CLINTON, NY — Indium Corporation’s Global Head of e-Mobility and Infrastructure, Brian O’Leary, will co-chair a special panel discussion on e-Mobility on Thursday, January 26 from 10 a.m.–1 p.m. local time at IPC APEX Expo in San Diego, Calif., US.

Climate change, government policy, and consumers are rapidly driving the automotive industry towards an electrified future. The printed circuit board assembly (PCBA) manufacturing industry has a vital role to play in this transition. From longer mission profiles to higher voltages, PCBAs are required to work longer, harder, and at higher operating temperatures.

The special session, one of the first of its kind, will bring together key stakeholders from across the e-Mobility industry, including original equipment manufacturers (OEMs), their supply chain regulators, policy, and technology experts. It will consist of two parts, the first of which will address problems and challenges facing the industry. The second part will address solutions to those problems. Audience participation is highly encouraged.

Registration for the special session is included in the All Access or Full Technical Conference packages or can also be added as a Technical Conference Single Session Pass.

O'Leary is responsible for promoting Indium Corporation's full range of products and services for e- Mobility, which includes electric cars, trucks, eVTOLs, charging stations, etc. He joined Indium Corporation in 2014 and has more than 20 years of experience in the electronics industry. He authored two books on thermal profiling called Profiling Guide for Profitability and Profiling Guide for Six Sigma. He currently serves as the chair of the IPC e-Mobility Quality & Reliability Advisory Council. In addition to regular technical conference participation, he co-hosts a free monthly webcast—EV InSIDER Live—with Loren McDonald of EVAdoption and a high-profile industry stakeholder as a guest. In the webcast, they discuss current pressing issues and hot topics in the rapidly evolving electric vehicle landscape.

CAMBRIDGE, UK — A new wave of electronics manufacturing is on the horizon, driven forward by volatile energy prices and increasing demand for sustainability. With the electronics industry accounting for 4% of global greenhouse gas emissions, it requires substantial innovation to reduce its environmental footprint. Fortunately, this area has a lot of movement, with several potentially revolutionary technologies entering the scene. IDTechEx's "Sustainable Electronics Manufacturing 2023-2033" report explores the key opportunities for sustainable innovation and the most promising new manufacturing approaches. The report concentrates on the fundamental building blocks of electronics - printed circuit boards (PCBs) and integrated circuits (ICs).

Incentives for Sustainable Electronics

Sustainability within the semiconductor and electronics industries is being driven forward by government mandates and green investment initiatives. Increasingly relevant to the survival of traditional manufacturers is the conscious choice of the public to only purchase from, and even only work for, companies that prioritize sustainable practices.

Environmentalism is often perceived as an obstacle-laden with legislative red tape and burdensome disclosures. However, companies that embrace environmentalism reap long-term rewards, and as such, the negative perception is replaced by one of opportunity. The implementation of low-emission manufacturing processes or the adoption of material recycling and recovery schemes can be the financially astute choice presenting an opportunity to reduce costs associated with energy consumption, waste treatment, and superfluous steps. Prioritizing environmentalism keeps the industry ahead of the curve as legislation becomes stricter while positioning individual companies to benefit from designated ESG investment.

As energy prices rise globally, low temperature and rapid processing methods become more attractive. Some of these methods employ additive approaches that substantially cut waste by printing material only where needed. This spares manufacturers the costs and emissions associated with excess materials and etching required in traditional subtractive manufacturing. For example, switching to additive methods of PCB manufacturing can lower water consumption by up to 95% - an outcome that could save the sector hundreds of millions of liters of water annually.

IDTechEx's analysis expects additive manufacturing to be particularly significant to the scaling of flexible printed circuit boards. Flexible PCBs are an important part of the emerging electronics industry as they enable a wider variety of applications than conventional rigid electronics. Flexible PCBs inherently require an overhaul of traditional processing - for example, using plastic or paper rather than conventional FR substrates. Embracing a new technology enables scope for further changes, such as transitioning to new materials and additive methods. Low-temperature processing may also be imperative for PCBs made on plastics such as polyethylene terephthalate (PET), considering that these have relatively low heat tolerances.

Digitization for Smart Manufacturing

Sustainable electronics manufacturing presents many opportunities to be more efficient, reduce waste, and improve cost-effectiveness. Sustainable manufacturing can be facilitated through artificial intelligence and Internet of Things. Using smart digital manufacturing methods to automate processes and sensor technology to detect leaks and improper material usage can help companies minimize waste and cut down on excess costs.

Digital data analysis can help remove superfluous steps and illustrate where to focus efforts to eliminate excess material and energy consumption. Digitization is becoming increasingly popular, with many household name brands adopting similar measures. At the end of 2021, Apple announced it had joined Sustainable Semiconductor Technologies and Systems (SSTS) - a program created by the Belgian research institute, imec, to reduce the environmental impact of semiconductor manufacturing. Imec's SSTS program aims to improve sustainability by employing digital solutions that can assist in modeling less wasteful manufacturing methods. In addition to Apple, imec is also working with Microsoft and Amazon.

Outlook

Reducing the carbon footprint of the electronics industry is a daunting task, particularly for well-established manufacturers that are reluctant to divert from traditional methods. Across the world, government and consumer pressure are forcing manufacturers to take on greater responsibility in reducing their emissions. IDTechEx believes that by embracing sustainable manufacturing methods, companies can benefit financially and demonstrate significant reductions in environmental impact. A comprehensive analysis and exploration of sustainable innovations within the field can be found in IDTechEx's report, "Sustainable Electronics Manufacturing 2023-2033".

This report analyses the many innovations aiming to make electronics manufacturing more sustainable and how they are being deployed. It examines the current status and latest trends in technology performance, supply chain, and manufacturing. It also identifies the key challenges, competition, and innovation opportunities within sustainable electronics manufacturing. IDTechEx has 20 years of expertise covering emerging technologies, including printed and flexible electronics. Our analysts have closely followed the latest developments in relevant markets, interviewed key players across the supply chain, attended conferences, and delivered consulting projects on the field.

To find out more about the IDTechEx report "Sustainable Electronics Manufacturing 2023-2033", please visit www.IDTechEx.com/SustainableElectronics.

MILWAUKIE, OR — ECD today announced that it has hired Michael Pliska as its new Director of Engineering, supporting all product lines and market sectors. Pliska, who brings impressive credentials to the role, will leverage his extensive experience in mechanical engineering, software engineering and business management to implement systems that streamline development, capitalize on digital capability, and continue to offer ECD customers user-friendly process control technologies. The company is modernizing its entire thermal profiling, dry storage, and machine quality management product line-up. Pliska will oversee all engineering aspects -- from major ground-up NPI to more efficient revisions that improve manufacturability and reliability.

Before ECD, Pliska held several engineering management roles with companies in the automotive and bio-science markets. His previous responsibilities, as well as his physics research and coursework, focused on instrumentation innovation, making him the perfect candidate to head ECD’s Engineering department. Pliska looks forward to significantly contributing to the company’s ambitious new product development initiatives and leading the effort to centralize and formalize all engineering documentation.

“The Director of Engineering role at ECD was precisely the type of position I was hoping to find,” shares Pliska. “I’ve become accustomed to working at companies that lead in their respective product classes, and I’m thrilled to have landed at another organization where this is the case. Having worked at large and small firms managing engineering teams of all sizes, I hope to leverage my experience with the Taguchi method of quality engineering and integrate that into the uniquely agile and responsive approach found with smaller, more nimble businesses. Being able to oversee both the engineering management side and the technical elements of embedded controls and rugged electronics is the ideal role for me. I have found that at ECD.”

ECD President, Tara Fischer, is confident Pliska is the right person to execute ECD’s product growth initiatives. “We are set to launch a revolutionary new thermal profiling product in January 2023 and plan to keep our foot on the gas,” says Fischer. “Michael will be instrumental in helping us bring robust, innovative technology to market in an expedited fashion. His skill set is exactly what we were seeking, and we know his expertise will enable excellent results for ECD and our customers.”

Pliska holds a BS in Mechanical Engineering, an MS in Physics, and an MBA from Portland State University. He is based in ECD’s Milwaukie, Oregon headquarters.

REDDITCH, UK — Altus Group, a leading distributor of capital equipment for electronics assembly in the UK and Ireland, will once again exhibit the most innovative machines available in the marketplace at the Southern Manufacturing and Electronics 2023, taking place from 7 – 9th February 2023, at Farnborough International Exhibition Centre.

Highlights will include demonstrations of best-in-class equipment from leading suppliers in the industry. The team of experts from Altus will present emerging technology within the electronics sector and the processes that will help to improve production.

Joe Booth, Altus CEO said: “Southern Manufacturing and Electronics is an important date in our exhibition diary as it brings the electronics community together in one space. This gives Altus the ideal platform in which to introduce some of the world’s most innovative capital equipment.

“Following a year full of new partnerships and additions in 2022, we are looking forward to introducing visitors to the very best products including inspection systems, production equipment, component management solutions and consumables.

“We have also welcomed several new staff including Jiri Kucera, Altus’ new Operations Director. He is looking forward to meeting our current customers, and prospective clients at the show, and, together with our team of experts, will demonstrate the capabilities of the varied products in our portfolio.”

Highlights on the Altus stand will include equipment from Koh Young, including the Zenith Alpha HS+ 3D AOI inspection platform. Combining the best hardware and 3D algorithm technologies, and teamed with artificial intelligence, it delivers the first class accuracy for any inspection application.

Essemtec Fox smart sized modular pick-and-place machine will also be displayed which is dedicated to high-mix production. Another highlight will be Asscon Vapour Phase system. As the demand to produce complex PCBA technology grows, this market-leading flexible system includes adjustable temperature gradients to assure each product has the optimal, reproducible temperature profile.

With traceability and process control of the upmost importance in electronics production, Altus will also demonstrate Promation USA Robotic Soldering platform. Visitors can see first-hand how these systems can support their high-tech, high value production requirements. Building on the foundation of proven robotic soldering performance and know-how, and with the addition of an impressive suite of software functionality, this robotic soldering process fits seamlessly within Industry 4.0 ideals.

To view the most innovative technology for electronics production, and speak to our knowledgeable team, visit Altus on stand J130.

www.altusgroup.co.uk