Press Releases
PENANG, MALAYSIA – ViTrox Technologies is excited to announce that our V310i Advanced 3D Solder Paste Inspection (SPI) Solution has officially passed the rigorous qualification audit for IPC-CFX-2591 Qualified Products Listing (QPL) and has received the mandatory IPC-CFX messages for classification.
This certification is a significant achievement for ViTrox and showcases the company's commitment to innovation and excellence in the electronics manufacturing industry. The V310i 3D SPI's listing on the IPC-CFX QPL shows that ViTrox's solution is fully compatible with the IPC-CFX-2591 standards, giving electronics manufacturers and Original Equipment Manufacturers (OEMs) the confidence to partner with us.
Our state-of-the-art V310i 3D SPI technology has unique features that set it apart from the competition. Our Artificial Intelligence (A.I.) Missing Detection significantly enhances users' experiences when detecting absent and insufficient solder with the integration of A.I. This feature is incredibly accurate and improves overall efficiency. Our effortless Inspection Parameter Setup allows users to export custom parameters fast for future usage, ensuring compliance with IPC standards. This feature streamlines inspection setups, making them more accessible and user-friendly. Lastly, our Ultra Smart Programming feature is a game-changer, reducing programming time by around 80%. The advanced programming algorithm in the ViTrox SPI Software (VAPIGUI) creates a fast, effortless, and easy-to-pick-up programming process for our users, making the V310i 3D SPI an excellent choice for anyone in the SMT PCBA industry.
Asides from the IPC-CFX standard, ViTrox's Industry 4.0 Manufacturing Intelligence Solution (V- ONE) provides Machine-2-Machine (M2M) connectivity and big data analytical capabilities for users to monitor production performance using real-time production process insights and data analysis with image traceability across ViTrox vision solutions. With V-ONE, manufacturers can have a strategic approach to oversee the production process, minimise production downtime, and improve production efficiency.
We are proud to continue developing innovative solutions with M2M connectivity to match the ever-changing demands of the electronics manufacturing industry, moving further into the era of Smart Manufacturing. Hence, ViTrox is actively collaborating with IPC to validate its PCB SMT Vision Inspection Solutions for the IPC CFX QPL. You can also find our validated solutions, the V510i Advanced 3D Optical Inspection (AOI) Solution and V810i Advanced 3D X-Ray Inspection (AXI) Solution, on the IPC-CFX-2591 QPL Portal at https://certification.connectedfactoryexchange.com/certification-directory
Are you interested in implementing IPC-CFX compliant vision inspection solution to achieve Smart Factory? Contact us today at enquiry@vitrox.com for more information and assistance.
NORTH BILLERICA, MA – BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will exhibit at the SMTA Capital Expo & Tech Forum, scheduled to take place Tuesday, May 23, 2023 at the Johns Hopkins Applied Physics Laboratory Kossiakoff Center. Attendees can learn all about BTU’s reflow ovens, Profile Tracer and the all-new Aurora platform.
“2023 has already been a big year for product development at BTU,” said Bob Bouchard, director of sales and marketing for BTU. “Earlier this year we launched the Profile Tracer and we have just returned from the launch of our new reflow platform, the Aurora, in Germany. I’m looking forward to bringing our customers up to date at the SMTA Expo.”
BTU will feature its new, award-winning Profile Tracer, a next-generation thermal profiling tool providing real-time data acquisition for oven optimization by identifying inconsistencies due to temperature variation at both the product level and at the heat source.
With 6, 8, 10, and 12 zone air or nitrogen models, flexible platform configuration and low nitrogen and power consumption, the PYRAMAX family of convection reflow ovens the industry’s best value. The BTU team also will discuss its newest development – the Aurora platform. Using the combination of newly integrated process control technologies and innovative Wincon 8 reflow oven control software, Aurora provides the ultimate in thermal process performance.
To learn more visit www.btu.com
AUSTIN, TX – TechSearch International’s latest analysis explains the tough year ahead for semiconductor companies, OSATs, and foundries after the record highs from the Covid-induced spending spree. Market forecasts for Ball Grid Arrays (BGAs) and Chip Scaled Packages (CSPs) are provided in units. The CSP market is divided into laminate (FBGA and FLGA) and leadframe (QFN) substrates. Stacked die package trends are included. Unit growth projections for Cu clip and molded interconnect substrates (MIS) are provided. Package examples and demand drivers are included. TechSearch International analyzes the supply and demand for build-up substrates used for flip chip BGAs and the excess capacity expected resulting from declining demand and inventory. The report includes OSAT financials and examines economic trends impacting the industry with an analysis of CAPEX plans for the year.
Automotive electronics and especially electric vehicles (EVs) are a bright spot. Increased adoption for SiC and GaN in applications including EVs and charging stations, renewable energy, fast charging for mobile devices, and power suppliers are driving demand for legacy packages such as TOs and power modules for SiC and DFNs and QFNs for GaN. Embedded die packages are playing an increased role. With strong growth in China’s EV industry, the country is well positioned with the infrastructure to support the expansion.
The latest Advanced Packaging Update is a 100-page report with full references and an accompanying set of more than 90 PowerPoint slides.
NAMPA, ID – Silicon Mountain, a leading electronic manufacturing company, is proud to announce its membership in the Idaho Manufacturing Alliance (IMA). This partnership reflects Silicon Mountain’s commitment to promoting the growth of the tech community in Idaho and revitalizing electronic manufacturing in the United States.
As a member of the IMA, Silicon Mountain aligns itself with the core values of promoting local manufacturing, fostering economic growth, and supporting the "Made in the USA" movement. The IMA serves as a platform to connect manufacturers, suppliers and industry professionals, driving collaboration, sharing best practices, and advocating for policies that encourage domestic manufacturing.
Silicon Mountain is a pillar of the tech community in Idaho, with its advanced manufacturing capabilities and commitment to quality and innovation. By joining forces with the IMA, SMCS aims to leverage its expertise and resources to further strengthen the tech ecosystem in the state. The collaboration will not only foster economic growth but also promote job creation and provide opportunities for local businesses to thrive.
"We are proud to be a part of the Idaho Manufacturing Alliance and contribute to the growth of the tech community in Idaho," said Clint Roehr, Project Manager. "At Silicon Mountain, we believe in the power of 'Made in the USA' and are dedicated to bringing electronic manufacturing back to our shores. By partnering with the IMA, we can collectively work towards creating a robust and sustainable manufacturing industry in Idaho, while also promoting American-made products and supporting our local economy."
The IMA provides a platform for manufacturers to collaborate, share knowledge, and address industry challenges. It offers valuable networking opportunities, educational resources, and advocacy efforts to promote a favorable business environment for manufacturers in Idaho. Through its partnership with the IMA, Silicon Mountain aims to contribute to the association's initiatives and leverage its collective strength to champion the resurgence of electronic manufacturing in the United States.
Silicon Mountain provides a wide range of services, whether it is prototyping for startups or high- volume manufacturing. Regardless of the service, the company aims for high quality and quick turnaround.
For more information about Silicon Mountain, visit https://siliconmtn.net/
NASHVILLE – KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Aguascalientes Expo and Tech Forum, scheduled to take place Thursday, June 1, 2023 at the Aguascalientes Marriott Hotel in Aguascalientes, Mexico. The KYZEN team will highlight both KYZEN E5631J and CYBERSOLV © C8882 stencil cleaning chemistries for understencil wiping.
KYZEN E5631J is a cost-effective, ready-to-use solution for removing all types of raw solder paste in both online and offline cleaning processes to ensure every print counts. Formulated with the worker and environment in mind, it has proven compatibility with standard stencils, cleaning equipment, and printer manufacturers.
CYBERSOLV © C882 is a solvent-based stencil cleaning fluid that can quickly dissolve all flux constituents within solder paste when used in understencil wipe processes, hand-wiping, ultrasonic cleaning systems and spray systems designed for solvents. Approved for use by several printer manufacturers, this fast-drying fluid leaves no residue when applied in cleaning solder paste, uncured SMT adhesives and flux from stencils, misprinted PCBs, stencil tools, and printing squeegees. KYZEN E5631J and CYBERSOLV © C8882 both provide proven and cost-effective options in removing solder paste in understencil wipe processes.
For more information, visit www.kyzen.com
CLINTON, NY – Indium Corporation senior technologist Dr. Ronald Lasky has been tapped by SMTA to conduct a three-part workshop, titled Solving Real-Life Problems Using the Tools of Lean Six Sigma, in conjunction with Jim Hall, Principal SMT Consultant with ITM Consulting. The first session will be held on May 31 at 3 p.m. EDT. Parts two and three will be held at the same time on June 7 and June 21, respectively. All sessions will be conducted virtually.
The workshops are intended to provide a basic overview of Lean Six Sigma (LSS) techniques for electronic assembly. They will use a teaching example, presenting a simulated LSS evaluation of a common electronic assembly quality problem. The format will follow the fundamental LSS procedure of DMAIC (Define, Measure, Analyze, Improve, Control). The workshop assumes the attendee has a basic understanding of statistics. Minitab® will be used in the quantitative aspects of the workshop.
The May 31 session, which employs a stencil printing example, will present a brief overview of LSS, define the problem, and analyze it through the first three steps of the DMAIC process.
“LSS is the fundamental technological approach to improving manufacturing processes, developed to help the U.S. be most competitive on the global economic stage,” said Dr. Lasky. “We believe this introduction will help attendees understand the advantages of LSS and to encourage them to pursue more detailed LSS training.”
Click here to register for the May 31 session and learn more about this workshop series.
Dr. Lasky is a senior technologist at Indium Corporation, as well as a professor of engineering at Dartmouth College and a Lean Six Sigma Black Belt Instructor. He has more than 30 years of experience in electronics and optoelectronics packaging at IBM, Universal Instruments, and Cookson Electronics. He has authored six books and contributed to nine others on science, electronics, and optoelectronics; he has authored numerous technical papers. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics such as electronics packaging, materials science, physics, mechanical engineering, and science and religion.
Dr. Lasky holds numerous patent disclosures and is the developer of several SMT processing software products relating to cost estimating, line balancing, and process optimization. He is the co-creator of engineering certification exams that set standards in the electronics assembly industry worldwide. Dr. Lasky was awarded the Surface Mount Technology Association’s (SMTA) Technical Distinction Award in 2021 for his “significant and continuing technical contributions to the SMTA.” He was also awarded SMTA’s prestigious Founder’s Award in 2003.
As ITM Consulting’s resident Lean Six Sigma Master Black Belt, Hall works with contract assemblers and equipment manufacturers to solve design and assembly problems, optimize facility operations, and teach basic and new technologies in private and public workshops. Hall is one of the authors of the highly acclaimed SMTA Process Certification Course, along with Dr. Lasky and Phil Zarrow. From its introduction in September 2002, he has served as the program’s principal instructor, certifying nearly 1000 engineers in the U.S., Canada, Mexico, Hong Kong, and China. Mr. Hall coordinates and implements all updates and improvements to the exams and course materials.
Hall is a strong proponent of in-process data capture and analysis for all assembly and related operations and other continuous improvement techniques. He participates as an instructor in the Lean Six Sigma programs offered at Dartmouth College. One of the pioneers of reflow technology, he has been actively involved in electronic assembly technology for more than 26 years. Hall’s expertise lies in process development and integration, fluid and thermodynamics, and computer control systems. He has delivered numerous papers and workshops on surface mount technology at technical seminars around the world. He is also the co-host of Circuitnet/Circuitmart’s “BoardTalk” audio program.
