CHINO, CA — Scienscope International, a leading American supplier of cabinet-style micro-focus X-ray systems, is pleased to announce the appointment of Cesar Gomez Martinez to Optical Inspection Manager for Mexico and Latin America.

Martinez is an industrial engineer with 25 years of experience working in the electronics industry, within the maquiladora industry in the material supply (purchasing) and sales with distributors such as EIS for 21 years.

During his 21 years in sales, Martinez marketed numerous Scienscope products, and was personally able to verify the quality, service and guarantee of the products. When he left EIS, he started a representation company ITSREP, where he was Scienscope’s commercial representative.

"The opportunity arose to take over the optical inspection management in Mexico and Latin America for Scienscope International," stated Martinez. "I am happy be part of a company that likes to serve the client, innovate and continue to grow. I am sure Scienscope will be in the industry for many years to come."

With expertise in machine vision, X-ray and automation, Scienscope is a one-stop solution provider for warehouse automation and optical and X-ray inspection. Scienscope also offers customization based on your facility needs.

For more information, please email Scienscope at info@scienscope.com, call 1-909- 590-7273 or visit www.scienscope.com.

MINNEAPOLIS, MN – The Anti-Counterfeiting Forum, CALCE and SMTA are very pleased to announce that they will be jointly hosting the Counterfeit Electronics and Materials Symposium at the Manufacturing Technology Centre in Coventry, UK, on 14th and 15th March 2023. This international event will feature domain expert speakers from Europe and USA and builds on the history of past events held in the USA by SMTA and CALCE and by the Anti-Counterfeiting Forum in the UK.

The event will focus on current trends, threats and new developments in combating counterfeits in the supply chain. As well as current and emerging new threats, delegates will also be able to hear about current and developing best practice for the management of counterfeits in the supply chain, current and developing new methods for the detection of counterfeits and how to access further information.

The organizers are currently seeking abstracts from interested parties and recommend that you look at the event website to view all topics of interest.

If you plan to submit an abstract, please do so online in the next few weeks. A powerful industry wide technical committee will determine the programme in the coming months.

There will be plenty of opportunity for delegates to raise questions, participate in a discussion and interact with speakers during the day. Delegates will also be able to meet potential solution providers during breaks in the co-located tabletop exhibition space. Industry professionals who are new to the threat and want to learn more as well as experienced practitioners in counterfeit mitigation practices are sure to find this seminar valuable. Online booking will soon be available on the event website: www.anticounterfeitingforum.com

CLINTON, NY — Indium Corporation® will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications at SPIE Photonics West, Jan. 28-Feb. 3, San Francisco, Calif., US.

Indium Corporation is the leading solder supplier for laser and optical applications. Au-based alloys are a great choice to ensure the best performance and reliability possible for applications requiring a high-melting die-attach solder. In addition to meeting the demanding thermal and electrical requirements for high-reliability applications, they also provide the strongest corrosion- and oxidation-resistant solder joint possible.

Semiconductor laser die-attach applications require the highest quality, ultra-precise solder preforms to ensure accuracy and repeatability during assembly for a guaranteed highly reliable end product. Indium Corporation’s Au-based PDA preforms offer the highest level of quality available to deliver the best performance possible in critical, high-reliability die-attach applications. Features include:

• Highly accurate thickness control
• Precision edge quality, virtually burr-free
• Optimized cleanliness control
• Default waffle-pack method

Indium Corporation’s Au PDA preforms are available in the following alloys:

• 80Au/20Sn, 79Au/21Sn, 78Au/22Sn, 75Au/25Sn
• 88Au/12Ge
• 82Au/18In
• 96.8Au/3.2Si

Indium Corporation’s AuLTRA™ 75 is an off-eutectic AuSn preform solution (75Au/25Sn) designed to improve intermetallic reliability in applications using a die with a thicker gold plating, such as a GaN die used for high-frequency, high-power RF power amplifier devices for 5G and other critical military and aerospace wireless communications. AuLTRA™ 75 helps improve the operation of these critical technologies by adjusting the final solder joint composition and improving wetting and voiding. The AuLTRA™ product line also comes in 78Au/22Sn and 79Au/21Sn compositions.

Indium Corporation’s AuLTRA™ ThInFORMS™ are 0.00035″-thick (0.00889mm or 8.89μm) 80Au/20Sn preforms that improve the overall operational efficiency of high-output lasers. AuLTRA™ ThInFORMS™ help combat common issues such as:

• Shorting—reduced solder volume inhibits wicking up the die, minimizing the risk of shorting
• Poor thermal transfer—the ultra-thin 0.00035″ preform reduces bondline thickness (BLT), thus improving thermal transfer and increasing the longevity and performance of the device.

A leading gold solder innovator, Indium Corporation’s gold-based portfolio includes wire, paste, preforms, spheres, shot, and ribbon manufactured with cutting-edge technology to ensure supreme quality and the utmost precision. The most commonly used gold-based alloy is 80Au/20Sn; it is the pillar alloy of the microelectronics industry with a melting point of 280°C and works exceptionally well in the majority of die-attach and lid sealing applications. It exhibits good thermal fatigue properties and is used in many applications that require high tensile strength and high corrosive resistance. Indium Corporation’s AuSn solder offers numerous benefits including:

• Highest tensile strength of any solder
• High melting point compatible with subsequent reflow processes
• Superior thermal conductivity
• Resistance to corrosion

To learn more about Indium Corporation’s precision Au-based preforms, visit www.indium.com/products/solders/gold/gold-preforms or stop by booth #3085 at the show.

CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation in the upcoming SMTA Silicon Valley Expo taking place on December 8th at the Juniper Dome in Sunnyvale, California. AIM will highlight V9, their new ultra-low-voiding, no clean paste, along with their full line of solder assembly materials.

Formulated to solve one of the industry’s most difficult challenges, V9 has proven to reduce voiding to as low as 1% on BGA and <5% on BTC components while exhibiting stable print performance on fine feature devices over 12 hours. V9 post-process residue is easily probed and possesses high SIR values required for high reliability applications.

To discover all of AIM’s products and services, visit the company at the SMTA Silicon Valley Expo on December 8th for more information and to speak with one of AIM’s knowledgeable staff members, or visit www.aimsolder.com.