industry leader in innovative materials solutions for heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications, Indium Corporation® will feature innovative material solutions designed to meet the evolving challenges of SiP and HIA at the 55th International Symposium on Microelectronics (IMAPS) from Oct. 3-6 in Boston, Mass., U.S.
Indium Corporation’s proven SiPaste® series is specifically designed for fine-feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void®, reduce slumping, and demonstrate consistent superior printing performance. Water-soluble SiPaste® 3.2HF has been adopted by leading OSATs and has been used in more than 5 billion mobile FEM SiP modules. The newly released SiPaste® C201HF offers the same superior printing performance with the benefit of having a cleanable chemistry with semi-aqueous-based solutions.
As the industry leader in no-clean semiconductor flux, Indium Corporation will also feature the first low-residue no-clean, ball-attach flux on the market, NC-809. NC-809 is a dual-purpose flux, engineered with high-tack characteristics for flip-chip applications and with adequate wetting power for ball-attach applications. This material is designed to hold die or solder spheres in place without risk of die shift or solder sphere movement during the assembly process. NC-809 is designed to leave minimal residue after reflow, at the level of Indium Corporation’s proven ultra-low residue (ULR) flip-chip fluxes such as NC-26S and NC-699. NC-809 exhibits superior wetting performance and is the first ULR flux qualified for ball grid array ball-attach applications for packages that are sensitive to traditional water cleaning processes. NC-809 also improves production yields by eliminating costly cleaning steps which can increase substrate warpage both after reflow and before the underfilling steps, creating the potential for die damage and cracked solder joints.
NC-809 offers:
• High tackiness to eliminate die tilting or shifting during reflow; greatly reducing electrical open failures
• Consistent flux deposition and excellent wetting
• Ultra-low residue; ideal for customers building tight-pitch flip-chip assemblies
• Compatibility with a wide variety of underfills
• Reduced warpage of package and lower thermal stress due to absence of cleaning step
About Indium Corporation
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
About IMAPS
The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through premier professional events, an exclusive microelectronics packaging research library, local chapter networks, and other efforts. Founded in 1967 as ISHM, then merging with the International Electronic and Packaging Society (IEPS) in 1996, the Society has over 50 years of networking, education, and publication history.
PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com