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MANASSAS, VA – ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that the ZESTRON Americas team will be featuring our newest decoating products, ATRON® DC and HYDRON® SE 230A, at the SMTA International Expo & Tech Forum.

New Decoating Products:

At SMTAI, ZESTRON will promote our new decoating products, ATRON® DC and HYDRON® SE 230A. The cleaning agents efficiently remove conformal coating residue from pallets, fixtures, tools, and boards. The products work on acrylic, urethane, arathane, and epoxy coating residues without the need for labor-intensive manual cleaning. Don’t take our word for it; check out the below quote from one of the industry’s top Aerospace and Defense companies.

“The ZESTRON product tackled the challenge all other evaluated alternatives couldn’t. Our challenge included multiple coating types under different processing conditions. I recommend anyone removing the coating from tooling and parts, or reworking coated electronics, using harsh solvents or manual labor, consider trying this product because it’s a game changer!” – Axel Vargas, Manufacturing Engineer Staff at Lockheed Martin.

For more information about these products, visit our Decoating Page!

About ZESTRON:

ZESTRON is headquartered in Manassas, Virginia, and operates in more than 35 countries. With eight technical centers worldwide and the industry’s most knowledgeable team of engineers focused on high-precision cleaning, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.

For additional information or to tour one of our technical centers, please visit www.zestron.com.

WATERBURY, CT  MacDermid Alpha Electronics Solutions, a global leader in high performance electronics materials, will exhibit its latest interconnect solutions and present five papers at the SMTA International Expo and Conference taking place October 31 – November 3 at the Minneapolis Convention Center in Minneapolis, MN.

A team of MacDermid Alpha experts will be presenting five papers discussing a range of solutions and materials designed to meet the demands of critical applications within automotive, telecommunication, and high-power LED assemblies. The materials covered by their research include: next generation low temperature and high reliability solder pastes and edgebond materials, the evaluation of polymer materials in combination with no-clean solder paste, advances in plating for connector press-fit applications, bio-based encapsulation resins and potting compounds, plus, leadframe chemistries for die attach.

    The titles of the technical papers scheduled for presentation are as follows:
  • Next Generation High Reliability Solder for Automotive Applications, Pritha Choudhury, Tuesday, November 1, 8:30 AM
  • Direct Metallization for the Printed Circuit Boards Manufacturing, Leslie Kim, Thursday, November 3, 8:00 AM
  • Expandable Bio-based Polymers: A Lightweight Future for Electronics Ruggedization, Beth Turner, Thursday, November 3, 11:00 AM
  • Reliability performance of fourth generation low temperature solder alloys in homogeneous and hybrid solder joints, Morgana Ribas, Thursday, Nov 3, 1:30 PM
  • Process and Chemical Reliability Requirements in Matching Reinforcement Materials with Solder Paste Flux Residue, Westin Bent, Thursday, November 3, 3:30 PM

In addition, MacDermid Alpha will promote its innovative portfolio of metallization and electronics assembly technologies in Booth 1018. Featured products include the Electrolube and HiTech brands of polymer solutions engineered to meet the requirements for high reliability and protection for increasingly complex circuit boards, coupled with the drive towards miniaturization. MacDermid Alpha will also showcase its latest development in the Alpha brand of solder paste technology, ALPHA OM-565 HRL3, a low temperature solder paste which enhances electro-chemical performance over and above existing low melt point solders. This paste enables a reduction in peak reflow down to 175°C in order to mitigate common warpage induced defects such as Head-in-Pillow and Non-Wet-Open to improve assembly yields.

For additional information about the latest products and technologies from MacDermid Alpha Electronics Solutions stop by Booth 1018 or visit MacDermidAlpha.com.

About MacDermid Alpha Electronics Solutions:

Through the innovation of specialty chemicals and materials under our Alpha, Electrolube, Kester, Compugraphics, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time.

ROSEVILLE, CA — The Michael Ziegler PRIDE Industries Foundation has been awarded a two-year, $280,000 grant from the Walter S. Johnson Foundation to fund its Youth Success Initiative.

“With this generous grant from the Walter S. Johnson Foundation, we are now able to launch the Youth Success Initiative,” said Dr. Jennifer Luebke, Chief Workforce Inclusion Officer, PRIDE Industries. “This new program will provide coaching, mentoring, counseling, and employment to young adults. It will also connect program participants to post-secondary education and training opportunities.”

As the nation’s leading employer of people with disabilities, PRIDE Industries is continually working to expand the employment services it offers. The Youth Success Initiative is the organization’s latest such offering. This workforce development program is focused on helping youth with disabilities and other barriers to employment (ages 16-24) achieve success in their desired career path and live independently. The Youth Success Initiative will help young people successfully transition from foster care, juvenile justice systems, and homeless care systems in Placer and Sacramento counties. PRIDE Industries, in consultation with New Ways to Work, will design, pilot, and monitor the Youth Success Initiative.

This is the type of program that is a natural fit for both PRIDE Industries and the Walter S. Johnson Foundation.

Founded in 1968, The Walter S. Johnson Foundation assists transition-aged foster youth and other vulnerable young people in Northern California and Nevada, helping these individuals reach their potential and become successful adults.

“The Walter S. Johnson Foundation is thrilled to partner with PRIDE Industries on supporting this program to help current and former foster youth with their employment skills,” said Yali Lincroft, Vice President of Philanthropic Services at the Walter S. Johnson Foundation/Whittier Trust. “They are an ideal partner for this project given PRIDE’s Industries’ record in creating innovative recruitment and training programs that help build an inclusive and diverse workforce.”

About PRIDE Industries

PRIDE Industries delivers business excellence with a positive social impact. A social enterprise, we provide facilities operations and maintenance services, custodial services, contract manufacturing, supply chain management, packaging and fulfillment services, and staffing and recruitment services to private and public organizations nationwide. Founded in 1966, PRIDE Industries’ mission is to create employment for people with disabilities. Through personalized employment services, we help individuals realize their true potential and lead more independent lives. PRIDE Industries proves the value of its inclusive workforce model through operational success across multiple industries every day. Learn more at https://PRIDEIndustries.com.

SANTA ANA, CA — Ducommun Incorporated (NYSE: DCO), a global supplier of innovative electronic and structural products and solutions for the aerospace and defense industry, is proud to announce the grand re-opening of its new Guaymas, Mexico facility. A ribbon-cutting ceremony was held on Oct 13, 2022, which was attended by valued employees and legacy customers, including The Boeing Company and Middle River Aerostructure Systems, a division of ST Engineering North America, the U.S. affiliate of Singapore-based ST Engineering.

The re-opening included the celebration of a newly built 70,000 sq. ft. facility along with an additional 45,000 sq. ft. building, both to support production of Ducommun’s VersaCore Composite™ technology, composite/metal bond flight controls, electronic wire harnesses and aerostructures manufacturing.

“I’m quite impressed with what I see today and excited about the opportunities to continue and expand our partnership with Ducommun,” said Richard Wehmer, general manager and senior vice president of Middle River Aerostructure Systems.

Ducommun’s expanded operations in Mexico will allow the company to continue its successful legacy of providing the highest level of product and process quality, while delivering maximum competitive value to its OEM customers.

“I’m excited about the re-opening and also expansion of our operation in Mexico. This will be a high leverage point to further enable revenue and earnings growth by providing the highest value and quality products to the Aerospace and Defense industry,” said Stephen G. Oswald, Ducommun’s chairman, president and chief executive officer.

About Ducommun Incorporated

Ducommun Incorporated delivers value-added, innovative manufacturing solutions to customers in the aerospace, defense and industrial markets. Founded in 1849, the company specializes in two core areas – Electronic Systems and Structural Solutions – to produce complex products and components for commercial aircraft platforms, mission-critical military and space programs, and sophisticated industrial applications. For more information, visit Ducommun.com.

WATERBURY, CT — MacDermid Alpha Electronics Solutions, the leading global supplier of integrated circuit, assembly and semiconductor solutions for the electronics design and manufacturing industries, will be highlighting their unrivalled capabilities as a total process solutions provider at this year’s Productronica South China, which takes place at the Shenzhen World Exhibition and Convention Center, Nov. 15-17, on the MacDermid Alpha Stand E17 in Hall 11.

MacDermid Alpha encompasses a full spectrum of industry leading innovative technologies from Alpha, Compugraphics, Electrolube, Kester and MacDermid Enthone brands, giving manufacturers a distinct advantage in sourcing all their application-specific needs in one place. MacDermid Alpha has been taking a proactive response where innovation is concerned and identifying key areas in the market, rather than a passive reactive approach. Essentially, MacDermid Alpha, supplies solutions across all aspects of the assembly process from PCB manufacturing, PCB assembly and even reclaim and recycling services.

MacDermid Alpha will showcase its’ latest new low temperature solder material. Designed to mitigate warpage induced defects in temperature sensitive chip-scale packages, the ALPHA OM-565 HRL3 solder paste enhances electrochemical performance over existing low temperature solders and provides excellent compatibility when used in combination with other ALPHA solutions for contact rework applications. 

ALPHA OM-565 HRL3 enables superior wettability to minimize post reflow defects such as Non-Wet-Open (NWO) and Head-in-Pillow (HIP). Next generation devices require a larger footprint and thinner form factor design that deliver superior processing power over existing technologies. These next generation packages create challenges for assembly at traditional SMT reflow temperatures. ALPHA OM- 565 HRL3 enables a reduction in peak reflow down to 175 °C to mitigate common warpage induced defects such as HiP and NWO to improve assembly yields.

Electrolube, the most recent addition to the MacDermid Alpha family of brands is a specialist manufacturer for the electro-chemicals industry. The brand has amassed a wealth of local knowledge and experience pertaining to China’s domestic market since opening facilities in China twenty years ago. The acquisition has proven successful for both MacDermid Alpha and Electrolube, the latter benefitting from an expansion of their Chinese Technical Support team. The brand has also recently launched a new generation of bio-based conformal coatings and encapsulation resins. Electrolube’s new bio-based products build upon their already strong portfolio of solutions. Not only do these new products offer environmental benefits but they also provide high performance protection and increase reliability.

Featured at the show will be a new bio-based polyurethane resins, UR5645, is a tough, two-part encapsulation system ideal for a wide range of applications including automotive and marine. UR5645 is a highly versatile resin with an operating temperature range of -50 to +150 o C and is a low viscosity resin that enables a faster and more efficient potting process. It also provides excellent chemical resistance to acids, alkalis and fuels, ideally suited for the harshest conditions, such as those found in automotive applications. 

Electrolube additionally offer a wide range of conformal coatings and thermal management materials. UVCL is a low viscosity coating with the capacity to cure within seconds of exposure to the correct dosage of UV light. UVCL is one of Electrolube’s next generation of VOC-free coatings, and the product’s low viscosity ensures that it is eminently suitable for selective spray equipment. The secondary moisture cure ensures even shadowed areas can be cured successfully.

Electrolube’s GF400 is an extremely versatile gap filling material, suitable for a wide variety of applications, including e-vehicles and chargers. This two-part silicone-based filling material cures at room temperature but the cure can also be accelerated by heat. An impressive thermal conductivity of 4.0 W/m.K is a feature of this gap filler and following cure, a low modulus elastomer avoids pump out phenomenon.

 

MacDermid Alpha’s vast interconnection of specialty electronics solutions ensures that manufacturers can access all areas of the electronics supply chain in one place. Visitors to Productronica South China are welcome to visit the team on Stand E17 in Hall 11 and talk to our technical experts on their application requirements.

Allen Chen, General Manager China, comments, “We are looking forward to attending the Productronica South China exhibition as a group of aligned brands offering cutting edge solutions for manufacturers. MacDermid Alpha has gone from strength to strength in recent years, developing product innovations that really meet the demands of our customers. Our investments and international collaboration with leading OEMs have enabled us to firmly position ourselves in the market as a reliable and trusted ‘one- stop’ provider at every stage of design and production.”

MacDermid Alpha Electronics Solutions serves all global regions and all steps of device manufacturing within every segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate with OEMs and fabricators in the implementation of new technologies that redefine what is possible in device design. Our world class technical service is constantly at hand to ensure optimized outcomes in yield and productivity. Our solutions can increase throughput, reduce carbon footprints, lower total cost of ownership, and enable electronics innovation.

For further information, http://www.electrolube.com.

About MacDermid Alpha Electronics Solutions

MacDermid Alpha Electronics Solutions enables electronics interconnection through the innovative specialty chemicals and materials from our Alpha, Compugraphics, Electrolube, Kester, and MacDermid Enthone brands. We serve all global regions and all steps of device manufacturing within every segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate with OEMs and fabricators in the implementation of new technologies that redefine what is possible in device design. Our world class technical service is constantly at hand to ensure optimized outcomes in yield and productivity. Our solutions can increase throughput, reduce carbon footprints, lower total cost of ownership, and enable electronics innovation.

HELSINKI — Incap Electronics Estonia was named The Foreign Investor of The Year at the Estonian Business and Innovation Agency (EAS) and the Confederation of Estonian Employers Annual Entrepreneurship Awards Ceremony. An Entrepreneurship Award is the highest national recognition for businesses in Estonia.

Greg Grace, Managing Director of Incap Electronics Estonia, stated that the company appreciates the acknowledgment. “We are honoured to be recognised with the award and thank the judging panel. Despite a challenging global business environment and supply chain challenges, we have performed well and are upgrading our production facilities to respond to the growing market demand. I would like to thank our partners and the amazing team at Incap Estonia. We wouldn’t have succeeded without you,” he added.

Chairman of the jury and head of the joint institution of EAS and KredEx, Lauri Lugna, commented that one of the reasons why Incap won the foreign investor category was that the company is a leader and advocate of the entire sector. "Incap has made considerable investments in Estonia over the years and also continuously invested in young talents, in the development of the region and in innovation, green and digital revolution," said Lugna.

Kristi Tiivas, Chairman of The Supervisory Board at EAS added: “This company is clearly looking into the future, but soon also to the Moon. Their priority is to contribute to green technology, for example they have a role in the production of light electric vehicles and solar cars. Besides all this, they contribute significantly to the local community as well as to the generation of young capable professionals.”

Organised by the Estonian Business and Innovation Agency and the Confederation of Estonian Employers, the entrepreneurship competition with the longest history in Estonia took place for the 27th time this year. The competition recognised Estonian companies that, despite challenges, have achieved success through ingenuity and consistent work. The Foreign Investors category specifically recognises enterprises that have shares held by international investors, are active in Estonia, and have made an important investment in the last three years.

The Entrepreneurship Award followed a two-phase application process. In the first phase, candidates submitted their financial data and arguments for winning their selected category. After the first phase, a TOP 10 ranking was drawn up and visitations were arranged with the selected enterprises to specify their accomplishments according to the statute. On this basis, three nominees in each category were shortlisted and submitted to the Entrepreneurship Awards 2022 jury to select the winner of each category.

For more information about the Entrepreneurship Award, please visit https://eas.ee/ettevotluseauhind/en/

Photos of Greg Grace, Managing Director of Incap Estonia: https://photos.app.goo.gl/7h6P3vkjzpxdXZtu8

Photos of Incap Estonia factory: https://photos.app.goo.gl/As4ywa69uGUydux68

INCAP CORPORATION

For additional information, please contact:

Greg Grace, Managing Director of Incap Electronics Estonia, tel. +372 516364

Mr Otto Pukk, President and CEO of Incap Corporation, tel. +372 508 0798

INCAP IN BRIEF

Incap Corporation is a trusted partner and full-service provider in Electronics Manufacturing Services. As a global EMS company, Incap supports customers ranging from large multinationals and mid-sized companies to small start-ups in their complete manufacturing value chain. Incap offers state-of-the-art technology backed up by an entrepreneurial culture and highly qualified personnel. The company has operations in Finland, Estonia, India, Slovakia, the UK, and Hong Kong and employs approximately 2,500 people. Incap’s share has been listed on the Nasdaq Helsinki Ltd stock exchange since 1997.

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