Sarasota Florida – July 2022 – WPI Vision, a division of World Precision Instruments, is pleased to announce the appointment of Southwest Systems Technology, Inc. as its manufacturers’ representative. Southwest Systems will represent the new 3D SpectaSCOPE™ inspection microscope systems in the states of Texas, Oklahoma, Arkansas and Louisiana. Southwest Systems Technology was founded in 1989. The firm sells equipment and materials in both the electronic assembly and semiconductor manufacturing industries. Southwest Systems’ sales professionals are trained in the latest industry processes and technologies.

Southwest Systems’ objective is to provide realistic expectations and product capabilities to its customers. The goal of the company is to enable the customer to correctly determine the viability of the equipment, materials and products for their specific applications and effectively select real long-term solutions. Under the new agreement, Southwest Systems will represent the game changing 3D SpectaSCOPE, with patent-pending technology and intuitive copyrighted software. For the first time, the microscope has increased return on investment (ROI) by solving some of the problems in the PCBA process. With patent-pending technology and intuitive copyrighted software, the 3D SpectaSCOPE inspection microscope utilizes enhanced reality

screen technology with high resolution cameras. The ergonomic 3D inspection microscope features an incredible working distance of 300 mm, automatic self-focusing, integrated image capture and true 3-dimensional viewing. The 3D SpectaSCOPE lets users increase throughput while achieving greater accuracy at the highest detail. The 3D SpectaSCOPE is optimal for rework, through-hole assembly and inspections, and it is available in multiple configurations.

Reduce time and errors and increase ROI by adding the 3D SpectaSCOPE into your inspection process. Available with a free 14-day try before you buy, 3D SPECTASCOPE can be tested out to prove its effectiveness on your inspection bench. For more information, visit www.wpiinc.com/vision.

For more information about Southwest Systems Technology, contact Scott Fillebrown at Scott@SWSystems.com or visit www.swsystems.com.

About WPI Vision and 3D SPECTASCOPE

The genesis of 3D SpectaSCOPE was driven by the engineers at WPI to solve some of the persistent problems in the production process and inspection in the PCBA industry. A byproduct of the bio-medical and research industry, 3D SpectaSCOPE is available for immediate FREE trials at www.wpiinc.com/vision.

WPI Vision is in the business of enriching the stereo microscopic process using patent pending technology to provide an superior user experience when compared with any other product at its price point. By leveraging advances in displays, CMOS sensors and processing power, WPIV is redefining how microscopic needs and problems are met and answered. WPI Vision is a wholly owned subsidiary of World Precision Instrument. Founded in 1967, WPI is a world leader in research laboratory product design and manufacturing with offices around the globe. 3D SPECTASCOPE is designed and manufactured in Sarasota, Florida, USA.

PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com

NORTH BILLERICA, Mass., July 2022 — BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, today announced the appointment of Closed Loop Technology, Inc. as its manufacturers’ representative in Southern California. Founded by Jim Bean and Robert Batchelder, Closed Loop Technology was formed to address the growing needs of micro-electronic and SMTA manufacturers, to make their plants and operations more efficient, with an emphasis on the medical, military, automotive, aerospace and other industrial facilities.

The firm will represent BTU’s thermal processing equipment in the following territories:

San Fernando Valley, Santa Clarita, Ventura, Santa Barbara, Central California

Jim Bean: 805-279-3264; jim@cltrep.com

South Orange County, San Diego County, Imperial County, Southern Nevada, Border towns of Mexico, Arizona, New Mexico

Robert Batchelder: 909-815-6397; robert@cltrep.com

Los Angeles, South Bay, North Orange County, Inland Empire, San Gabriel Valley, West Riverside County

David Batchelder: 909-312-1733; david@cltrep.com

“We are confident that the team at Closed Loop will be able to expand our reflow oven business in this region and provide excellent support to our customers,” said Chris Heesch, BTU Western Regional Sales Manager.

Closed Loop Technology consolidates a number of review and selection processes for their clients, giving a “whole picture” review and designing a comprehensive and complete solution for each customer in parallel with their needs and requirements.

With Closed Loop Technology’s depth of knowledge, understanding of the current manufacturing climate, and cadre of principals it represents, positions it well to “close the loop” for their clients. For more information, visit cltrep.com.

To learn more, visit www.btu.com.

About BTU International

BTU International, a wholly-owned subsidiary of Amtech Group (Nasdaq: ASYS), is a global supplier and technology leader of advanced thermal processing equipment in the electronics manufacturing market. BTU’s high-performance reflow ovens are used in the production of SMT printed circuit board assemblies and in semiconductor packaging processes. BTU also specializes in precision controlled, high-temperature belt furnaces for a wide range of custom applications, such as brazing, direct bond copper (DBC), diffusion, sintering and advanced solar cell processing. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia and Europe. Information about BTU International is available at www.btu.com.

PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com

AUSTIN -- TechSearch International’s latest analysis describes high-performance package options with an update on TSMC’s new offerings, including the latest organics CoWoS® versions. New high-end product examples using fan-out on substrate are discussed. Features of the build-up substrates supporting redistribution layer (RDL) structures are provided. Applications for high-performance wafer-to-wafer hybrid bonding are also described. Trends in integrated photonics packaging are discussed, including the use of fan-out options.

The report includes OSAT financials and examines economic trends impacting the industry. The past two years saw phenomenal growth in shipments of smartphones and PCs. Reduced demand for smartphones and PCs this year is changing package demand. High-performance and mid-range Samsung smartphones are examined to determine package usage.

TechSearch International analyzes changes in the gap between manufacturing demand and capacity for build-up substrates. Lower demand for PCs is easing the shortage this year, but demand continues to increase for the more complex, more expensive FC-BGA substrates. Examples of substrate features are included. IC package substrate design rules for major suppliers are provided in the report.

The latest Advanced Packaging Update is an 89-page report with full references and an accompanying set of 43 PowerPoint slides.

TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. TechSearch International professionals have an extensive network of more than 22,000 contacts in North America, Asia, and Europe. For more information, contact TechSearch at tel: 512-372-8887 or see www.techsearchinc.com.

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PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com

Germantown, WI—July 2022—WAGO has hired Jeffrey Govek its new Senior Sales and Application Engineer. After receiving his degree in Electrical Engineering from the University of Tulsa, he got his MBA from Methodist University. Govek, now based in the Dallas area, has worked in the oil and gas, printing and IoT industries. He also ran his own automation consulting company for many years prior to joining WAGO. “As a prior customer of WAGO and automation products, I feel that I can help demonstrate the value that WAGO brings to existing and future customers,” says Govek. “I’m excited to be at a growing company with great products and great people.”

For the latest news from WAGO, visit www.wago.com/us/press-contact

PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com