FREMONT, CA — VVDN Technologies, a global provider of engineering, and digital services and solutions, today announced it has entered into a multi-year global strategic partnership with Google Cloud. The partnership will help customers accelerate app modernization and cloud transformation. VVDN will also develop the next generation of innovative solutions, namely IoT and Video Cloud Platform, and a NextGen Enterprise Private 5G Cloud, etc., through this new partnership with Google Cloud.

Through this partnership, VVDN’s enterprise customers will gain greater financial flexibility, and the ability to accelerate their cloud migrations and modernize their enterprise applications on Google Cloud. Once on Google Cloud, customers will be able to immediately begin creating hybrid applications that enable businesses to be more agile, with more secure access to Google Cloud services like BigQuery and Cloud Operations, and extend their existing disaster recovery, backup, and storage services.

Furthermore, VVDN and Google Cloud are setting up a joint CoE to work on IOT, Video Cloud, and Enterprise Private 5G Cloud.

In the IoT and Video Cloud space, VVDN is developing a SaaS-based Device Agnostic IoT Cloud solution with Google Cloud for onboarding smart devices, cameras, and more. The solution is based on a scalable and secure architecture that can be delivered for multiple applications and serve a variety of use cases. Building blocks are engineered to accelerate deployment for multiple industries including IoT, Security and Surveillance, Automotive, Networking and Wireless, and more.

As part of a wider 5G strategy, VVDN aims to bring its respective 5G expertise and become an end-to-end Enterprise Private 5G provider with Google Cloud. VVDN 5G Cloud services include: end-to-end service orchestration, VNF optimization, CI/CD and automation, network performance testing, Automation framework development, and application development (i.e Network Management System).

Vivek Bansal, President Engineering, VVDN Technologies: “We are really excited about our newly announced partnership with Google Cloud. This partnership will act as a catalyst for VVDN’s growth and will enable us to scale our customers with the help of Google Cloud’s infrastructure. This joint CoE between VVDN Technologies and Google Cloud will allow us to innovate and build advanced technologies which will be a key driver in our growth. Through this partnership, we aim to develop solutions for IoT, Video, and 5G Cloud Platforms which are in demand.”

“Enterprises around the world are realizing the benefits of adopting cloud technologies in the IOT and private 5G space." said Majed Al Amine, Head of 5G & Edge Telecom Industry Solutions, Google Cloud. "We’re proud to support VVDN's commitment to innovation and are excited to move forward in our journey together."

MINNEAPOLIS, MN – SMTA is pleased to announce Emily Williams, Lorain County Community College, has been selected as the recipient of the 2022 JoAnn Stromberg Student Leader Scholarship.

The SMTA Awards Committee selected Emily for her committed leadership in the SMTA. Emily is currently enrolled in the Micro Electromechanical Systems (MEMS) program at Lorain County Community College. She holds the Student Leader role for the SMTA Ohio Valley Chapter, serving as an advocate for local college students. Upon completion of her studies, Emily would like to work as a professional researcher at the NASA Glenn Research Center in Cleveland, Ohio, where she could contribute towards the advancement of technology in various fields of research.

The $3000 JoAnn Stromberg Student Leadership Scholarship, given in honor of the nearly 30 years of service dedicated by former Executive Administrator, JoAnn Stromberg, was established following her retirement in 2015. The purpose of this scholarship is to encourage students to take on more leadership opportunities and strengthen the connection between students and the electronics industry.

The Stromberg Scholarship is awarded annually to a student pursuing a degree in electronics and actively involved in the SMTA. The scholarship is intended for the purchase of technical books and research materials, for participation in conferences related to electronics assembly and packaging, and for living expenses if necessary.

The award will be presented in person at the 2022 SMTA International Conference, October 31 - November 3, 2022 in Minneapolis, MN.

The nomination period will be available early next year for 2023 candidates. Consider making a donation to the scholarship by visiting https://www.smta.org/scholarship/.

Please contact Saniya Pilgaonkar, scholarship@smta.org or +1-952-920-7682, with questions.

SMTA – A Global Association Working at a Local Level

SMTA is an international network of professionals who build skills, share practical experience and develop solutions in Electronics Manufacturing (EM), including microsystems, emerging technologies, and related business operations.

NASHVILLE — KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, is pleased to announce that the SMTA has honored Sherry Stepp, Global Marketing Manager, with a 2022 Members of Distinction Award. Stepp was chosen for an Excellence in Leadership Award. Recipients of the Members of Distinction awards are selected for showing exceptional dedication to the association and the electronics manufacturing industry.

The Excellence in Leadership Award honors strong leaders who continue to support and elevate the association. Stepp has been an advocate for the SMTA on a national, international, and most recently at the local level.

Since she joined SMTA in 2009, Stepp has been an important voice with the Marcom Committee, the Women’s Leadership Program and the Expos Committee. Since 2020 she took on leadership roles with her local Huntsville chapter, first as President and most recently as VP of Membership.

SMTA is an international network of professionals who build skills, share practical experience and develop solutions in Electronics Manufacturing (EM), including microsystems, emerging technologies, and related business operations. The association has recognized exceptional individual and corporate members for their immeasurable contributions to the association since 1994.

As KYZEN’s Global Marketing Manager, Stepp has been with the company for more than 25 years. KYZEN connects leading science with care to create the most effective cleaning solutions for each customer’s unique manufacturing process or problem. For more information about KYZEN, or to ask specific technical cleaning questions, visit www.kyzen.com.

About KYZEN

KYZEN is a global leader in providing environmentally responsible, RoHS compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Since its founding in 1990, KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards. For more information, visit www.kyzen.com.

Indium Corporation Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, will be part of a panel presentation at the International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) conference in Taipei, Taiwan on Oct. 27. The presentation will cover the findings from a technical paper titled The Effects of Voids on Solder Joint Reliability in First Level Interconnect.

First level interconnect (FLI), e.g., flip-chip attach on substrate or wafer, using solder as the interconnect material, is employed extensively in advanced packaging assembly. During the flip-chip die-attach process, some voids are often formed in the solder joints. In the past, this may not have been seen as a major issue since the voiding percentage is typically less than 10%; however, as miniaturization continues, the solder joint of FLI is becoming smaller (<100µm bump or Cu pillar size) with tighter pitch and higher density, there is an increasing concern with how the micro voids in the solder joint will affect the package’s long-term reliability even though the void percentage is not excessive. This paper will describe the details of the different test conditions, and discuss observations from the failure analysis done with cross-sections and electron backscatter diffraction (EBSD) analysis.

As Senior Global Product Manager for Semiconductor and Advanced Materials, Lim works closely with R&D and manufacturing, and engages with the world’s leading semiconductor companies and contract manufacturers. She is a task force member of the International Electronics Manufacturing Initiative (iNEMI) Packaging Technology Integration Group and has co-chaired a number of industry projects and road-mapping initiatives over the past five years. She is also on the executive committee of the Institute of Electrical and Electronics Engineers (IEEE) Packaging Society, Malaysia Chapter. Lim is a part of the organizing committee for the International Electronics Manufacturing Technology (IEMT). She has authored a number of technical papers and presented regularly in various international technical conferences. She holds a bachelor’s degree from the National University of Singapore, where she majored in industrial chemistry with a focus in polymers. She is a Certified SMT Process Engineer and has earned her Six Sigma Green Belt designation.

About Indium Corporation

Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.