Since the invention of the first 3D printing technologies in the early 1980s, the 3D printing market has experienced a tremendous amount of innovation and interest. A niche technology until the expiration of key patents, the 2010s allowed many startups to emerge offering inexpensive consumer-level 3D printers. The subsequent media frenzy in the early 2010s thrust 3D printing into the limelight, accompanied by major multinational corporations like HP and GE entering the 3D printing space. After years of hype, the industry has moved on to a more critical examination of the value-add that additive manufacturing brings to businesses and supply chains. Despite the obstacles posed by the COVID-19 pandemic and persistent supply chain disruptions, the additive manufacturing market continues to find new applications and end-users. IDTechEx forecasts that 3D printing's continued innovation and meaningful adoption will lead the hardware and consumables market to surpass US$41 billion by 2033.
IDTechEx has studied the 3D printing industry for over a decade and has released their latest report, “3D Printing and Additive Manufacturing 2023-2033: Technology and Market Outlook”, providing the most comprehensive view of the market. In examining thirty individual 3D printing technologies and five major material categories, IDTechEx finds a continuous theme between these important aspects of the industry: expansion.
Evolution of Market Shares for 3D Printing Technologies and Materials 2022-2033. The IDTechEx report includes eighty 10-year forecast lines. Source: IDTechEx - "3D Printing and Additive Manufacturing 2023-2033: Technology and Market Outlook"
Given that established additive manufacturing technologies like selective laser sintering and thermoplastic filament extrusion are decades old, it might be expected for the market to consolidate and stabilize from a technology standpoint. However, new entrants with their own unique innovations on 3D printing are popping up every year, some of which are so unique that they don't fit into the classic seven printing processes framework. New technologies, which span polymer, metal, electronics, ceramics, construction, and composite 3D printing, offer different advantages and disadvantages to incumbents. Parallel to these new technologies are more incremental improvements in established processes. What both advancements allow is access to new applications and end-users that 3D printing previously struggled to reach.
Taking place in tandem with the expansion and improvement of the 3D printing hardware portfolio is the growth of the broader 3D printing ecosystem, including materials, post-processing, software, and services. For example, the 3D printing materials portfolio is expanding because of the aforementioned new technologies entering the market, which can process materials previously underused or underutilized by additive manufacturing. In addition, the software, scanners, and services sector of 3D printing is introducing new offerings to simplify the adoption of additive manufacturing by end-users, making their experience more seamless.
Across these different technologies, materials, and services, the theme remains the same: the expansion of additive manufacturing to enter new target markets and reach new end-users. IDTechEx expects this expansion to drive the 3D printing industry past US$41 billion in hardware and materials sales by 2033.
Market Forecasts for Additive Manufacturing Materials
The new report from IDTechEx, "3D Printing and Additive Manufacturing 2023-2033: Technology and Market Outlook", carefully segments the market by eighty different forecast lines across seventeen different technology categories, four major material categories, and eight material subcategories. These hardware and material forecasts analyze future installations, hardware unit sales, hardware revenue, materials mass demand, and material revenue. Additionally, IDTechEx provides comprehensive technology benchmarking studies, examination and case studies of critical application areas, detailed discussion of auxiliary AM industry fields, and in-depth market and economic analysis. Finally, IDTechEx carefully dissects the positive and negative effects of the COVID-19 pandemic and subsequent supply chain disruptions on the 3D printing market. For further information on this market, including 125 interview-based profiles of market leaders and start-ups, technology comparison studies, business model analysis, and granular 10-year market forecasts, see the market report "3D Printing and Additive Manufacturing 2023-2033: Technology and Market Outlook".
For more information on this report, please visit www.IDTechEx.com/3DP, or for the full portfolio of 3D Printing research available from IDTechEx please visit www.IDTechEx.com/Research/3D.
PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com
Tokyo, Japan – August 24, 2022 – Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, will be exhibiting at Productronica India 2022. From 21 to 23 September, visitors to Saki's booth PC05 in Hall 14/15 will be invited to discover the latest 3D-SPI, 3D-AOI and 2D-AOI inspection solutions. The Saki technology team will also present latest hard- and software innovations and demonstrate its Full SMT Line, Smart Factory and M2M capabilities.
Saki will offer booth visitors a first-hand look at the unique features of the latest hardware and software releases with an emphasis on reliability, speed, quality and value for applications across all sectors, including mobile phone manufacturing.
The show line-up on booth #PC05 will feature:
3D-AOI solution 3Di-LS2-L with 18μm camera head
The powerful 3D AOI model 3Di-LS2-L with 18μm camera head is the ideal inspection solution suitable for all standard full SMT line manufacturing processes. It is designed to improve production, boost process efficiency and maximize product quality. The closed-loop system, dual servo motor drive, high-resolution linear measurement and solid gantry design provide unsurpassed accuracy and repeatability. Quadruple multi-frequency digital projectors ensure accurate 3D measurements and high-quality images.
3Di-LS2 with 12μm high resolution
Saki’s flexible 3Di-LS2 has been developed in response to the increase of customer applications demanding further optional features and capabilities. The machine is based on the 3Di-LS2-L system and can be customized with a choice of three camera resolution levels of 7µm, 12µm, and 18µm to match specific application requirements. In addition, the system can be upgraded with a quad side camera system that ensures inspection of the entire board, including dead angles and areas missed by overhead cameras. Saki’s latest Z-axis optical head is a further optional feature for accurate inspection of tall components, press-fit components and PCBAs in jigs. The innovative optical-head offers the industry’s highest level of inspection capability. With such a choice, Saki’s 3Di-LS2 machine fulfills inspection capabilities and flexibility far beyond standard SMT inspection processes with accuracy, speed, and ease.
3Si-LS2 with 12µm optical head
Saki's high-precision and high-speed 3D solder paste inspection machine. The single-lane system is equipped with a 12µm camera head for board sizes from 50mm x 60mm to 500mm x 510mm.
BF-10D
The 2D-AOI system BF-10D was developed especially for high speed, inline, dual-lane production of M-size (330x250mm) PCBs, employing Saki's innovative high-speed color camera and a robust gantry frame designed for high-speed motion of the camera. Sophisticated image processing tools take advantage of multi-core CPU processing. Able to easily keep up with production takt times as short as 8 seconds, BF-10D handles dual-lane high speed production lines using only one head. Whether the two lanes have the same or different board configurations, simultaneous inspection is possible in one pass, making inspection very fast.
Saki's software suite & line control systems demonstrate the company's data-driven approach to continuous productivity improvement. Visitors to the Saki booth will experience the full IPC-CFX certified machine-to-machine connectivity capability, full line control enabled by Saki’s Offline Teaching station (BF2-Editor) and Verification station (BF2-Monitor).
“We see India as a market with huge growth potential for Saki. With our deep expertise in inspection solutions, our goal is to become the go-to technology partner for OEM's and EMS companies in India,” said Jayson Moy, General Manager Saki Asia Pacific.
For further information about Saki, visit www.sakicorp.com/en/.
PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com
(Waterbury, CT USA) – August 24th, 2022 – MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, will exhibit its range of innovative assembly solutions for the electronics manufacturing services industry at the upcoming EMS-Tag conference and exhibition on Thursday 8th September in Würzburger, Germany.
MacDermid Alpha will highlight its range of high reliability circuit board assembly solutions including high reliability solder pastes and alloys designed to exceed industry expectations in harsh environments. The ALPHA CVP-390V solder paste paired with the high reliability Innolot alloy provides superior electrochemical performance on fine pitched components to ensure reliability on complex PCB assemblies. The ALPHA HiTech range of adhesives, underfills, edgebonds and encapsulants will also be highlighted. Designed to provide reinforcement and protection for soldered assembled components, the ALPHA HiTech range protects against potential component failure due to mechanical stress.
For more information on the EMS-Tag conference and exhibition please visit: https://www.ems-tag.de/en-gb
To learn more about MacDermid Alpha’s high reliability assembly solutions please visit: macdermidalpha.com
About MacDermid Alpha Electronics Solutions:
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Electrolube, Kester, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Assembly Solutions, Semiconductor Solutions, and Circuitry Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time.
PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com
2022-08-25 – Seoul, Korea – Koh Young, the industry leader in True 3D measurement-based inspection solutions, is eager to explain how optical inspection positively drives Electronic Vehicle (EV) reliability upwards. We will present our first sessions on 08 September 2022 in Korean and English to support our global users. We will present additional webinars in Japanese and Chinese shortly thereafter. Our panel of experts will be available following the presentation to field questions about EV inspection solutions during a live panel session.
During the presentation, we will explore relevant EV technologies and trends by incorporating specific real-world application challenges and solutions. Attendees will be presented with exclusive information about how several different Koh Young solutions will improve manufacturing yield and quality across several stages of the production process.
Register now for the online seminar “Optical Inspection Drives EV Reliability” by clicking the “Register Now” link or visit our website www.kohyoung.com. During registration, you may submit specific questions for our panel of experts to address during the live Q&A session or attend to ask us directly.
Date Time Language Registration
Thursday 8 Sep 11:00AM Korean Standard Time (KST) Korean https://us06web.zoom.us/webinar/register/6016613063436/WN_llOdzPRKSiuVnG0AphWp-A
9:30AM Central European Summer Time (CEST) English https://us06web.zoom.us/webinar/register/2416613064392/WN_4bgWnkWXSm-5SmQsSN1fYA
1:00PM Eastern Standard Time (EST) English https://us06web.zoom.us/webinar/register/4916613064660/WN_PwNLmrLASWCSBzGRa4ZgjQ
If you cannot attend Koh Young Future Forum 2022, you can still learn more about Koh Young and its award-winning solutions by visiting our website at www.kohyoung.com.
About Koh Young Technology, Inc.
Established in 2002, Koh Young pioneered the market by launching the first 3D Solder Paste Inspection (SPI) system using a patented dual-projection Moiré technology. Since then, it has become the global leader in 3D measurement-based SPI and Automated Optical Inspection (AOI) equipment for the electronics industry. Based on its True3D™ measurement-based inspection technology, Koh Young has developed innovative solutions for challenges with Machining Optical Inspection (MOI), Dispensing Process Inspection (DPI), and Semiconductor Packaging Inspection (MEISTER Series). Through its technology innovations, Koh Young has secured thousands of global customers, and maintains the largest global market share in the SPI and AOI markets. Additionally, by adopting its user-centric R&D activities, it continues to use its core competencies and develop innovative solutions for new and existing markets. Its activities stem from the corporate headquarters in Korea to its global sales and support offices in Europe, Asia, and the Americas. These local facilities ensure it keeps in close contact with the market, and more importantly, its growing customer base to provide access to an award-winning network of inspection and measurement experts. Learn why so many electronics manufacturers trust Koh Young for reliable inspection at kohyoung.com.
For More Information
Koh Young Technology, 14F Halla Sigma Valley, 53 Gasandigital 2-ro, Geumcheon-gu, Seoul, Korea 08588
marketing@kohyoung.com www.kohyoung.com
Carlsbad, CA, USA – 19 August 2022 – Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, is pleased to announce that SmartTec Nordic A/S now distributes and supports ASYMTEK conformal coating and fluid dispensing products in Denmark and Norway.
“SmartTec Nordic has a long history in the electronics industry with their capability to develop customized hardware and software to meet local needs,” explained Lars M. Nielsen, global account and regional sales manager, Nordson Electronics Solutions, Europe. “They have strong technical expertise with turn-key solutions and great interactions with customers.”
Based in Copenhagen, Denmark, smartTec Nordic A/S provides sales, engineering, applications development, parts, and service for ASYMTEK products, as well as the other Nordson product lines of SELECT and DAGE, already in their portfolio. They are part of smartTec Gmbh, headquartered in Germany, who have supported the ASYMTEK product line for many years. A demonstration facility - more than 400m2 – near Frankfurt, Germany runs full conformal coating and dispensing production lines for test and process development for customers. As one of the largest solutions providers in Europe, smartTec will offer excellent customer support and enable growth in this region for Nordson Electronics Solutions.
“We have known Nordson and Asymtek for many years, and see how they continue to provide high quality products as well as cutting-edge technology within the coating and dispensing areas,” stated Lars Bøndergaard, General manager CEO, smartTec Nordic A/S. “This made it a logical decision for smartTec Nordic to work with ASYMTEK Products.”
About Nordson Electronics Solutions
Nordson Electronics Solutions makes reliable electronics an everyday reality. Through our ASYMTEK, MARCH, and SELECT brands, we supply the world's semiconductor, printed circuit board, and precision assembly manufacturers with the innovative fluid dispensing and surface treatment solutions they need to protect sensitive electronics. Day after day, year after year, across the globe, for over 35 years, we've delivered cutting-edge engineering and applications excellence to help our customers succeed.
About Nordson Corporation
Nordson Corporation is an innovative precision technology company that leverages a scalable growth framework to deliver top tier growth with leading margins and returns. The Company’s direct sales model and applications expertise serves global customers through a wide variety of critical applications. Its diverse end market exposure includes consumer non-durable, medical, electronics and industrial end markets. Founded in 1954 and headquartered in Westlake, Ohio, the Company has operations and support offices in over 35 countries. Visit Nordson on the web at www.nordson.com, www.twitter.com/Nordson_Corp or www.facebook.com/nordson.
Indium Corporation’s Brian O’Leary, global head of e-Mobility and infrastructure, will participate in two panel discussions on the charging-related reliability challenges in the e-Mobility market at the Electric & Hybrid Vehicle Technology Expo (co-located with The Battery Show North America) from Sept. 13-15 in Novi, Michigan, US.
“The automotive industry is going through the biggest change its seen in decades and is being turned on its head,” O’Leary said. “From supply chain, regulators’ ability to keep up within areas including autonomy, to the very standards we use in manufacturing. I hope my upcoming participation, as well as the ongoing work of the IPC’s e-Mobility Quality & Reliability Advisory Group, sheds light on important reliability issues for the e-Mobility industry going forward.”
In the panel, Building Quality, Reliability & Safety for E-mobility – A Case for EVs and Charging on Wednesday, Sept. 14, O’Leary brings together expert members of the IPC’s e-Mobility council representing both original equipment manufacturers (OEMs) and their suppliers. In this panel, they will discuss the challenges of building safe, high-quality, and reliable EVs and their chargers.
Panel members include O’Leary, who currently serves as the chair of the IPC’s e-Mobility council and helped organized its formation; Nello Li Pira, global R&I materials manager of CRF (Stellantis); Cory Bullis, senior public affairs manager, U.S. at FLO EV Charging; and Matt Kelly, chief technologist, IPC.
In his panel on Thursday, Sept. 15, O’Leary and guests will give attendees an overview of the state of public charging infrastructure in the U.S. In US Charging 2.0: Reviving Our Public Charging Infrastructure, they will discuss the country’s “failing grade” in charging. With a large number of non-functional chargers, market potential for EV adoption is slow and government regulation or intervention is imminent. However, a combination of improvements can dramatically drive performance, longevity, and reliability. He will be joined by Bullis; Brian Chislea, TS&D scientist at Dow Consumer Solutions; and Debbie Carboni, global product manager at KYZEN Corporation.
O’Leary is responsible for promoting Indium Corporation’s full range of products and services for e-Mobility, which include the markets for EVs, charging stations, and infrastructure, among others. He joined Indium Corporation in 2014 and has more than 20 years of experience in sales, marketing, and channel management in the electronics industry. He earned his master’s degree in international management at the Thunderbird School of Global Management at Arizona State University, Phoenix, AZ. He also co-authored two books on thermal profiling: Profiling Guide for Profitability and Profiling Guide for Six Sigma.
About Indium Corporation
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.
About the Electric & Hybrid Vehicle Technology Expo
The Electric & Hybrid Vehicle Technology Expo brings together engineers, business leaders, top-industry companies, and innovative thinkers to discover ground-breaking products and create powerful solutions for the future. It is co-located with the Battery Show North America.
PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com