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NORTH BILLERICA, MA — BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, today announced the appointment of Assembly Resource as its new exclusive distributor for reflow soldering systems in Northern California and Northern Nevada.

Leigh Jackson and the team at Assembly Resource will provide sales, technical and after sales support for BTU’s high-performance reflow ovens and custom furnaces. Since 1950, BTU has been the partner of choice for manufacturers facing the most complex thermal processing challenges.

“BTU’s reflow ovens are widely recognized as the best performing ovens available in the market today,” said Leigh Jackson of Assembly Resource. “We are excited to take BTU’s products into new applications and projects in our territory.”

As one of the established manufacturers’ representatives in the vital Northern California, Northern Nevada and Silicon Valley territories, Assembly Resource is focused on providing superior sales representation and support for its customers and principals. As technology and equipment for Micro-Electronics, Semiconductor Packaging and SMT Assembly become more closely aligned, Assembly Resource’s product offerings and expertise take advantage of this newly developing synergy to provide timely solutions and valuable knowledge.

“We look forward to partnering with Assembly Resources in Northern Cal and Nevada,” said Chris Heesch, Regional Sales Manager at BTU. “Leigh and his team take excellent care of their customers, and have excellent process knowledge to foster success in this important high-tech region.”

With more than 20 years’ experience in PCB Surface Mount Technology (SMT), through-hole, Micro-Electronics and Semiconductor Assembly, Mr. Jackson has a significant background of sales success, detailed product demonstrations and assembly process consulting. He has worked directly for many leaders in the electronics industry and as a manufacturers’ representative providing direct sales, product demonstration, process and marketing consulting.

Fore more information about Assembly Resource, email Leigh@AssemblyResource.com or visit www.assemblyresource.com.

To learn more, visit www.btu.com.

FREMONT, CA ―  Anda Technologies, a leading provider of fluid application and custom automated manufacturing equipment, today announced plans to exhibit at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. The company will highlight its total selective coating and fluid dispensing line solutions along with the AP-3 Series inline surface plasma treatment machine in Booth #1533. Additionally, the IPC APEX EXPO will be the first show appearance for their TVS-400 tabletop precision dispensing machine.

Anda’s TSV Series are versatile, compact, high-speed precision tabletop dispensing machines designed for selective coating and fluid dispensing applications. Due to their compact size, these dispensing machines are easily portable making them ideal for low volume processes or laboratory tabletop applications.

The TSV Series is an automated, XYZ (3-axes) gantry system driven by ball screw and servo motors. This dispensing machine series is available in two different models with varying platform work areas and X-Y travel dimensions. The TSV-300 model is 300 x 300 mm and the TSV-400 model is 400 x 400 mm.

Anda manufactures and supplies total coating and fluid dispensing line solutions for RTV, heat curable, and UV curable material processes. Anda also manufactures a wide variety of conveyors and provides solutions for every level of automation for coating and fluid dispensing processes. Their One-Man Operation (OMO) total line solutions offer many advantages over traditional process lines. Product flow input and output can occur at the same location within the line, allowing conventional manual flip for coating or dispensing on both sides of a PCB assembly.

HANAU, GERMANY — Heraeus Electronics will exhibit at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. The company will showcase three innovative products designed to meet current and future SMT challenges. New solutions are needed to meet the increasing demands for miniaturization, reliability and TCO challenges.

Heraeus has answered the industry’s need, and will introduce the next evolution of Solder Paste to address these challenges in Booth #2419 during the IPC APEX EXPO.

The all-new paste system is a high reliability, high performance paste system with a competitive TCO offering. Based on proven experience of Heraeus Electronics, the new paste system allows a wide process window, enabling soldering in air with low defects. Additionally, it is designed to offer an optimized formulation for lower material costs. Moreover, the company will discuss its proven Innolot Solder Paste and mAgic® DA320 Sinter Paste.

Heraeus’ SMT 650 Innolot solder paste achieves a consistently high surface insulation resistance that prevents electrochemical migration. The combination of the flux system with Innolot alloy delivers superior reliability— especially in miniaturized systems in the automotive industry. In addition, the developed flux system can also be combined with SAC305.

mAgic® DA320 is a high shear strength, non-pressure dispensing sinter paste for die attach of power applications. With high thermal conductivity, it offers fast sintering at low application temperatures from 200°C and above to form quality interconnections.

For more information about the company’s innovative materials portfolio, visit Heraeus experts in Booth #2419 during the IPC APEX EXPO.

To learn more about Heraeus Electronics, visit www.heraeus-electronics.com

NASHVILLE – Magnalytix, providing real-time reliability solutions for electronics manufacturing, will exhibit at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. The company will display its new Magnalytix® OE-300 SIR Testing System in Booth #1318.

Assembly operations invest substantial time and talent in developing and documenting their Qualified Manufacturing Plan in compliance with IPC-J- STD-001H by employing high humidity and temperature while biased testing. The Magnalytix OE-300 with Process Control builds on that QMP development by employing the same, approved, objective evidence testing techniques adapted to meet production area operation’s safety, tempo and economic considerations with results in as little as two hours.

The Magnalytix OE-300 is the first of its kind test system that enables assembly operations to quickly generate true objective evidence data during daily operations for effective process control. The electrical test method exposes the test board to elevated temperature and humidity, which mobilize undesirable process residues.

The Magnalytix OE-300 then detects the impact any mobilized metal ions have in the form of measurable leakage currents or fully formed dendrites, which can be the cause of intermittent or total device failure. That is the science inside the Magnalytix OE-300, but all you need is the native analytics to prove that your process is in control.

To learn more about Magnalytix’s real-time reliability solutions, visit www.magnalytix.com

MINNEAPOLIS, MN — Nordson Corporation (Nasdaq: NDSN) today announced that it has been selected for a 2022 SMT China Vision Award in the category of Test & Inspection – AOI for its CyberOptics SQ3000™+ Multi-Function system. The highest-level award was garnered based on the level of product innovation.

The all-in-one SQ3000+ was introduced at the beginning of 2022, and since then has received a 2022 NPI Award, 2022 Global Technology Award, 2022 EM Innovation Award, and now its fourth award – the 2022 SMT China Vision Award. It is the 33rd award for Multi-Reflection Suppression® (MRS®) sensor technology.

The innovative SQ3000+ offers a combination of unmatched high accuracy and high speed, with an even higher resolution MRS sensor that inhibits reflection- based distortions caused by shiny components and specular surfaces. The system is specifically designed for high-end applications including advanced packaging, mini-LED, advanced SMT, 008004/0201 SPI, socket metrology and other challenging CMM applications.

“We are excited that our latest MRS sensor technology-enabled system has been deemed best-in-class for innovation,” said Perry Duffill, Vice President of Test and Inspection, Nordson Corporation. “Designed specifically for next-generation applications, customers can rely on the superior performance of the advanced SQ3000+ to improve their yields and processes.”

SMT China magazine launched the SMT China Vision Awards in 2007 to recognize both international and domestic providers of SMT equipment, materials, software and services that have made outstanding contributions to the rapid growth of China's electronics manufacturing industry by their inventions and innovations.

For more information, visit www.cyberoptics.com

MEDINA, MN ― ASC International, a leading manufacturer of 3D solder paste inspection (SPI) and automated optical inspection (AOI) systems, will exhibit in Booth #827 at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. ASC International will offer live demonstrations of its industry-leading SPI and AOI solutions.

On display will be the VisionPro M500 offering an affordable option for true 3D bench top SPI. The VisionPro Merlin sets the standard as the price to performance leader for offline 2D-3D AOI and the VisionPro DMI combines both 3D SPI and 2D-3D AOI into a single platform for the most cost-effective inspection station island solution in the market today.

Also on display, the LineMaster Fusion 3D provides sophisticated 3D solder paste measurement coupled with an intuitive user interface and Windows® 10 OS. With only a few minutes of training, an operator can perform accurate and reliable 3D measurements of solder paste deposits as well as many other important SMT measurement applications. LineMaster's completely automatic solder paste measurement process eliminates manual board handling as found with offline SPI systems and provides operators with immediate feedback to reduce printer related defects.

For more information about ASC International’s LineMaster Fusion 3D and other AOI/SPI products, visit https://www.ascinternational.com/products/solder-paste- inspection/linemaster-fusion-3d/

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