CLINTON, NY – Indium Corporation senior research chemist Mary Ma is set to deliver a technical presentation titled Printable Copper Sintering Paste for High-Power Die-Attach Applications at CSTIC, taking place in Shanghai, June 26-27.

Low-temperature copper (Cu) sintering paste, with high thermal and high electrical conductivity, is apromising material for die-attach applications in power electronics and third-generation semiconductor devices. Large size die-attach applications or IGBT modules require high efficiency printing transfer processes.

“As demand for high-power devices such as EVs and consumer electronics grows, so does the need for solder solutions that can meet the efficiency and operating temperature demands,” said Ma. “This paper elaborates on the influence of printing processes to obtain flat Cu paste deposit and high volume and I am honored to have the opportunity to present its findings at CSTIC.”

Ma is a senior research chemist in Research and Development at Indium Corporation. She joined Indium Corporation in 2010 and has more than ten years’ experience in the development of advanced materials which are applied in the semiconductor and electronics assembly industry. She has led the development of ultra-low-voiding solder paste and launched an advanced solder paste which was widely applied in the electronics assembly field. Ma is also responsible for product development for copper sintering materials which are used in advanced die-attach technology for semiconductors.

SILICON VALLEY – Zero Defects International [ZDI] has announced their participation as an exhibitor at the SMTA Oregon Expo and Tech Forum. It will be held at the Holiday Inn Portland South. The date of this event is Thursday, June 8, 2023.

Foremost among the PCBA test and inspection products and services to be shown will be ZDI's flying-probe ICT test services including reverse engineering and failure analysis. Additionally featured are ZDI partners' PCBA products including Europlacer SMT assembly equipment, Tagarno digital microscopes, Arcadia smart component racks, Epoch International's functional test fixtures, Seica flying probe and ICT test systems as well as Velan's PCB and PCBA engineering software services.

CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation in the upcoming SMTA Long Island In-Person Technical Meeting taking place on May 31 at Zebra Technologies in Holtsville, NY. Timothy O’Neill, AIM Solder Director of Product Management, will be presenting.

Mr. O’Neill has 25 years of industry experience and is a Certified IPC Specialist. His responsibilities include developing product and technical information; he is a technical writer and presenter for industry trade publications and events and has been recognized as a Speaker of Distinction by the SMTA. At this event, he will be speaking on the following:

Assembly Challenges & Solutions for M0201, 08005, and Micro/MiniLED

Processing solder paste using Type 6 and finer powders requires a thorough examination of current materials, equipment, and processes to ensure success. In this presentation, AIM’s Director of Product Management will share practical information about the implementation requirements of Type 6 pastes as well as lessons learned in assisting clients in preparing for an inevitable change in how PCB are assembled today and in the future.

Registration for this event is free of charge courtesy of the Long Island SMTA Chapter and available online through May 29. To learn more about AIM’s products and services, visit www.aimsolder.com 

INGLESIDE, IL – IDENTCO – a manufacturer of high-performance labeling solutions for the power equipment, electronics, transportation, and general industrial sector – has appointed longtime materials supply executive Brad Zechman as its newest CEO. He officially joined the company on April 10, and will be responsible for overseeing all strategic business, sales and product development direction across each of IDENTCO’s four major business units. Mr. Zechman also is CEO of Reliance Label Solutions.

Most recently, Mr. Zechman served as president of Pennsylvania-based Adhesives Research, where his implementation of a commercial transformation linked to a more suitable operational strategy lead to toward significant growth. Prior to that, he spent three years as VP of Global Packaging for Minnesota-based HB Fuller, where he oversaw strategies that helped mitigate the then-deflationary raw materials market. Before that, he spent a decade with specialty materials and electromechanical solutions company LORD, where his leadership led to exponential growth.

Mr. Zechman joins IDENTCO at a promising time. The company has been steadily adding to its extensive portfolio of labeling solutions, which it designs, manufactures and supplies for demanding sectors such as automotive components, electronics applications, industrial machinery & tools, and commercial transportation. Among other products, IDENTCO specializes in exactingly engineered labels, ribbons, applicators and printers for product tracking & tracing, branding, compliance and identification.

Mr. Zechman is replacing IDENTCO CEO and founder Scott Lucas, who is retiring after an impressive 37 years with the company. Through the decades, Mr. Lucas’ stewardship helped take IDENTCO from a promising labeling and marking solutions startup to the robust, globally-focused organization it is today. Mr. Lucas has assumed the title of Chief Strategic Relations Officer.

“I am honored to step into the role of a true industry pioneer like Scott, and look forward to helping build upon what he helped create as IDENTCO enters a new chapter,” said Mr. Zechman. “We’ll continue to expand of solutions portfolio across each of our four main business units, with the goal of further increasing our market presence in each.”

Mr. Zechman earned a degree in chemical engineering from Rutgers University in New Jersey, and an MBA in finance from Wharton School of Business, University of Pennsylvania.