TORONTO — Working closely with Altus Group, Sellectronics, a leading contract electronics manufacturer specialising in quick turn-around prototype assembly and low volume/high mix production, has recently invested in Koh Young’s 3D AOI inspection equipment to further enhance production.

Recognised for its innovative, high-quality PCB assembly, Sellectronics continually invest in leading-edge technology to provide assembly excellence. Looking for the equipment that would enable precise inspection, and best performance to price ratio to increase quality further and improve production times, the company approached Altus for guidance.

Jason O’Connell, Sellectronics Technical Director, said: “As the business grows, the company makes many investments in the latest equipment to improve processes and ensure we are capable of providing the most intricate PCB assembly service with the best possible accuracy.”

To help increase inspection precision, Altus recommended the Zenith Alpha HS+ from Koh Young. As a true 3D AOI solution, it is powered by artificial intelligence and machine learning, combining the best optomechatronics and vision technologies to deliver outstanding performance without sacrificing accuracy.

Suitable for demanding production lines like those in Sellectrionics, Zenith Alpha HS+ greatly improves process yields by removing the need for manual inspection. In addition, the technology incorporates AI to deliver the accuracy required for ultra-fine pitch and solder joint interreflection challenges to enhance production. It also features KSMART, a measurement-based process analysis solution that allows for Industry 4.0 implementation with reliable full 3D measurement data. Graham Tonkin, Sellectronics Director of Sales and Marketing, said: “Due to the precise and quantifiable measurement of the Koh Young platform, and by exploiting KSMART statistical process capability, our engineering process improvement and quality teams can aggregate real time production information. This not only removes the chances of an escape, but also to study our production processes in detail to improve our yields and drive our quality standards ever higher.”

Joe Booth, Altus Group CEO, concluded: “We are delighted to implement another Alpha HS+ system into the field and establish another new Koh Young user as the momentum of the new these innovative platforms keeps building. This equipment addition is just one of the investments that Sellectronics has made as they continue to deliver top quality electronics manufacturing.”

CAMBRIDGE, UK — With COP27 underway, sustainability is once again at the forefront of global discussion. Debates surrounding emissions reductions, water security, and renewable energy are at centre-stage with many politicians, businesses, investors, and think tanks enthusiastic to bring about meaningful change. In IDTechEx’s report, “Sustainable Electronics Manufacturing 2023-2033”, methods of reducing emissions within one of the most polluting industries are evaluated and discussed with a view to cost-effective and widespread implementation.

With the electronics industry accounting for 4 % of global greenhouse gas emissions, it is a sector that requires substantial innovation to reduce its environmental footprint. IDTechEx’s latest report explores how the environmental impact of manufacturing printed circuit boards (PCBs) and integrated circuits (ICs) can be reduced through innovative materials choices and processing methods. This includes implementing low-temperature processing, eliminating superfluous wasteful steps, recycling and re-using materials where possible, and adopting novel approaches where the long-term potential is foreseen. IDTechEx expects that within a decade, 20% of PCBs could be manufactured using more sustainable methods such as dry etching, printing, and low-temperature solder component attachment. The report explores what many well-known electronics manufacturers are doing to enact cost-effective and sustainable measures, including Samsung, IBM, Intel, Toshiba, Apple, and Dell, among others.

Sustainable Manufacturing Methods Covered in this Report

The report assesses sustainable methods of electronics manufacturing and concentrates on innovations within printed circuit boards and integrated circuits. The report evaluates how sustainable innovation can drive forward the new era of flexible electronics and covers different materials and manufacturing processes that can deliver effective long-term sustainability improvements. Covering each key stage of the value chain for PCB and IC manufacturing, the report identifies areas that can benefit from innovation. These are compared not just in terms of the emissions, materials, and water consumption but also in terms of what is scalable and cost-effective to implement.

The analysis covers the following areas:

• Different material choices for PCB and IC substrates
• Alternatives to traditional wet etching
• Additive approaches such as printing metallic traces.
• Low-temperature component attachment materials
• Shifts towards new dielectrics as integrated circuits reduce in dimension
• End of life analysis

Emerging Flexible Electronics Benefit From Sustainable Innovations

Most electronics today are manufactured on rigid substrates; however, flexible electronics are on the rise as a wide range of different application areas grow, including wearable technology and flexible displays. The flexible PCB substrate market is expected to reach US$1.2 billion by 2033, largely led by polyimide – a bendable plastic substrate already used in the PCB industry. Polyimide is an expensive material and is also environmentally unfriendly. The report discusses the use of cheaper materials such as polyethylene terephthalate (PET) but also biodegradable materials such as paper and natural fibers. While these appear some way away from appearing in everyday devices, many household names have pursued pilot projects employing biodegradable PCBs, including Microsoft and Dell.

A key advantage to the next generation of electronics is that its success depends upon innovation. Liberated from traditional processing routes, pioneering approaches can be adopted from the get-go that save time, reduce waste, and cut emissions. These approaches may involve something relatively simple such as switching to low-temperature solder, or something more revolutionary such as adopting a partial or fully additive manufacturing approach. The advantages and compromises to implementing sustainable innovations are fully evaluated in IDTechEx’s report, “Sustainable Electronics Manufacturing 2023-2033”.

Key Questions Answered in this Report

• What are the key policies and legislations to watch out for?
• What are existing low-emission technologies that can be implemented?
• What disruptive technologies are on the horizon?
• Which novel manufacturing routes are both sustainable, reliable, and scalable?
• How can additive manufacturing reduce costs and minimize waste?
• Where are the key materials growth opportunities?
• What are key players doing to improve sustainability?

IDTechEx has 20 years of expertise covering emerging technologies, including printed and flexible electronics. Our analysts have closely followed the latest developments in relevant markets, interviewed key players across the supply chain, attended conferences, and delivered consulting projects on the field. This report examines the current status and latest trends in technology performance, supply chain, manufacturing know-how, and application development progress. It also identifies the key challenges, competition, and innovation opportunities within sustainable electronics manufacturing.

To find out more about the new IDTechEx report “Sustainable Electronics Manufacturing 2023-2033”, including downloadable sample pages, please visit www.IDTechEx.com/SustainableElectronics.

SANTA CLARA, CA ― Absolute EMS, Inc., an award-winning EMS provider of turnkey and consignment manufacturing services, is pleased to announce that the company is sponsoring a 16-year-old driver in the Race for Research Event benefiting St. Jude Children’s Research Hospital.

Every once in a while, you meet someone who just has a little something extra. Drive, passion, charisma, or sometimes they are just wise old souls. Ms. Mickelina Monico is a young woman who is not only smashing the proverbial glass ceiling but will not allow one to exist in her world young and exciting world.

When Monico was turning 15 she wanted to take up race car driving. Not just drive, but be the best in her sport. When her sport outstripped her family’s ability financially, it was not a problem. She created her own sponsorship package to take to local businesses with an enticing story as to why they should sponsor her, and yes, she was successful. But she was young then. She is 16 now and has her eyes set on larger challenges and goals.

The young driver’s father had cancer when he was younger. When he recovered, he wanted to give back to St Jude. He single-handedly organized one of the most profitable fundraisers for St Jude. Now, his daughter is coordinating a fundraiser for St. Jude and using her racing as a conduit. Monico would like to organize one of the most profitable fundraisers for St Jude and we can join.

“When you see a young person with this much passion, it has always been my reaction to run, not walk, to help them!” said Jayne Carthy, Vice President of Sales and Marketing. “Mickelina is 16! I don’t know who she will be when she is 30 but I can guarantee she will be a leader of sorts making this world a better place for all of us – all while she elegantly carves a path into racecar driving for young women. Yes please, we very much wish to be a part of this.”

Absolute EMS is proud to support young women determined to break the glass ceiling. The company has contributed to the young, ambitious driver’s fundraiser and looks forward to leading her to success. The fundraiser will take place Friday, May 12, 2023 at the Hilton Garden Inn Fairfield, and the race will be held Saturday, May 13, 2023 at the Dixon Speedway in California.

Absolute EMS is a leader in end-to-end electronic manufacturing services solutions that help its customers rapidly introduce innovative new technology by facilitating speed-to-market in their marketplace. Speed-to-market starts with engineering services, and extends into prototypes, pilots and then into production.

A long-time commitment to sustainability contributes to Absolute EMS leading the way for manufacturing operations among EMS organizations. For more information, visit www.absolute-ems.com.

To make a contribution, visit https://urldefense.com/v3/__https:/fundraising.stjude.org/site/TR?px=7764315&pg=personal&fr_id=133399__;!!NfcMrC8AwgI!dHfRzSbVA_zNdgRHQPZJfZev-mcX5rEPkvbTZZyLi8WNvIW8Eygi-9JHwsTdXgPhvo9tv6iwFRgmhWJDM955XWR2LXIizA$

CRANSTON, RI — AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that they will feature their new AIM LUX™ Product Line at Hangjiatalk MiniLED, scheduled to take place on November 17th and 18th, 2022, at Crowne Plaza Shenzhen International Convention and Exhibition Center.

AIM designed its LUX solder materials to provide tier one manufacturers of LED, miniLED and hi-power LED assemblies with solder pastes and alloys to solve production challenges associated with these applications. AIM Solder’s Flopy Feng will present on the second day on MiniLED Assembly Material Considerations.

Designed to provide tier one manufacturers of LED, miniLED and hi-power LED assemblies with solder materials to solve production challenges associated with these applications, the LUX product line pairs ultra-fine SAC-based and silver-free Type 6, 7 and 8 alloy powders along with innovative flux chemistries. AIM’s NC259 series is proven to provide excellent soldering performance and high production yields. When combined with the SN100C® alloy, NC259 solder pastes eliminate silver migration concerns. AIM REL61™ is a low-silver alloy option that can lower peak reflow temperature requirements and improve mechanical strength over other low/no-silver alloys. For high-power LEDs, AIM's REL22™ doubles the service life under extreme thermal cycling conditions. AIM's Tacky Flux offers high tack forces, unlimited open time, and improved wetting for all mass transfer and high-speed dipping applications.

AIM Solder’s Flopy Feng will also present information on MiniLED Assembly Material Considerations on November 18th. MiniLED assemblers can learn from SMT applications because they share some similarities, but as technology progresses, it is apparent there are significant differences as well. Ultra-miniature print requirements, novel component placement techniques and low oxygen reflow environments require new and innovative materials to optimize production throughput and product quality. This presentation will discuss some of the material considerations for miniLED assembly and their implementation.

For more information about the AIM LUX Product Line and AIM’s services, visit us at Hangjiatalk MiniLED or visit www.aimsolder.com.