CLINTON, NY — Indium Corporation is pleased to announce the promotion of Sze Pei Lim to the role of Senior Global Product Manager, Semiconductor and Advanced Materials.
Lim leads all aspects of the global Semiconductor and Advanced Materials product line, including the strategic planning, product line roadmaps, promotional activities, pricing, and channel development. She works closely with R&D, engineering, manufacturing, sales, and technical support teams around the world to develop and grow Indium Corporation’s world-class offerings.
Lim is a task force member of the International Electronics Manufacturing Initiative (iNEMI) Packaging Technology Integration Group and has co-chaired a number of industry projects and roadmapping initiatives over the past five years. She is on the executive committee of the Institute of Electrical and Electronics Engineers (IEEE) Electronics Packaging Society Malaysia Chapter, serving as Secretary for the past two years. She is also part of the organizing committee for the International Electronics Manufacturing Technology (IEMT). She has authored a number of technical papers and has presented regularly in various international technical conferences. In addition to English and Malay, she speaks fluent Mandarin and has been instrumental in developing Indium Corporation’s Chinese semiconductor business and team.
Lim joined Indium Corporation in 2007 as an Area Technical Manager, based in Kuala Lumpur, Malaysia, where she developed the Southeast Asia Technical Support team. She was promoted to Technical Manager (SEA) in 2013 and began her role as a Regional Product Manager for Semiconductor in 2015. She holds a bachelor’s degree from the National University of Singapore, where she majored in industrial chemistry with a focus in polymers.
HAVERHILL, MA — The motivation behind component lead tinning is to facilitate the removal of gold plating to eliminate the risk of gold embrittlement, tin whisker mitigation, or processing components for applications that require refinishing with lead-free solder for RoHS compliance. The ideal method to facilitate the removal of gold plating and mitigate tin whiskers from SMT and through-hole components is to use the robotic hot solder dip (RHSD) process. This new white paper from Circuit Technology Center examines the key process considerations when undertaking this process.
The full white paper can be viewed here: https://www.circuitrework.com/features/1067.html
HOWELL, MI — Horizon Sales is pleased to announce that it received an award from ESSEGI Automation S.r.l. for its Top Sales Representative in the Americas. Jose Ciccio, Global Sales Manager ESSEGI, presented the award to David Smith, Horizon’s South Regional Manager, and Kyle Keydel, Horizon’s East Regional Manager, on behalf of the Horizon team during the ESSEGI sales meeting that took place October 18-20, 2022 in Vincenza, Italy.
The award was presented with the recognition that even though Horizon Sales’ territory of just the Midwest USA is very small in context of the all of the geography and account density throughout the entire Americas, Horizon was responsible of providing more than 20 percent of all sales for the ESSEGI product line.
Participants from around the globe including Europe, Africa, Australia, Asia and the Americas (including North, South and Central America) attended the three-day event. The sales meeting featured some product training and an advance introduction to some of the newer features that will be shown for the first time to the general public at the IPC APEX Expo in January Horizon Sales offers ESSEGI’s complete line of automated component storage systems, including the new ISM UltraFlex 3600S. The unit is a new benchmark in the electronic component storage market, pushing performances beyond current possibilities, allowing the user to reconfigure the unit as their needs change.
For more information, visit www.horizonsales.com
REDDITCH, UK — Five years ago, Altus Group, a leading distributor of capital equipment in the UK and Ireland, embarked on a new partnership with batch Xray inspection solution provider Scienscope. Since then, the systems have gained momentum as electronics’ companies look for ways to increase traceability and improve quality of manufacturing as parts increase in cost, both to improve manufacturing processes and reduce any risk of error.
Scienscope’s presence in Europe has grown exponentially, with the American company working closely with Altus to take advantage of their industry knowledge. Together with Scienscope’s dedicated team in the region who support sales and aftercare, it has resulted in unified support offering to ensure customers’ needs are met.
Joe Booth Altus CEO said: “Scienscope has gone from strength to strength over the last years with the support of Adrian Radu, European Sales Manager. They have focused their attention on the real pain points experienced by our customers across X-ray and component management. They have developed tools that solve those problems better than most of the providers in the market and with a more palatable price point.”
Scienscope comes into their own when price to performance is critical. This is particularly important to Contract Electronics Manufacturers (CEMs) who require top quality results, alongside efficient and cost-effective processes.
PCBA X-ray solutions are often seen as too expensive to implement, but Scienscope is working to change that by offering affordable solutions with closed tube technology without compromising on performance. The X-Scope 3000 is one of the most popular X-ray inspection systems in the portfolio. It offers many advantages to help inspect highly complex PCBAs including a larger working area, automatic volumetric checking and measuring features.
“Scienscope’s X-ray systems pack a lot of functionality and a lot of performance for their price point and that is why we are winning projects. When it comes to component management, it’s also a no brainier as Scienscope has become a one stop shop to create gold standard component management and traceability. There are new generation systems coming soon from Scienscope that will really take the competitive advantage to a new level, so watch this space!”
To find out more about Scienscope’s products visit www.altusgroup.co.uk
NEWMAN LAKE, WA – Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Starlight Refined Technology Limited has purchased a Pulsar solderability system.
The Pulsar utilizes the highly proven dip- and-look test method that is a qualitative type test performed by comparative analysis after specimens are dipped in a bath of flux and molten solder. An advantage of the dip-and-look method is since it is based on comparative analysis it can be performed rapidly by shop floor personnel with minimal training as well as requiring significantly lower capital investment then a wetting balance test system. The Pulsar solderability test system complies with all applicable solderability test standards including MIL-STD-883 Method 2003, IPC J-STD-002 and MIL-STD-202 Method 208.
About Starlight Refined Technology Ltd.
Headquartered in Hong Kong, Starlight Refined Technology Limited serves the semiconductor, telecommunications, and electronics manufacturing industry segments. Their core business is providing design, manufacturing tooling and precision machining services to companies throughout the Asian market. For more information, please visit: www.srt.com.hk.
About Hentec Industries
Hentec Industries/RPS Automation is a manufacturer of automated selective soldering, component lead tinning, and solderability test equipment for electronics and electronic component manufacturing, assembly, and distribution. Hentec/RPS has been advancing automated soldering and lead finishing technology for defense, aerospace, automotive, contract manufacturers and micro-electronics component manufacturers since the early 90’s. All Hentec/RPS products are designed and manufactured in Newman Lake, Washington. For more information, please visit us at www.rpsautomation.com.
BANNOCKBURN, IL — New data from IPC show that most electronics manufacturing industry executives see a recession as inevitable. IPC’s October Monthly Economic Outlook and Global Sentiment Survey found that 27 percent of industry executives believe the economy is already in a recession, 45 percent believe the economy will enter a recession in 2023, and 13 percent believe the economy will enter a recession in the fourth quarter of 2023. Industry executives expecting a recession are bracing for a longer one.
“Tight financial conditions and an uncertain economic outlook are making both businesses and consumers more cautious,” stated Shawn DuBravac, IPC chief economist. “We have reached the end of the post-lockdown rebound.”
Inflation continues to dominate the narrative, with the U.S. likely past peak inflation, while the situation worsens in Europe. Europe is expected soon to reach peak inflation, and prices continue to rise. Projections for economic growth in Europe in 2023 have been lowered, and now show a decline for the first time for the entire year. China’s economy remains below the targeted 5.5 percent growth expected for the year, with growth likely to be closer to 3 percent in 2022. The yuan has fallen to its lowest level in 14 years.
IPC surveyed hundreds of companies from around the world, including a wide range of company sizes representing the full electronics manufacturing value chain.
View the full reports:
Current Sentiment of the Global Electronics Manufacturing Supply Chain