Universal Instruments is now a member of the recently formed American Semiconductor Innovation Coalition (ASIC). Comprised of more than 90 businesses, startups, universities, national labs, and nonprofits, ASIC’s mission is to deliver focused research and development to The National Semiconductor Technology Center (NSTC) and The National Advanced Packaging Manufacturing Program (NAPMP). The 2021 National Defense Authorization Act (NDAA or CHIPS Act) called for the creation of the NSTC and NAPMP to establish a pathway for investment to accelerate the U.S. transformation into a secure semiconductor powerhouse.

“Semiconductors have become a fundamental part of our everyday lives and the recent pandemic and geopolitical uncertainty have shown them to be a critical element of our supply chain that must be protected and nurtured by applying the latest innovations and technology,” said Universal Instruments Vice President of Marketing, Glenn Farris. “Joining ASIC will help us to advance this goal.”

As the only semiconductor equipment packaging company member manufacturing high-precision, high-volume production systems, Universal brings a unique perspective to ASIC. “We look forward to sharing our knowledge of the manufacturing technologies required for efficient, cost-effective semiconductor packaging with the other member companies, as well as learning from these companies to collectively drive towards our goals,” stated Farris.

Earlier this year, ASIC announced its formal intent to advocate with one voice for the NSTC and NAPMP, following the Coalition’s response to the Department of Commerce Request for Information (RFI) 2022-01305. The key principles in the response outline critical aspects to bolster a robust domestic semiconductor supply chain that is achievable, scalable, and sustainable.

“Decades of disinvestment in our domestic semiconductor industry have made us more reliant than ever on supply from other countries to meet our nation’s chip demand. There is no more time to waste — for the U.S. to remain competitive on the global stage, we must make bold investments in chip R&D, packaging, and manufacturing,” said Dr. Douglas Grose, ASIC spokesperson and past president of NY CREATES, the organization that operates the Albany Nanotech Complex, the most advanced semiconductor R&D facility in the U.S., and where the headquarters for the NSTC and NAPMP could be located. Dr. Grose added, “ASIC is a well-rounded coalition with members that are leading drivers of chip innovation and ready to hit the ground running to fuel America’s semiconductor resurgence.”

Farris sees the New York-based facility as a powerful local asset. “Having the NSTC hub right here in our backyard in New York and being able to build a foundation for growth that can be expanded nationally would be a great opportunity and privilege,” said Farris. “The focus of the NSTC and NAPMP will be to help better move technologies from the lab to operational systems in the US, bridging the prototyping and scaling gap that currently exists and strengthening the entire domestic ecosystem.”

To learn more about Universal’s solutions for any electronics manufacturing challenge, contact Universal Instruments at +1-800-432-2607 or +1-607-779-7522 or visit www.uic.com. (See attached file: Universal Joins ASIC, Effort to Fuel America’s Semicon

MADISON, AL — August 2022 — STI Electronics, Inc., a full-service organization including engineering, contract manufacturing and training services, today announced that it will sponsor the upcoming J-STD-001H Objective Evidence for Reliability Workshop, scheduled to take place Thursday, Aug. 25, 2022 at STI’s facility in Madison. The workshop will be conducted by Magnalytix and Restronics Southeast.

IPC-J-STD-001H is a must-have for those in the electronics industry with an interest in the process and acceptance criteria for electrical and electronic assemblies. The standard is recognized globally for its criteria on soldering processes and materials. Updated with participants from 27 countries providing input and expertise, the IPC-J-STD-001H standard brings the latest criteria to the industry including guidance on the use of X-ray to inspect through-hole solder conditions that are not visible by any other means.

Save the date for the one-day event that will include a panel of interesting discussions concerning Objective Evidence, including a presentation and hands-on demo of the OE-300 SIR Testing System and other Magnalytix Services.

To learn more or register for the event, visit https://cutt.ly/cZhebIe.

About STI Electronics, Inc.

Since 1982, STI Electronics, Inc. (STI) has been a full-service organization providing electronics contract manufacturing, electro mechanical box build, microelectronics lab (clean room), rework & repair services, material failure analysis, analytical lab services, circuit design, testing, prototype manufacturing services, training services, training materials, online training, and custom courses. For more information, visit https://stiusa.com.

 PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com

MILPITAS, Calif. — July 28, 2022 — SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the passage of the CHIPS and Science Act of 2022 by the United States House of Representatives. The bill provides a 25% tax credit for U.S. facilities that produce semiconductors or chipmaking equipment and $52 billion in funding for new semiconductor programs. The funding includes $39 billion for grants available to semiconductor manufacturers as well as equipment and materials suppliers and $11 billion for federal semiconductor research programs.

“Enactment of the investment tax credit and funding for CHIPS Act programs was made possible by the steadfast support of President Biden, Secretary Raimondo, the original CHIPS Act sponsors, leadership in Congress and the committees of jurisdiction,” said Ajit Manocha, SEMI president and CEO. “We thank them for their leadership and support and look forward to working to ensure these policies and programs are implemented quickly and consistently with the objective of strengthening the semiconductor supply chain in the United States.”

“The investment tax credit and funding for CHIPS Act programs will be instrumental in bolstering semiconductor manufacturing and R&D along with a wide range of technology-reliant U.S. supply chains, create thousands of high-skill jobs, and keep pace with incentive programs around the world,” said Manocha. “With semiconductor manufacturing fabs heavily reliant on a complex mix of equipment and materials providers, the inclusion of these critical contributors in the incentives will help to ensure the competitiveness and resiliency of the U.S. semiconductor ecosystem.”

Visit SEMI Global Advocacy to learn more about public policy efforts and developments, and SEMI Workforce Development for more information on efforts to address the microelectronics industry’s talent needs.

PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com

Cranston, Rhode Island USA – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the appointment of Levente Liszka to the position of Eastern Europe Sales Manager.

With a degree in Mechanical Engineering, Levente brings over 10 years’ experience in electrical, electronics and automotive industries to AIM. In this role, he will be responsible for sales growth to new and existing clients with a focus on Central & Eastern countries in Europe.

"Levente’s knowledge, expertise and motivation will undoubtedly bring success to the growing electronic market in this region,” said AIM’s Business Development Manager Europe, Petr Bettinec. “We are confident that Levente will be a great addition to AIM’s extensive sales and support network in Europe.”

Based in Hungary, Levente Liszka can be reached at lliszka@aimsolder.com.

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service, and training. For more information about AIM’s complete line of advanced solder products and global technical services, please visit www.aimsolder.com.