Press Releases
NEW DELHI, INDIA – Electronic Industries Association of India (ELCINA) at its 55th annual general meeting held on September 29, 2023 elected Atul Lall as the president for the year 2023-24.
Atul B Lall, a professional as well as an entrepreneur for 25 years in the EMS industry. Lall has been associated with Dixon Technologies since inception and is responsible for overall business operations. Additionally, he holds a master degree in management studies from the Birla Institute of Technology and Sciences, Pilani.
Lall has served as a member of the Technical Evaluation Committee for Electronic Manufacturing Services under M-SIPS (Electronic Manufacturing Services- EMS) constituted by the MeitY and served as a representative of ELCINA on the Committee for Reliability of Electronic and Electrical Components and Equipment (LITD. 02) of the BIS. He has also authored the book, ‘Gita and India Inc.’
He brings his experience and in-depth knowledge about the electronics manufacturing sector and its supply chain which will immensely help the industry and enable ELCINA to contribute to the ESDM ecosystem.
Furthermore, the other eminent ELCINA office bearers elected for the year 2023-24 include Sasikumar Gendham, MD, Salcomp Manufacturing India as senior vice president; Richard Puthota, director, MacDermid Alpha Electronics Solutions as vice president; Rajiv Venkatraman, MD, PEC Manufacturing as secretary; Varun Manwani, director, Sahasra Group and CEO, Sahasra Semiconductors as treasurer.
CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the appointment of Henry Colina as Technical Sales Engineer.
Based in Cavite, Manila, in the Philippines, Henry will play a pivotal role in expanding AIM Solder's presence and offering unparalleled support to customers in the region.
With an impressive background in the electronics industry spanning over two decades and armed with a degree in Electronics and Communication Engineering, Henry Colina is set to become a valuable asset to the AIM Solder team. His wealth of experience and technical expertise positions him perfectly to address the unique needs of our customers in the Philippines.
"We are excited to welcome Henry Colina to our team," said TS Lim, Technical Sales Manager. "His extensive industry knowledge and commitment to excellence align perfectly with AIM Solder's values. We are confident that Henry will excel in his role and contribute significantly to our continued growth in the Philippines."
Henry Colina's appointment reflects AIM Solder's dedication to delivering top-tier products, superior customer service, and a commitment to innovation within the electronics industry.
Henry can be reached at hcolina@aimsolder.com
SCHAUMBURG, IL – Effective today, Landon Robertson has been appointed Technical Sales Engineer for the Eastern Region for Bowman XRF. The region, which spans 14 states, is regarded as one of the company's highest-potential growth areas, with customers in every major city, and throughout Bowman's dominant markets: general metal finishing and printed circuit board manufacturing.
Robertson was most recently a Director of Business Development, with total sales cycle responsibility. He holds a BS in Chemical Engineering and an MBA, diverse degrees that provide valuable skill sets for working with advanced XRF measurement technology. Robertson has established an office in Nashville, the region's dominant metro area. Advanced manufacturing in the Nashville region has an annual economic impact of $69.7 billion.
MANASSAS, VA – ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is excited to announce that Dr. Denis Barbini, Technical Solutions Manager at ZESTRON, will present "Utilizing SIR and Analytical Tools to Determine Impact to Reliability for Process Improvements" at the upcoming SMTA International Conference and Exhibition.
The presentation will delve into the challenges the electronics manufacturing industry faces when implementing new processes, machinery, or materials under Reision H of IPC-J-Std-001. Dr. Barbini, an industry expert with years of experience in the field, will explore how implementing advanced methodologies, such as Surface Insulation Resistance (SIR) testing and other analytical tools, can provide valuable insights into the reliability impact of process enhancements. Attendees will gain understandings into strategies for evaluating the efficacy of cleaning solutions, materials, and processes, ultimately ensuring that product reliability is not compromised.
For more information about ZESTRON's participation in SMTA International or to learn about their advanced cleaning solutions, visit ZESTRON at booth #1401 during the exhibition.
CHATSWORTH, CA – NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is pleased to announce the appointment of Rupinderjit (Rubi) Catuna as Chief Financial Officer.
Ms. Catuna joined the Company in 2006 and has served in various roles within Accounting and Finance, most recently as a VP of Finance and Corporate Controller. During her tenure at NEOTech, she has been an instrumental part of the Company’s growth where she took critical roles in the M&A activities of Epic, OnCore, and Stellar acquisitions. Additionally, she brings the experience in capital restructuring, systems integration, and divestitures. Committed to NEOTech’s culture of continuous improvements, Ms. Catuna spearheaded the consolidation and integration of accounting functions for all acquired entities.
She is a key member of the executive team and has managed Global Finance and Accounting for NEOTech since 2019. In the new role, she will be responsible for the Company’s corporate and financial strategies and its financial operations and processes.
Ms. Catuna is a Certified Public Accountant in the State of California and holds a bachelor’s degree in accounting from California State University, Northridge.
“Rubi has been instrumental in our success and exemplifies our culture of integrity and accountability. We are very proud of all of Ms. Catuna’s contributions and look forward to her continued success,” commented Kunal Sharma, President and Chief Operating Officer.
With more than 40 years of heritage in electronics manufacturing, NEOTech specializes in high- reliability programs in the Aerospace and Defense industry, Medical Products, and High-Tech Industrial markets. NEOTech is well recognized as a premier EMS provider with in-depth experience manufacturing high-tech products and managing stringent US government requirements. For more information about NEOTech services, visit the company’s website at www.NEOTech.com
HEERBRUGG, SWITZERLAND – As an EMS provider catering to major OEMs, ESCATEC believes in the importance of continually upgrading its technological capabilities to keep delivering high quality products and to accommodate customer requests for more advanced services. Within the Group, ESCATEC Switzerland (ECH) plays the role of an innovation hub and testbed, where new technology and processes are evaluated and, if found beneficial, will be rolled-out to ESCATEC’s other production sites.
A recent example illustrates this ‘technology roll-out’ process, with ECH taking the lead for the wider Group. Based in Heerbrugg, Switzerland, ECH integrated a Mycronic MY700 jet printer to its Surface Mount Technology (SMT) line in early August 2023 and the results have been right on target. The advanced, cutting-edge jet printer offers many advantages over the stencil printing method usually employed for soldering in SMT production and has enabled ECH to improve the flexibility, efficiency, and quality, of its SMT output.
The SMT process is a foundational activity towards assembling most electronic products with a key part of it being soldering via stencil printing of various electronic components onto printed circuit boards (PCBs). Stencil printing involves using a stencil that is essentially a thin sheet with openings (apertures) corresponding to the locations where solder paste needs to be deposited on the PCB. The solder paste itself is typically a low-melting-point metal alloy that creates electrical and mechanical connections, enabling the components to be reliably ‘joined’ to the PCB. SMT’s significance in electronics production lies in its ability to enable miniaturisation, reduce production costs, enhance quality and reliability, and adaptability to various PCB designs and component types.
ECH’s new jet printer provides significant innovation over the stencil printing method, notes Production & Engineering Manager Dr Martin Mundlein. “It is a unique equipment allowing a very high level of flexibility for solder paste application, enabling up to 700,000 solder paste dots per hour and dispensing down to 200um size. By using it in combination with a stencil printer, it has given ECH full process flexibility when it comes to SMT,” he explained.
The jet printer is currently installed directly in ECH’s SMT line after a stencil printer and before a 3D solder paste inspection station. It has allowed ECH to reduce cost and lead times for prototype builds and low volume production by eliminating the need for stencils (which are expensive), while greatly expanding flexibility in the type and complexity of PCBs that can be run.
Increased Flexibility, Cost Reduction, and Improved Quality
ECH’s new jet printer can apply solder paste to a far wider range of components, including those with complex geometries or that are in difficult-to-reach areas. This makes it ideal for NPI and low-volume production, as well as for high-volume production applications that require a high degree of flexibility.
The jet printer has reduced costs in several ways for ECH. Firstly, by eliminating the need for expensive stencils which have a long lead time when ordering and to set up. Secondly, there is an improvement in yield by reducing the risk of solder paste misprints and process failure, thirdly by allowing for precise control of the solder paste volume applied to each component, and fourthly by reducing the number of scrap or rejects.
ECH has also gained from higher standards of quality in relation to its SMT output because the jet printer improves the consistency of the solder paste deposits while reducing the risk of solder bridging and other defects. There is also an improvement in the overall appearance of the finished products.
Dr Mundlein believes the new jet printer is a valuable addition to ECH's manufacturing capabilities and, once it has been thoroughly evaluated and fine-tuned in ECH and with experience in hand, the technology is likely to be rolled out to ESCATEC’s network of production sites in Europe and Malaysia. Most importantly, ECH’s customers will benefit from the cost savings, shorter lead times, and higher quality, gained from the new jet printer.
