Three Indium Corporation experts will share their industry knowledge and expertise during four presentations at the 55th International Symposium on Microelectronics (IMAPS) from Oct. 3-6 in Boston, Mass., U.S.

The following technical presentations will be featured:

• A Lead-Free Lower-Temperature Solder Paste for Wafer-Level Package Application by Dr. HongWen Zhang, R&D manager, alloy group

• A Drop-in High-Temperature Lead-Free Solder Paste that Outperforms High-Pb Pastes in Power Discrete Applications by Zhang

• Investigating Optimal Process Parameters for Ultra-Fine Solder Paste Printing in SiP Assembly by Evan Griffith, product specialist

Indium Corporation’s Guangyu Fan, thermal interface materials (TIMs) R&D leader, will present Thermal Performance of Liquid Metal Paste Containing Low Content of Metal Particles for Thermal Interface Materials during a poster session.

Dr. Zhang is manager of the alloy group in Indium Corporation’s R&D department. His focus is on the development of Pb-free solder materials and the associated technologies for high-temperature and high-reliability applications. He was instrumental in inventing the mixed-alloy solder technique to combine the merits of constituents to improve wetting, reduce processing temperatures, modify the bonding surface, and control the joint’s morphology, thus improving reliability. Dr. Zhang has a bachelor’s degree in metallurgical physical chemistry from Central South University of China, a master’s degree in materials and engineering from the Institute of Metal Research, Chinese Academy of Science, and a master’s degree in mechanical engineering and a Ph.D. in material science and engineering from the Michigan Technological University. He has a Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College, and is a certified IPC Specialist for IPC-A-600 and IPC-A-610 as well as a certified SMT Process Engineer. He has extensive experience in various aluminum (Al) alloys and fiber/particle reinforced Al-based composite materials, and Al-rich and ZrHf-based amorphous alloys. He has co-authored two book chapters on high-temperature lead-free bonding materials, has had a number of patents filed, and has been published in approximately 20 journals in the fields of metallurgy, materials science and engineering, physics, electronics materials, and mechanics.

Griffith is a product specialist for SEMI/SAAM fluxes and SiPaste® materials. He is responsible for researching and analyzing customer and market data and facilitating current and prospective customers’ needs. Additionally, he supports customers’ enquiries, internal product trainings, and works closely with Indium Corporation’s R&D team on new applications. Griffith earned his Bachelor of Engineering in Materials Science, graduating

PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com

AUBURN HILLS, MI – August 2022 – The Murray Percival Company, the leading supplier to the Midwest's electronics industry, is proud to be IAC Industries’ local supplier in the Metro Detroit area. IAC provides industrial workbenches, workstations, lab benches, seating, and shelving systems to many industries including Automotive, Assembly, Material Handling, Biomedical, Aerospace, R&D labs, etc.

IAC products offer the advantages of ergonomics, modularity, adjustability and durability that cannot be duplicated in ordinary office furniture. IAC’s mission is to improve the organization, function and atmosphere of its customers' production and assembly work areas, inspection stations, and research laboratories. “We are mainly focused in the electronics industry, but we are bringing on more and more brands that not only fit our customers’ profiles but many others in the industrial and technical industries,” says Mark Percival Jr., MARCOM manager for Murray Percival Co. “We have built a technical sales force that is so strong and knowledgeable, branching out into these other industries is seamless. We approach these customer projects with a ‘process improvement’ mindset rather than just a ‘distributor’ or ‘manufacturer’s rep’ mindset. We really want to do what’s best for our customers, improve their processes, create value and support them even after the project is complete.”

Do you need Industrial workbenches or workstations quickly? There is no program like the IAC “Quick Ship” program. The workbenches in this program include a large variety of configurations including 4-leg workbenches, packaging stations, adjustable height workbenches, multitask benches and more. Some of these benches have a 2–3-week lead times or less. For ASAP delivery, “Quick Ship” is the way to go.

In addition to the Quick Ship benches, IAC offers customized solutions for any application thrown at them. IAC’s experienced engineers work with customers every step of the way to design, manufacture and ship custom workbenches/workstations in a timely manner.

IAC manufactures 100 percent of its products inhouse where all processes meet or exceed industry specifications for quality. The company’s key design, manufacturing and customer service management represents more than 70 years of combined experience in the workstation industry. For more information, visit www.iac.com.

About Murray Percival

Murray Percival Company is a third-generation family-owned business that recently celebrated their 60th year in business. Located in Auburn Hills, MI they are currently the leading supplier to the Midwest's electronics industry, offering thousands of assembly equipment and production supplies as well as the industry’s leading process enabler. www.murraypercival.com For more information, visit www.murraypercival.com.

Austin, Texas August 29, 2022. High Density Packaging (HDP) User Group is pleased to announce that Advanced Micro Devices, Inc (AMD) has become a member.

“AMD thrives on an innovation-driven culture; my team evaluates PCB(A) related processes & components required to bring next generation products to market. We look forward to collaborating with HDP member OEMs, CMs, test service providers, and component/material suppliers to leverage our combined expertise in solving complex industry PCB(A) technology challenges”, said Jim Merkelbach, Senior Manager – Global PCBCAD, Data Center Engineering at AMD.

“I am pleased to welcome AMD to HDP, joining the outstanding companies working on HDP User Group projects. Their expertise and capability in high performance semiconductors, especially those focused on next-generation servers and cloud computing, will contribute significantly to several of our emerging technology projects”, said Larry Marcanti, Executive Director of HDP User Group.

About AMD

Founded in 1969 as a Silicon Valley start-up, the AMD has grown into a global company setting the standard for modern computing through major technological achievements. Today, AMD offers the industry’s broadest portfolio of leading high-performance and adaptive processor technologies, combining CPUs, GPUs, FPGAs, Adaptive SoCs and deep software expertise to enable leadership in computing platforms for cloud, edge and end devices.

Visit AMD at https://www.amd.com/en

About HDP

HDP User Group (www.hdpug.org), a global research and development organization based in Round Rock, Texas, is dedicated to reducing the costs and risks for the Electronics Manufacturing industry when using advanced electronic packaging and assembly. This international industry-led group organizes and conducts R&D programs to address the technical issues facing the industry, including design, printed circuit board manufacturing, electronics assembly, and environmental compliance. HDP User Group maintains additional offices in Singapore and Tokyo.

For more information, visit HDP User Group on the Internet at www.hdpug.org or contact Madan Jagernauth at madanj@hdpug.org, phone number +1 561.501.1567.

Indium Corporation celebrated with a press conference this morning the significant expansion of its onsite operations at 5836 Success Drive in Rome. With its growth, the Rome facility is now the company's largest manufacturing center globally in terms of square footage. The event was attended by media and special guests and the Rome business community.

The 24,000 square foot expansion is expected to have a significant economic impact on the city of Rome. It represents a more than $10 million investment into the local economy with the company looking to hire 300 employees over the next two years, with many roles needed immediately. In addition, the expansion brings the number of processes executed at the facility to 25 with more than 175 pieces of manufacturing equipment.

"The people of Rome have been welcoming to Indium Corporation since we began our operations here in 2013," said Indium Corporation President and COO Ross Berntson. "This investment represents our continuing commitment to being a conscientious corporate citizen, while ultimately contributing to the already fantastic quality of life here."

Since the commencement of operations at the Rome facility in August 2013, staffing has grown from just a few individuals to 163, with more hiring needed to meet increased demand. Overall jobs at Central New York facilities have grown from 681 in 2020 to 951 currently. Indium Corporation continues to grow globally with over 1,300 employees at 15 locations around the world.

Following the press conference, Indium Corporation hosted a recruiting event onsite to address its immediate production needs. The company is continuing its hiring campaign for Rome and other local facilities. Career seekers are invited to visit jobs.indium.com to learn more.

The Rome facility produces solder fabrications that are used primarily by advanced electronics manufacturers to build their final assemblies. Indium Corporation materials serve markets as diverse as aerospace, medical, telecommunications, and semiconductor assembly.

About Indium Corporation

Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.

PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com