WESTWOOD, MA – HumiSeal a leading conformal coating manufacturer and innovator, is pleased to confirm its recent collaboration with Bob Willis and SMTA Europe enabling the release of Bob’s extensive training resources as a donation to the SMTA. HumiSeal’s sponsorship agreement also includes contributions to two well known causes/charities.

The training resources that have been made available for free cover a wide spectrum topics including solder, inspection, cleaning and conformal coatings amongst other relevant technologies. Webinars, Training videos and other related material can be accessed via the SMTA website (https://smta.org/).

David Greenman, Director at HumiSeal Europe said, “Our sponsorship has allowed these training resources to be available free of charge on the SMTA web site and for contributions to two worthy causes, the Charles Hutchins Educational Grant and Prostate Cancer UK.”

This joint effort between SMTA and HumiSeal Europe Ltd aims to not only advance professional development within the industry but also contribute to the betterment of society. Bob Willis, Keith Bryant (Chairman of SMTA Europe) and David Greenman recently visited Prostate Cancer UK and meet with Jade Dyer (Community Fundraising Executive) of Prostate Cancer UK, for a tour of their London headquarters and a discussion how the Bob Willis/SMTA contribution will help the research and support provided by Prostate Cancer UK.

Following the visit Bob Willis commented “It was wonderful to hear how our contribution will help Prostate Cancer UK with their work, meet Jade and see the excellent facilities they have at the London HQ. Also have a chance for a photo shoot.”

For access to the training resources visit www.smta.org, more information on HumiSeal protection of electronics can be found at www.humiseal.com, or e mail europetechsupport@chasecorp.com on SMTA Europe go to https://smta.org/group/europe 

TAIPEI – At this week’s SEMICON Taiwan, Henkel brings its extensive range of semiconductor packaging material solutions to customers in a collaborative setting designed to foster discussions that will help address application challenges. With recently launched innovations for high-reliability advanced packaging and wirebond devices, the company will showcase its enabling impact on some of the most demanding package designs used in the automotive, industrial, and high-performance computing sectors.

“As the SEMICON Taiwan show organizers have emphasized,” comments Henkel Global Market Segment Head for Semiconductor Packaging Materials, Ramachandran Trichur, “the semiconductor industry is central to nearly all technology development and to solving some of the world’s biggest challenges. Henkel is a key contributor to this progress, delivering cutting-edge semiconductor packaging materials for high reliability automotive packaging, AI and high-performance computing, and evolving industrial applications.”

As a leader in die attach pastes and films and having engineered several groundbreaking advanced packaging formulations, Henkel’s objective at SEMICON Taiwan is to introduce invited guests to materials that are helping semiconductor technologists respond to microelectronics advancement, including:

Automotive Electrification, Responsiveness, and Reliability– From power ICs to microcontrollers to sensors, the devices that make modern vehicles more electrified, safe, and connected require materials with robust processing capability and exceptional in-field performance. Henkel high thermal die attach adhesive Loctite Ablestik 6395T and pressure-less sintering material Loctite Ablestik 8068TI deliver the highest standard automotive grade 0 reliability and are compatible with various leadframe finishes, including Cu.

In addition, Henkel’s pioneering work in conductive die attach film materials is embodied in two of its top products, Loctite Ablestik CDF 200P and Loctite Ablestik CDF 600P. Both formulations offer the inherent benefits of conductive die attach film – tight bondline control, consistent fillet formation, no die tilt, and no resin bleed – and are distinguished by their different thermal and electrical conductivities, as well as die size compatibility. Henkel’s conductive die attach film materials are widely used for automotive microcontroller unit packages such as QFPs and TSSOPs.

High-Performance Computing and Mobile Processing Solutions– Next-generation processors are integrating the most advanced Si node flip chips, and protecting them against thermomechanical stress is vital to their reliability. Last year, Henkel introduced a breakthrough capillary underfill, Loctite Eccobond UF 9000AG, that balances high filler loading and fast flow capability. This combination helps packaging specialists meet volume production while ensuring excellent protection of chip interconnects. Lid and stiffener attach materials, also part of the Henkel portfolio, further protect high-value 2.5D and 3D packages by securing lids and peripheral stiffeners to reduce warpage, maintain coplanarity, and in some cases, may provide grounding and shielding capability.

“The converging demands of miniaturization, high performance, functionality, and extremely high reliability make semiconductor device innovation more complex than ever. We are helping our customers meet the challenges head-on with materials that allow them to confidently push the reliability envelope.” comments Ramachandran Trichur.

To learn more about Henkel’s semiconductor packaging materials, the company’s global R&D capabilities, and its application engineering expertise, visit this resource.

PENANG, MALAYSIA – ViTrox, which aims to be the world’s most trusted technology company, is excited to announce that we will be participating in SMTA International (SMTAi), at Hall B, Booth #1316 at the Minneapolis Convention Center, MN, USA. SMTAi, the Midwest's Largest Electronics Manufacturing Event, will take place on the 10 th and 11 th of October 2023.

This year, we will be showcasing our award-winning V9i Advanced Robotic Vision (ARV) Solution, which revolutionizes flexible inspections for conformal coating and final assembly inspections.

Featuring a unique 6-axis COBOT design, it enables adjustable angle inspections up to 90°, guaranteeing convenience. With its Advanced Smart Learning Algorithm, V9i ARV detects various conformal coating defects. Moreover, it performs thorough inspection for screw, cosmetic, connector, and label defects in final assembly, all achieved seamlessly without requiring CAD information. Our V9i ARV solution is built with multi-focal vision, allowing inspection ranging from 5 mm to 200mm, thus resulting in high-resolution images as clear as 14µm/px for small defect inspection. The V9i ARV solution ensures complete inspection coverage and always delivers reliable and consistent results.

Additionally, users can connect the V9i ARV solution to their production for inline production mode by using the SMEMA connection for upstream and downstream communication, thus providing better traceability in the back-end assembly process compared to human manual inspection. Alternatively, users can place the system for offline mode discussion with the existing conveyor. Read more about our V9i ARV Solution’s capabilities in conformal coating inspection and final assembly inspection.

Also, ViTrox has continued sponsorship of the SMTAi Passport Program. Therefore, we cordially invite all Explorers to visit our booth, delve into our solutions, and engage with us! Don't miss out on this amazing opportunity to meet and connect with us at SMTAi 2023! Our experts from ViTrox will be there to address all your inquiries and ensure you have an incredible experience at our booth. Simply click the registration link to book an appointment and meet our field experts in person!

For more information, feel free to reach out to us at enquiry@vitrox.com. We hope to see you soon!

CLINTON, NY – Indium Corporation is pleased to announce several key promotions within its Research and Development (R&D) team. Dr. Jie Geng has been promoted to the role of Senior Research Metallurgist, while Dr. Sihai Chen, Dr. Guangyu Fan, and Jim Hevel have all been promoted to the role of Senior Research Chemist.

In their new roles, these team members assume responsibility for leading research projects and working innovatively to deliver timely solutions for both customers and the market. This encompasses the design, implementation, and adjustments of experiments; analyzing the root cause of product failures and testifying solutions; and training and leading research associates in laboratory projects and works.

“As a company built on perpetual innovation, Indium Corporation believes in fostering an industry-leading R&D department,” said Dr. Yan Liu, Director, Global R&D. “The promotions of Dr. Geng, Dr. Chen, Dr. Fan, and Mr. Hevel are well earned and representative of our commitment to remaining at the forefront of materials science.”

Dr. Geng joined Indium Corporation in 2017 as a Research Metallurgist. Since that time, he has excelled in technology development, as demonstrated by his recent success with Indalloy®292 and Durafuse® HR. He holds a doctorate degree in metallurgy, a master’s degree in materials science, and a bachelor’s degree in materials science and engineering.

Dr. Chen joined Indium Corporation in 2007. He holds a doctorate degree in physical chemistry from the Chinese Academy of Sciences, is a Six Sigma Green Belt, and is certified as an IPC Specialist for IPC-A-610.

Dr. Fan joined Indium Corporation in 2011. He has a doctorate degree in polymer chemistry and physics, a master’s degree in polymer chemistry, and a bachelor’s degree in chemistry. He is also a graduate of the Dale Carnegie Leadership Skills for Success program.

Hevel has been with Indium Corporation since 2004 and has over 30 years of wave flux product development experience. He has been a driving force behind several of Indium Corporation’s successful products, including the recent award-winning CW-818. He holds a bachelor’s degree in chemistry from Michigan State University.