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Irvine, California, USA - TopLine® Corporation will exhibit its latest technology solutions at Electronica in Munich, Germany, November 15 – 18, 2022, in Booth B4-332. The exhibit will include leading TopLine products including CCGA Solder Columns, IC Bonding Wire, Zero Ohm Jumpers, IC JEDEC Trays, and more. TopLine manufactures a wide range of solder columns for CCGA semiconductor packages, and provides Daisy Chain CCGA packages for engineering development, profiling, and practice. For more information, visit Booth B4-332 at Electronica.

TopLine recently announced the availability of new low-void CCGA solder columns, developed by TopLine engineers using new proprietary processes. The absence of voids in the column's high temperature core makes the columns structurally stronger and more reliable.

About TopLine

TopLine manufactures a wide range of solder columns for CCGA semiconductor packages, and provides Daisy Chain CCGA packages for engineering development, profiling and practice. TopLine products provide hands-on learning for engineers. To learn more, visit www.CCGA.tv or call (1+) 800 – 776-9888.

CalcuQuote, a supply chain solutions partner for the electronics industry, is pleased to announce an integration with WireMasters, a trusted source for Mil-Spec wire, cable, connectors, and harness management products.

“We’re excited to work with WireMasters,” says CalcuQuote Vice President of Growth Dustin Carlson. “Through this integration, CalcuQuote customers have increased access to meet their wire, cable, connector, and harness management needs. Additionally, this integration can be set up quickly and allows access to customer-specific pricing.”

Wiremasters is pleased to join forces with CalcuQuote and to support supply chain solutions for their mutual customers. As a global leader providing everything in your harness, WireMasters is always looking for ways to support and serve its thousands of customers and is looking forward to doing just that through this partnership.

CalcuQuote works with more than 200 electronics companies to solve complex problems with industry-leading solutions. WireMasters’ integration with CalcuQuote solutions will allow for seamless sourcing decisions in the future.

To learn more about CalcuQuote, visit www.calcuquote.com.

About WireMasters

With locations across the globe and 24/7 eCommerce capabilities, WireMasters is your trusted source for wire and cable, connectors and accessories, harness management products, and value-added services. WireMasters' mission and vision is, "To serve with integrity—our customers, teammates, families, and communities while being the premier partner in connecting the world's most extraordinary systems and platforms, powered by our people, products, and passion for service."

About CalcuQuote

CalcuQuote provides quoting and supply chain software for the electronics industry. With a focus on the future, CalcuQuote improves the speed, accuracy and efficiency of the quoting and supply chain process by optimizing operations and implementing sustainable digital solutions. Founded in 2014, CalcuQuote currently serves over 200 EMS companies and has a global customer base.

The Occam Process reverses traditional component assembly removing its greatest vulnerability

EL DORADO HILLS, CALIFORNIA --A Game-changing component assembly methodology will transform product confidence in the harshest environments.

Most electronic manufacturing defects are related to the soldering process and most field failures occur as a result of solder weaknesses such as fatigue due to shock and vibration and/or repeated thermal excursions in operations or rework.

The Occam Process is a game-changing solderless assembly technology that reorders the way electronic components are assembled, greatly improving reliability and performance, while significantly reducing product size and cost. With Occam, solder related failures are eliminated because solder itself is eliminated. The Occam approach bypasses the weakest link, inherently driving up product reliability while opening the door to a host of new capabilities and benefits for product designers.

Occam inventor Joe Fjelstad commented: “Occam isn’t just a new process but a reordering of current methods. It is an enabling technology allowing the industry to move toward a future where higher reliability, lower costs and less environmental impact are the norm. Occam will transform the industry into something substantially simpler and better.”

To learn more about The Occam Process download the ebook, SAFE, Solderless Assembly for Electronics

For more information on how to join the Occam revolution, visit the Occam website: theoccamgroup.com or contact managing partner, Ray Rasmussen at: ray@theoccamgroup.com, 916-337-4402

About The Occam Group

This group’s sole purpose is to find committed partners desiring to adopt and integrate the Occam Process into their businesses. The Occam team is composed of three seasoned electronics industry veterans from the US and Germany: Joe Fjelstad, Ray Rasmussen and Silvio Bertling. Collectively they have over a century of relevant experience.

Joe Fjelstad is the inventor of the Occam Process and has been active in electronics manufacturing since 1972 in various roles, including chemist, process engineer, and R&D manager. He holds nearly 190 U.S. Patents and numerous foreign ones. One of his patents for a low profile bottom leaded IC package presaged the QFN and is today cited in more than 550 other patents. He is an internationally recognized book and column author, electronics interconnection technology expert, inventor and lecturer in the field of interconnection technology and is as well a veteran of several startup companies beyond Verdant Electronics, including: Beta Phase, ELF Technologies, MetaRAM, Silicon Pipe, , Tessera (now the public company, Xperi where he was the first appointed company fellow.

Ray Rasmussen is a widely respected veteran PCB industry watcher, reporter and analyst and trusted source and sounding board for numerous industry executives. He was co-founder, editor and publisher of CircuiTree magazine, publisher of SMT Magazine and iConnect007.

Silvio Berling is a seasoned, innovative and accomplished electronics engineer with over 30 years of experience in the field specializing in printed circuit board materials, leading teams for major materials suppliers in the U.S. and Europe. T

he Occam Process, is aptly named in honor of 14th Century English Philosopher William of Occam, who taught his followers, “It is vanity to do with more, that which could be done with less,” an idea which was inspirational to the process as conceived.

Contact us at: The Occam Group

Media contact: ray@theoccamgroup.com

Kitron has entered into a long-term production agreement with an expected value of NOK 750 million with Kongsberg Defense & Aerospace AS for electronic modules that are part of KONGSBERG’s remote weapon station system (RWS).

“This is a significant agreement for Kitron. It both extends and expands our strong collaboration with KONGSBERG,” says Peter Nilsson, CEO of Kitron.

On Monday, 31 October, KONGSBERG announced a new 5-year framework agreement with the U.S. Army for its version of the Common Remotely Operated Weapon Station (CROWS).

For Kitron's production facilities in the USA and Norway, the CROWS program is expected to generate annual revenues of NOK 150 million over the next five years. The volume will depend on demand and the annual budget process in the US and may therefore be either lower or higher.

In total, KONGSBERG has delivered more than 18,000 weapon station systems across all defence branches to the US military. The system is intended to provide protection and a better decision-making basis for soldiers or operators.

For further information, please contact:

Peter Nilsson, President and CEO, tel. +47 948 40 850

Hans Petter Thomassen, Managing director, Kitron Norway, tel.: 47 913 92 360

E-mail: investorrelations@kitron.com

Kitron is a leading Scandinavian electronics manufacturing services company for the Connectivity, Electrification, Industry, Medical devices and Defence/Aerospace sectors. The group is located in Norway, Sweden, Denmark, Lithuania, Germany, Poland, the Czech Republic, India, China and the United States. Included the acquisition of BB Electronics in January 2022, Kitron has about 2 800 employees, and pro forma revenues were about NOK 5 billion in 2021.

FOUNTAIN INN, SC – KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, is introducing a new global MLCC part numbering system this November.

The new global MLCC part numbering system will maximize manufacturing synergies within KYOCERA AVX and the KYOCERA Electronics Components Group, which combined their MLCC manufacturing and development resources in 2021 following the corporate reorganization and rebranding that elicited KYOCERA AVX. It will also facilitate the rapid expansion of the MLCC business unit and make it easier for customers to perform product searches across the entire KYOCERA AVX brand portfolio.

“The new MLCC part numbering system will be introduced this November, starting with new product releases. Our goal is to make it the universally preferred ordering code for all KYOCERA AVX MLCC products while providing customers with adequate time to familiarize themselves with the new part numbers,” said Neil Smyth, Marketing Director, KYOCERA AVX. “We’re excited about this important milestone of our MLCC product line integration. Also, I’d like to emphasize that all of the KYOCERA AVX MLCCs that employ the new part numbering system will continue to be produced with the same trusted materials, designs, and processes and exhibit the same physical and electrical characteristics.”

For more information about KYOCERA’s new global MLCC part numbering system, including cross references to current part numbers, please visit https://search.kyocera-avx.com/ and https://ele.kyocera.com/en/product/capacitor/mlcc/. For more information about KYOCERA AVX, please visit https://www.kyocera-avx.com/, email inquiry@kyocera-avx.com, follow them on LinkedIn, Twitter, and Instagram, like them on Facebook, call 864-967-2150, or write to One AVX Boulevard, Fountain Inn, S.C. 29644.

CLINTON, NY — Indium Corporation’s expertise and proven products were featured at NSW Automation’s launch of its N4 Full-Range Solder Paste Micro-Dispenser during a special event in Penang, Malaysia.

Indium Corporation’s proven solder paste for jetting and microdispensing applications — Indium12.8HF — was featured in several demonstration machines at the event.

Indium12.8HF is a no-clean, halogen-free solder paste optimized for long-term jetting and microdispense applications. Indium12.8HF has proven to be useful in a wide range of applications requiring precision dot diameter/line width deposits down to 80μm, consistently achievable with NSW’s equipment.

Additionally, Indium12.8HF:

  • Meets IPC J-STD-004B with Amendment 1 ROL0 requirements
  • Offers exceptional electrical reliability
  • Minimizes graping and similar reflow issues with a unique flux oxidation barrier formulation
  • Delivers aesthetically pleasing clear residue with minimal flow-out
  • Provides minimal reflow spatter compared to similar solder pastes
  • Long working (syringe) life

Other Indium Corporation products were featured at the event, including the award-winning Durafuse™ LT, a low-temperature alloy technology, and its GalliTHERM™ portfolio of gallium-based liquid metal solutions, a new thermal interface materials (TIMs) product line that can be applied with jetting and microdispensing equipment for mass production.

Additionally, Associate Director for Global Technical Service & Application Engineering Jonas Sjoberg shared his technical expertise and insight on the importance of design for excellence and collaboration.

To learn more about Indium Corporation's jetting and microdispensing pastes, visit www.indium.com/jetting-paste

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