Press Releases
SAN JOSE, CA – Green Circuits, Inc., a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, is pleased to announce the appointment of Richard Dutton, MBA to Chief Financial Officer. A senior finance executive, Dutton brings multi-industry experience with companies ranging from $90 million to $2.5 billion USD.
In his previous role as VP of Finance for a major manufacturer in the durable goods industry, Dutton led his division to $28M+ EBITDA improvements through operational initiatives, contract renegotiations, facility consolidations and SKU/customer rationalizations. He has experience working in fast-paced environments, managing multiple priorities under tight deadlines.
He has cross-functional experience working with sales, marketing, R&D, operations, supply chain, finance, IT and HR. Dutton has more than 15 years of expertise in Strategic Leadership, Budgeting & Forecasting, P&L Management, Operational Experience, Capital Investment Strategy & Planning, Business Process Improvement, Cross-Functional Team Leadership, Financial Modeling & Analysis, Strategic Planning and Management Reporting.
Green Circuits provides high-quality design, prototyping and full-scale production services for all types of printed circuit boards and complex systems. For more information, visit www.greencircuits.com
REDDITCH, UK – To ensure quality and efficiency are implemented at all times and compete as a best-in-class CEM, Garner Osborne Circuits liaised with capital equipment supplier and service provider Altus to further enhance their inspection processes through 3D AOI technology.
False calls and escapes are unavoidable when using 2D inspection techniques. When manufacturing complex miniaturised PCBs, this assessment method cannot meet the high standards critical to the success and performance of modern electronic devices. Identifying defects early in assembly and having data to support process improvement decisions is vital to ensure quality. Therefore, moving away from 2D inspection methods to 3D AOI technology is crucial.
To take their inspections processes to a new level Altus introduced Garner Osborne to Koh Young Zenith Alpha HS+, the foremost true 3D AOI solution powered by AI enhanced high speed 3D measurement capabilities. The system incorporates KSMART technology which revolutionises data collection and analysis, and improves PCB process optimisation.
Steve Honeybun, CEM Operations Director, Garner Osborne, said: "Garner Osborne has always had a philosophy of continuous improvement to consistently perform at the top end of electronic production services. Moving to a 3D light metrology process with Koh Young, who is widely regarded as the best inspection provider in the market, is a great reflection of that.
"We have worked with Altus for several years, and extending our partnership further, given the support they have always given us, made the decision easier. As a result, we now have fully 3D SPI and AOI to support improving our production yields, and we are delighted to get the unit up and running."
KSMART analysis collects all inspection and measurement data and helps advanced inspection systems evolve from “Pass/Fail” tools into highly intuitive, dynamic decision-making systems. Adept equipment supplies can then apply the data set to proprietary AI engines for continuous performance improvement. KSMART ensures the highest levels of transparency by showing all conditions of the lines, while providing the required documentation for changes to each job for traceability.
Anthony Oh, Altus Technical Applications Manager: "This has been an excellent project for Altus, and we especially enjoy working with the team at Garner Osborne. Of course, we take each project as a standalone in its own right, and their team tested us, given that by upgrading to Koh Young, they moved away from an already trusted partner. I am pleased that we demonstrated our claims of providing the lowest levels of false calls available and showing the value of fully 3D light measurement data collection to improve yield. This aspect is where CEM customers can unlock value in their production environment and for their customers."
To find out more visit www.altusgroup.co.uk
NASHVILLE – KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at RAPID + TCT 2023, scheduled to take place May 2-4, 2023, in Chicago, IL. The KYZEN clean team will discuss their safe and effective water and solvent based solutions for sensitive 3D parts at Booth #4153.
KYZEN will focus on their two 3D Printing Process Resin Cleaners at the expo: KYZEN 3D5420 is a water-based aqueous cleaning solution proven efficient in removing a variety of uncured resins and contaminants from Stereolithography (SLA) 3D printed parts. Used for post-process cleaning, 3D5420 offers an operator safe and environmentally friendly alternative to IPA and TPM solvent cleaning processes. KYZEN 3D5420 provides a cost effective and free rinsing solution.
KYZEN 3D5701 is a cost-effective drop-in replacement for Tripropylene glycol monomethyl ether (TPM) in solvent parts washing systems. 3D5701 will remove resins and contaminants from molds and Stereolithography (SLA) 3D printed parts. KYZEN 3D5701 has proven effective with many standard UV cured resins used in 3D printing processes.
For more information, visit www.kyzen.com
FELDKIRCHEN, GERMANY – Pemtron Europe, an inspection equipment developer and supplier, will exhibit at SMTconnect, scheduled to take place May 9-11, 2023 in Nuremberg, Germany. See the invisible world in Hall 4, Stand 331 – Pemtron develops the best inspection equipment with the world’s best technology. Systems on display include the Saturn 3D Inline Solder Paste Inspection System, Athena 3D Automated Optical Inspection System, TWIN 3D Automated Optical Inspection System and TROI 8800 CI Series Conformal Coating Inspection System.
Pemtron’s Saturn 3D Inline Solder Paste Inspection (SPI) System features Moiré technology, combining 2D color images with 3D measurement data. The result is more accurate and realistic 3D inspection images unlike conventional methods that display the solder paste through a color map only. With quad projection, 10/15 or 18um resolution a 4MP camera (optional 10MP) and three-stage conveyor (rail extensions optional), the Saturn is the most advanced 3D SPI system.
The Athena 3D Automated Optical Inspection (AOI) System uses 12-way projection for 3D measurements on all models to minimize errors due to shadow effects, and performs 100 percent of 2D & 3D inspection concurrently in all FOV areas. This significantly reduces false calls while providing near-perfect detection. The system offers 10/15 or 18um resolution, a 10MP camera (optional 12MP) and a three-stage conveyor.
Also on the AOI side, Pemtron will showcase the TWIN 3D AOI system for top/bottom double- sided simultaneous inspection. Pemtron’s new head type has been upgraded for 3D formation that is identical to the real image and is more stable.
Pemtron’s TROI 8800 CI Series Conformal Coating Inspection System with optional inline Coating Thickness Measure provides the most reliable conformal coating inspection. With simple programming, the machine can inspect defects like cracks, coating voids, wrong coating thickness (too-thin or too-thick).
For more information about Pemtron’s technology, meet with company representatives at SMTconnect or visit https://pemtron.com/
Learn about KIC’s Heat to Data TM Solutions at SMTconnect – Machine Tracking and Automatic Profiling
SAN DIEGO – KIC will exhibit in Hall 4, Booth #126 at SMTconnect, scheduled to take May 9-11, 2023, in Nuremburg, German. KIC provides the most accurate Heat to Data™ solutions including its award-winning support with onsite service and application knowledge from the thermal process experts.
KIC provides Heat to Data™ Solutions for all electronics assembly and semiconductor packaging Thermal Processes. Its solutions cover Machine Performance Tracking with Heat Transfer Index TM - automated NPI recipe setup - Thermal Profile Optimization – Automation for Traceable Audit Data with Automatic Profiling and Profile Inspection. KIC is the inventor of automatic profiling and real-time process inspection with RPI and WPI for reflow/cure/wave. The company continues to innovate with a complete ecosystem of solutions for its customers’ manufacturing requirements.
Machine Performance Tracking
- Smart Reflow Analyzer - detecting oven performance to make maintenance more effective and precise. Easily identify changes: heat transfer with HTITM, temperature, and speed.
- Wave Surfer – Track preheat peak temperatures and ramp rates, and peak temperature and dwell time through the wave.
Profile Setup, Optimization, and Verification
- SPS Smart Profiler with AutoFocus TM and Navigator TM automated NPI oven setup and optimization tools. Used across all factory floor thermal processes (soldering, curing, rework, etc.)
Automation and Inspection
- An infinite number of automation possibilities across five different platforms for a customized solution specifically for your requirements. Something for every budget and every requirement.
- The most options available – always the most accurate and independent monitoring solutions.
- From simple automatic profiling to fully integrated real-time profile inspection traceability and process control, and everything in between.
- Always with our award-winning onsite service and application support in every region worldwide, with the experience and knowledge from the thermal process experts, KIC.
KIC’s has 45+ years of experience in automated process data collection and analysis and a worldwide network of KIC service and application support in the field in every region. With more than 28,000 systems in the field KIC offers the most reliable, accurate, and innovative solutions for electronics manufacturing challenges. Experts in turning Heat to Data TM . For more information: www.kicthermal.com
OXFORD, CT – MIRTEC, ‘The Global Leader in Inspection Technology,’ will premier its complete line of 3D AOI and SPI Inspection Systems at SMTconnect, scheduled to take place May 9-11, 2023 in Nuremberg, Germany. The company will showcase a total of five (5) Inspection Systems specifically designed to address the full spectrum of inspection requirements associated with the electronics manufacturing industry in Hall 4A, Stand 128.
MIRTEC’s Award-Winning MV-6 OMNI 3D AOI Series features its exclusive OMNI-VISION ® 3D Inspection Technology which combines either a 15MP or 25MP CoaXPress Camera with MIRTEC’s revolutionary 12 Projection BLUE Moiré 3D Technology in a cost-effective platform. MIRTEC’s proprietary Ultra-High resolution CoaXPress Vision System is designed and manufactured by MIRTEC for use with its complete product range of 3D inspection systems. MIRTEC’s 12 Projection Digital BLUE Moiré Technology provides true 3D inspection to yield precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured MIRTEC’s MV-6 OMNI machines feature four 10MP or 18MP Side-View Cameras in addition to the Top-Down Camera, a Multi-Focus Programmable Z-Axis System, an Internal PCB Flipper Conveyor, and Multi-Function AOI/SPI Fusion Technology.
MIRTEC’s Award-Winning MV-3 OMNI Desktop 3D AOI Series features the same hardware and software as MIRTEC’s in-line OMNI-VISION ® 3D Inspection Systems providing 100% compatibility across the company’s entire 3D AOI product line. These systems feature exclusive OMNI- VISION ® 3D Inspection Technology which combines either a 15MP or 25MP CoaXPress Camera with MIRTEC’s revolutionary 12 Projection BLUE Moiré 3D Technology in a cost-effective platform. MIRTEC’s proprietary Ultra-High resolution CoaXPress Vision System is designed and manufactured by MIRTEC for use with its complete product range of 3D inspection systems. MIRTEC’s 12 Projection Digital BLUE Moiré Technology provides true 3D inspection to yield precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured MIRTEC’s MV-3 OMNI machines feature four 10MP or 18MP Side-View Cameras in addition to the Top-Down Camera, a Multi-Focus Programmable Z-Axis System and Multi-Function AOI/SPI Fusion Technology. Without question, the MV-3 OMNI is the most Technologically Advanced Desktop 3D AOI machine.
AI Powered Smart Factory Automation Solution
MIRTEC’s Smart Factory Automation solution, ‘INTELLI- PRO’, is an AI based Software Suite specifically designed for the purpose of improving the performance and convenience of MIRTEC’s complete line of AOI machines. INTELLI-PRO consists of a proprietary Deep Learning based Automatic Part Search and Teaching function, and AI based; Automatic Parameter Optimization, Character Recognition (OCR), Foreign Object Detection (FOD), Placement Inspection Algorithms and an Automatic Defect Type Classification function.
MIRTEC’s Award-Winning MS-11e 3D SPI Series features exclusive 15MP or 25MP CoaXPress Camera Technology, providing enhanced image quality, superior accuracy, and incredibly fast inspection rates. The MS-11e 3D SPI is also available with a cost-effective 4MP Camera Link option. These machines use Dual Projection Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste depositions on PCBs post screen print for insufficient/excessive solder, shape deformity, shift of deposition and bridging. All MIRTEC 3D SPI machines are CFX complaint and feature upstream and downstream Closed Loop Feedback.
MIRTEC’s Award-Winning GENESYS-PIN Hybrid 3D AOI Series is specifically developed for the Automotive Electronics Market. This extraordinary system is configured with a 12 Megapixel CoaXPress High-speed Camera System, a 15um Precision Telecentric Lens, an advanced nine (9) Phase RGB Color Lighting System, a Programmable Multi-Focus Z-Axis System, and four (4) Programmable Multi-Pattern Digital Projectors which are an integral part of MIRTEC’s proprietary Hybrid 3D Measurement Technology. With this revolutionary optical system, the GENESYS- PIN machine can measure up to 50mm tall connector pins with extreme accuracy. The GENESYS-PIN machine detects defects such as missing pins, pin offset as well as measurement of distance between pins and inner/outer dimensions of forked pins.
New to SMTconnect 2023, MIRTEC will be displaying the GENESYS-CC AI Based Conformal Coating AOI Series. These revolutionary systems are configured with MIRTEC’s Exclusive 15MP CoaxPress Camera Technology, four 18MP Side-Angle Cameras and an optional Internal PCB Flipper Conveyor for Double Sided PCB Inspection. The GENESYS-CC machine inspects for Presence/Absence of Conformal Coating, AI Based Bubble Inspection and Lateral Side Component CC Inspection using the 18MP Side Cameras. The system is also fully capable of standard PCB inspection, providing maximum flexibility to the Electronics Manufacturing Environment.
MIRTEC is Leading the Way to Industry 4.0
MIRTEC’s Total Remote Management System (TRMS) is a fully integrated Industry 4.0 Solution which combines remote management with real-time data monitoring and analysis for each system within the SMT production line. MIRTEC’s TRMS provides real-time remote monitoring of status information and statistical data such as equipment operation status, production yield, PC resources, temperature, humidity, etc. The combination of MIRTEC’s 3D Inspection Systems and TRMS provide a vast improvement in production process management. The TRMS Module is a key part of MIRTEC’s Intelligent Factory Automation System, INTELLISYS ® . This powerful software suite was designed and developed by MIRTEC to provide manufacturers with a clear view into the manufacturing process, thereby helping them achieve higher operating efficiencies and improved quality.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing