AUBURN HILLS, MI – The Murray Percival Company, the award-winning leading supplier to the Midwest’s electronics industry, today announced Josh Funk’s introduction of a Yxlon Cougar Evo X-Ray machine into White Horse Labs, a leading provider of electronic component testing and quality assurance services. The advanced X-Ray machine will allow White Horse Labs to provide even greater accuracy and efficiency in detecting defects and ensuring quality of electronic components.

The Yxlon Cougar Evo X-Ray machine is equipped with the latest technology, providing high-resolution imaging and fast detection of defects in electronic components during the production process. The machine’s advanced features enable White Horse Labs to perform thorough inspections while ensuring that clients receive high-quality components.

“We chose Yxlon because of their reputation for delivering the highest quality X-Ray machines in the industry,” said Aaron Page, General Manager at White Horse Labs. “The Cougar Evo X-Ray machine is a game-changer for our quality assurance services, allowing us to identify defects quickly and accurately in electronic components. This has helped us to improve our processes and provide our clients with even greater confidence in the products they receive.”

This partnership between White Horse Labs and Yxlon represents a commitment to quality and innovation in the electronics industry. White Horse Labs has been providing quality assurance services to customers for more than a decade, while Yxlon has a long-standing reputation for producing high-quality X-Ray machines.

DAYTON, OH – Libra Industries, a valued portfolio company of CW Industrial Partners (CWI), is thrilled to announce the promotion of Andrew Williams to the role of President and CEO.

Mr. Williams, previously serving as Senior Vice President of Business Development at Libra, played a pivotal role in driving double-digit growth within the company's core markets, including Semiconductor, Medical, Aerospace, and Defense. With over three decades of experience in contract manufacturing and holding senior positions at renowned companies such as Jabil, Sanmina, and Kimball Electronics, Mr. Williams brings a wealth of expertise to his new position. His leadership style emphasizes collaboration and a proven track record of process enhancement for technologically advanced product businesses.

Expressing his gratitude for the appointment, Mr. Williams stated, “I am deeply honored to lead such an exceptionally talented and hardworking team dedicated to delivering innovative manufacturing solutions to our clients. We will continue to focus on delivery of truly customized manufacturing and supply chain solutions to some of the world’s most prominent OEMs.”

Todd Martin, Managing Partner of CW Industrial Partners, commented “We are absolutely thrilled that our extensive search process yielded the best possible candidate right here on our existing team. Andrew is an extremely talented and competitive leader who is relentlessly dedicated to our customers’ success.”

REDDITCH, UK – Altus Group, a leading supplier and service provider of capital equipment for the electronics industry, has revealed that since partnering with Heller Industries, they have seen unprecedented installations throughout the UK particularly following the launch of the new MK7 convection reflow system thanks to its ground-breaking design and features.

The new MK7 line of reflow ovens have been hailed as the most economical systems ever released. Building upon the remarkable success of the MK5 oven, the MK7 brings significant advancements in various aspects of reflow technology.

Joe Booth, CEO of Altus Group, said: "The response to the Heller MK7 reflow ovens in the UK have been extremely positive. The innovative improvements in energy efficiency have been especially important but there are also advances in thermal management, ease of operation and maintenance which have caught the attention of electronics manufacturers and resulted in record numbers of installations.

"Our commitment to delivering industry-leading solutions that maximise productivity, minimise costs, and increase performance are integral to Altus. Heller Industries' innovative solutions perfectly align with these objectives."

One of the key highlights of the high-throughput MK7 is the redesigned thermal heating zone, which effectively reduces thermal mass and brings the fans closer to the product. This update includes an enhanced low height heater module providing the lowest Delta Ts for superior thermal uniformity and improved air flow. MK7’s clever design and Industry 4.0 compatibility ensures its seamless integration into existing production setups for those already using Heller’s systems.

Energy consumption of the MK7 has been reduced by at least 25% compared to the MK5 which was a market leading system when launched, with the Uniform Gas Management system eliminating ‘net flow’ which results in nitrogen consumption reductions of up to 40%. The energy required for start-up has also been significantly reduced, improving the speed of initialisation. Additionally, the reduced thermal mass in the heating zone, coupled with new software-based energy reduction capabilities, further enhance the efficiency of the oven when idle.

Heller’s state-of-the-art reflow oven offers unparalleled advantages and continues to be one of Altus’ most sought-after options in the UK and Ireland. To find out more visit www.altusgroup.co.uk

CLINTON, NY – As an industry leader in innovative materials solutions for heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications, Indium Corporation® will feature innovative products designed to meet the evolving challenges of HIA and SiP at the Chiplet and Heterogeneous Integration Packaging Conference and Exhibition (CHIPcon) hosted by IMAPS, July 24-27, in San Jose, CA.

Indium Corporation’s proven SiPaste® series is specifically designed for fine feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void®, reduce slumping, and demonstrate consistent superior printing performance. The newly released, award-winning SiPaste® C201HF offers the same superior printing performance with the benefit of having a cleanable chemistry with semi-aqueous-based solutions.

As the industry leader in no-clean semiconductor flux, Indium Corporation will feature NC-809, the first low-residue no-clean, ball-attach flux on the market. NC-809 is a dual-purpose flux, engineered with high-tack characteristics for flip-chip applications and with superior wetting power for ball-attach applications. This material is designed to hold die or solder spheres in place without risk of die shift or solder sphere movement during the assembly process.

NC-809 is designed to leave minimal residue after reflow at the level of Indium Corporation’s proven ultra-low residue (ULR) flip-chip fluxes, such as NC-26S and NC-699. NC-809 is the first ULR flux qualified for ball grid array ball-attach applications for packages that are sensitive to traditional water cleaning processes. NC-809 also improves production yields by eliminating costly cleaning steps that can increase substrate warpage, both after reflow and before the underfilling steps, creating the potential for die damage and cracked solder joints.

Indium Corporation will also feature Indium12.8HF, an award-winning, no-clean, halogen-free solder paste formulated to be compatible with a wide range of microdispensing and jetting systems. Indium12.8HF provides exceptional deposition performance, and its unique oxidation barrier promotes complete powder coalescence during reflow to eliminate graping and similar reflow issues.

Additionally, Indium Corporation will showcase QuickSinter®, a high metal content paste, redefining sinter technology. Available in pressure and pressureless formulations, this portfolio of sintering solutions delivers products engineered for customers’ specific application needs. The company’s suite of Thermal Interface Materials, including Heat-Spring®, m2TIM™, and Liquid Metal Paste will also be featured.

To learn more about Indium Corporation’s innovative solutions for HIA and SiP, visit our experts at CHIPcon, or visit us online at indium.com/HIA.