Manassas, VA – August 3rd, 2023, ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce an upcoming webinar titled, "Tackling Flux Residues: Best Practices for Cleaning Power Electronics Components," on August 17th, 2023, at 2:00 PM EST.

Flux residues pose a significant challenge in cleaning power electronics components, causing corrosion, electrical shorts, and other reliability issues, affecting the performance and longevity of the components. Ravi Parthasarathy, Senior Application Engineer at ZESTRON Americas, will present the webinar. Through a series of case studies, this webinar will focus on best practices for cleaning power electronics components, including selecting the appropriate cleaning method, ensuring compatibility with the components, and several test methods to validate cleanliness.

Registration is free and available HERE. Take advantage of this opportunity to learn from one of the industry's leading experts on best practices for cleaning power electronics components. Attendees will have the opportunity to ask questions, receive expert guidance from Mr. Parthasarathy, and gain valuable insights into the latest cleaning technologies and best practices for optimal performance.

About ZESTRON:

ZESTRON is headquartered in Manassas, Virginia, and operates in more than 35 countries. With eight technical centers worldwide and the industry’s most knowledgeable team of engineers focused on high-precision cleaning, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.

For additional information or to tour one of our technical centers, please visit www.zestron.com

Indium Corporation is set to deliver a technical presentation and exhibit its industry-leading products for power electronics assembly at PCIM Asia, August 29-31, in Shanghai, China.

Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation titled Innovative High-Temperature Lead-Free Die-Attach Soldering Materials and Applications. He will examine the characteristics, applications, and process optimization related to new high-temperature, lead-free materials and their reliability testing data.

Power semiconductors are the core of electric energy conversion and circuit control in electronic devices, and are widely used in new energy vehicles, energy storage, data centers, photovoltaics, and industrial applications. In response to industry changes, Indium Corporation has launched a number of innovative high-temperature lead-free solutions, such as new high-temperature lead-free solder paste, pressured and non-pressured silver sintering paste, and copper sintering materials for die-attach.

“The power density of the third-generation semiconductors represented by SiC has been greatly improved, and higher requirements are placed on the on-resistance, thermal conductivity and reliability of die-attach materials,” said Hu. “Combined with the exemption of high-lead solder expiring in 2024, it is imperative for the industry to evaluate new and innovative high-temperature, lead-free solutions.”

As Senior Area Technical Manager for East China, Hu manages the technical support team in East China, and collaborates with global technical support teams to provide Indium Corporation customers with product and application solutions. He has more than 15 years of experience in semiconductor packaging and possesses expertise in advanced assembly technology development, process improvement, and assembly materials applications. Hu earned a master’s degree in IC engineering from the Chinese Academy of Science and a bachelor’s degree in electronic information science and technology from Nankai University, Tianjin, China.

Indium Corporation’s products for power electronics have been demonstrated to reduce energy consumption and solve warpage issues for its customers while ensuring high reliability and improving overall efficiency.

Featured products include:

• InTACK™ – a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. Designed for use in no-flux reflow applications with formic acid, InTACK™ is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, reducing the dependency on tooling without compromising soldering or sintering quality.

• InFORMS® – reinforced solder alloy fabrications that improve mechanical and thermal reliability and are specifically designed to produce consistent bondline thickness for power module applications. They also address specific challenges for the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.

• Indalloy®301 LT Alloy for Preforms/InFORMS® – a novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys. Specifically designed for power module applications, this alloy prevents warpage in package-cooler attach scenarios without sacrificing reliability like traditional bismuth-containing low-temperature alloys. It is available in preforms, ribbon, or InFORMS®.

• InFORCE™29 – a pressure copper sinter paste for high-reliability, high thermal conductivity, die-attach applications, InFORCE™29 features high workability, making it suitable for printing or dispensing applications. InFORCE™29 provides excellent sinter performance on bare copper surfaces without the need for costly gold or silver plating.

• InFORCE™MF – a pressure silver sinter paste for the highest reliability, highest thermal conductivity, die-attach applications, InFORCE™MF is specially formulated for printing applications providing low process yield loss due to print defects and reduces the need for overprint. With a high metal load and low organic content, it enables fast drying times and less material loss.

• Durafuse® HT – based on a novel alloy technology, designed to deliver a tin-rich, high-temperature lead-free (HTLF) paste, presenting the merits of both constituent alloys. Durafuse® HT delivers simplified processing, with no special equipment needed, and enhanced thermal cycling reliability equal to or higher than a high-Pb solder.

To learn more about Indium Corporation’s solutions for power electronics, be sure to visit with our experts at PCIM Asia in hall W2, stand F25.

About Indium Corporation

Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.

MADISON, AL – August 2023 – STI Electronics, Inc., a full service organization providing training services, training materials, analytical/failure analysis, prototyping, and contract PCB assembly, is pleased to announce the appointment of Brian Tharp as Master Instructor for the Training Services Department. This strategic move recognizes Tharp’s exceptional contributions, unwavering dedication, and remarkable leadership within the organization.

Tharp has been an integral part of the STI team since he joined the company. Throughout his tenure as Quality Manager, Tharp consistently demonstrated excellence, a commitment to quality and a profound passion for STI's mission. His expertise and relentless pursuit of excellence have made him a key asset to the company.

In his new role as Master Instructor, Tharp will lead and guide the development of education programs and training initiatives within STI. Leveraging his deep understanding of the company’s values and vision, he will empower the Training Services Department to deliver best-in-class training programs to STI’s valued customers and partners.

“Brian’s exceptional leadership, extensive knowledge, and passion for our company’s mission make him the ideal candidate to drive our training services to new heights,” said David Raby, President/CEO at STI Electronics, Inc. “We have complete confidence in Brian’s ability to inspire our team, enhance our training offerings, and propel STI to greater achievements.”

As Brian transitions into his new role, he will continue to exemplify STI’s core values of excellence, integrity, and customer focus. His relentless pursuit of quality and dedication to continuous improvement will undoubtedly shape the future of STI and strengthen the company’s position as a leader in the industry.

About STI Electronics, Inc.

STI’s mission is to provide electronic contract manufacturing, solution-based engineering, analytical services and training resources to the electronics industry. We will consistently provide products and services that meet or exceed the requirements and expectations of our customers as well as industry standards. www.stiusa.com

PENANG, MALAYSIA – Electronics manufacturing services (EMS) provider, ESCATEC, has appointed a Chief Sales Officer (CSO), with the Penang-headquartered Group seeking to rapidly expand market share globally. The new role will oversee ESCATEC’s international Business Development team and strategic development initiatives, with the key mandate of growing the Group’s customer base in emerging market segments.

Its Board of Directors (BoD) announced today that Charles-Alexandre Albin, currently the Group’s Director of Strategic Development (DSD) and member of the BoD, will take on the role of CSO. Charles has been instrumental in rapidly expanding ESCATEC’s production footprint and capabilities in recent years, and as CSO, he will have the added responsibility of securing new business for the Group’s various business units.

ESCATEC is active across a range of market segments with a customer base largely comprising of major OEM brands from Europe and North America. It currently has multiple production facilities in Malaysia, Switzerland, the United Kingdom, the Czech Republic, and Bulgaria, as well as a Design & Development (D&D) Centre in Switzerland and strategic partnerships in Croatia and the United States.

In recent years, ESCATEC has made significant investments to acquire the latest technologies and capabilities. Its key strengths today include a strong financial base with zero external debt, a portfolio of long-term customers, and an in-house capability to offer integrated product lifecycle solutions from design & development to mass manufacturing to post-sales services, ranging across MOEMS, electronics, box build, electro-mechanical, and plastic moulding services.

Moving forward, ESCATEC is seeking to expand its presence and relevance to several emerging technologies, with a special focus on disruptive Industrial, Medical, and Transportation market segments.

“ESCATEC has all the tools and resources in place to help disruptive OEMs scale their business – from ideation and product design through to mass production. As CSO I will be maximising the synergy between our Business Development team, our capabilities and expertise, and our plans to build a truly global production network. I am truly honoured to have been entrusted with this vision,” said Charles.

Charles has a BSc in Engineering and Business Studies from the University of Warwick and previously served as an Investment Banking Associate at J.P. Morgan in London. He was appointed a member of ESCATEC’s BoD in April 2016 and subsequently took on the fulltime role of Director of Strategic Development in October 2020. Charles will continue to report to CEO Ernest Sebak in his new role as CSO.