DERRY, NH – StenTech® Inc., the leading multinational SMT Printing Solutions company, today announced the expansion of its operations with a new facility at 1050 Perimeter Rd. in Manchester. The move comes as a result of the company’s remarkable organic growth, necessitating additional space to meet the increasing demands of its valued customers.

With the current combined tooling and stencil operation in Derry reaching its capacity, StenTech has decided to relocate the stencil operation to the new state-of-the-art facility in Manchester. This strategic move creates room for the addition of more advanced tooling machines in Derry, optimizing production capabilities. Additionally, the new facility will offer ample space for the stencil department to grow and thrive independently, further enhancing StenTech’s service offerings.

“Our remarkable organic growth in Derry has presented us with exciting opportunities to better serve our customers,” said Greg Starrett, Director of Sales at StenTech. “By streamlining our operations and providing specialized space for our stencil department, we can continue delivering the best service and solutions to our valued clients.”

The move to the new facility represents a significant milestone for StenTech, signifying its commitment to continuously improving its operations and strengthening its position as the industry leader. With enhanced capabilities and increased capacity, the company is poised to meet the evolving needs of its customers with unparalleled efficiency and precision. StenTech remains dedicated to providing top-notch tooling and stencil solutions, tailored to meet the unique requirements of its diverse customer base. The new facility’s strategic location ensures seamless access to essential resources and a more convenient experience for clients seeking StenTech’s renowned services.

To learn more, visit www.StenTech.com 

August 1, 2023 – Launched at the beginning of the year, ECD’s M.O.L.E.™ EV6 thermal profiler has far exceeded initial sales projections, the company announced today. A complete paradigm shift from conventional thermal profiling, M.O.L.E. EV6 delivers handheld access to profiles, calculation templates, pass/fail analysis, and more – on the production floor. No PC download is required to effectively view, analyze, and optimize a thermal profile. According to many ECD partners and early adopters, this technology is long overdue.

Debuted in January with shipments beginning April 2023, the M.O.L.E. EV6 saw record order demand compared to ECD’s previous thermal profiler launch. M.O.L.E. EV6 sales were more than double those of its predecessor during a similar six-month period. According to ECD Electronics Division Manager, Mark Waterman, this validates the team’s innovative vision of what electronics assembly operators and process engineers need to perform their job most effectively.

“Now more than ever, production efficiency is vital to remain competitive in the electronics manufacturing market,” says Waterman. “Touchscreen control and on-the-fly data access for immediate corrective actions enables operators to simplify and streamline the profiling process. Productivity is raised, errors reduced, and decision-making is informed and immediate.”

While ECD is delighted with the early success of M.O.L.E. EV6’s adoption, Waterman notes that there is plenty more to come: “We anticipate this order trajectory to continue – and even accelerate – as this is truly the most significant thermal profiling product innovation in the last decade,” he says. “The new M.O.L.E. technology platform, along with user input, will influence the development of several other ECD profiling tools we anticipate bringing to market soon. Stay tuned!”

To learn more about M.O.L.E. EV6, its scalable capability with RIDER™ machine quality management tools, or any of ECD’s process control technologies, visit www.ecd.com.

Except as otherwise noted, all marks used herewith are trademarks and/or registered trademarks of ECD and/or its affiliates in the US and elsewhere.

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TechSearch International’s latest analysis examines demand for packages used in AI. As the industry enters the AI era, successful hardware deployment requires a supply of silicon interposers, or alternatives such as redistribution layer (RDL) structures and advanced laminates, to support high density. With the desire to add more and more high bandwidth memory (HBM) stacks, the size of the interposers is growing, driving demand for larger build-up package substrates. TechSearch International analyzes industry readiness with silicon interposers (and alternatives), large body-size packages, and HBM.

Reliability issues for large body size packages are highlighted. Demand projections are provided for interposers and HBM. Supply and demand for build-up substrates is examined, given the need for large substrates. The report also examines the status of glass for substrates and provides an update on the technology. The report points out challenges to be addressed.

While wafer-to-wafer (W2W) hybrid bonding has been in production for image sensors for many years, and is seeing growing use in the production of NAND Flash, die-to-wafer (D2W) adoption is in the early stages. The report analyzes the adoption for memory on logic, logic on logic, and the future for HBM. Research activities and challenges are discussed.

RF package trends are highlighted with an in-depth examination in the mobile space. Alternatives to laminate substrates are discussed. The report examines OSAT financials, discussing prospects for the year.

The latest Advanced Packaging Update is a 110-page report with full references and an accompanying set of ~100 PowerPoint slides.

DERRY, NH – StenTech® Inc., the leading multinational SMT Printing Solutions company, is excited to announce its participation in the SMTA Michigan and SMTA Ohio Expos. The company will exhibit its highly acclaimed Advanced Nano Coating and showcase its complete product line of various stencils and tooling. The expos are scheduled for Tuesday, Aug. 15, 2023, at Laurel Manor in Livonia, MI, and Thursday, Aug. 17th, 2023 at the Embassy Suites by Hilton Cleveland- Rockside in Independence, Ohio.

As electronic packaging continues to miniaturize, the challenge of achieving precise solder paste deposition and meeting evolving IPC requirements remains ever-present. StenTech’s award-winning Advanced Nano Coating provides a groundbreaking solution to this challenge. Applied to the bottom side and inside the apertures of the stencil, this highly unique 1-3 micron hardened nano coating offers anti-adhesion properties, repelling solder flux and ensuring increased transfer of paste.

With Advanced Nano, transfer efficiency can be boosted by up to 25 percent, significantly reducing bridging and paste-related defects. The “non-stick” characteristics of the coating also lead to reduced underside cleaning, resulting in improved yields and reduced expenses on rework and touchup. Stencils coated with Advanced Nano are ready for use in just 30 minutes after coating, enhancing production efficiency and minimizing downtime.

With a history of pioneering stencil technology and introducing Fiber Diode lasers into North America, StenTech has established itself as an industry leader. The company's team of over 30 experienced CAD designers provides unparalleled support in stencil modifications, material recommendations, and thickness specifications, ensuring optimized stencil solutions for every application.

Visitors to the StenTech booth at the expos will have the opportunity to explore the full range of stencil technology offerings, custom-tailored to meet specific manufacturing needs in the SMT industry.

To learn more, visit www.StenTech.com