SAN DIEGO — KIC will exhibit in booth 2401 at the IPC APEX EXPO 2023, taking place January 24-26 at the San Diego Convention Center, San Diego, CA. KIC provides the best and most accurate Heat to Data^TM solutions, from the thermal process experts.

A key part of KIC’s solutions is their award- winning customer and application support. KIC, once again, won the 2022 Service Excellence Award in the soldering equipment category. Furthermore, with new technology leveraging their best-in- class profiling systems, KIC won the Mexico EMS Technology Award for their 24 channel profiling capabilities. All of this is added to the industry standard for thermal process inspection: Reflow Process Inspection (RPI) and Wave Process Inspection (WPI).

Be sure to stop by the KIC booth to discuss NPI setup, recipe optimization for reduced defects, improved OEE, oven performance tracking, thermal process inspection, and their complete ecosystem of solutions for thermal processes. And, now with the KIC API available with their software development kit, anybody can integrate KIC automated process inspection with their factory MES or quality systems.

KIC’s 45 years of experience in automated process data collection, KIC service and support offices in every region, and more than 28,000 systems in the field brings the most reliable, accurate, and innovative solutions for electronics manufacturing thermal process challenges. Experts in turning Heat to Data^TM. For more information: www.kicthermal.com

DONGGUAN, CHINA ― SASinno Americas today announced plans to exhibit at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. The company will showcase the Ant-i1 Offline Selective Soldering Machine will be on display in Booth #1736.

The Ant-i1 includes a drop jet fluxer, bottom preheating zone and optional top preheating zone, and solder pot with 15 kg capacity. It can handle boards up to 350mm L x 260mm W and can manually rotate boards 180 degrees to 700 mm L x 260mm W.

The Ant-i1 software is based on the Windows 10 operating system for easy programming and excellent traceability. Standard features include live on-camera viewing of the soldering process, auto wave height calibration, one-button flux nozzle auto cleaning function, N2 closed-loop heat-up, flux level alarm, solder level alarm and more. Optional features include N2 purity monitoring, N2 flow monitoring, flux quantity monitoring and more.

The SASinno brand stands for “Smart and Steady Innovation.” The company has established a strong worldwide distribution channel with well-trained engineers to support its customers in any location.

For more information about the Ant-i1, watch the video at https://www.youtube.com/watch?v=k-WY5- tHY88

For more information about SASInno Americas, visit www.sasinnoamericas.com

OXFORD, CT — MIRTEC, ‘The Global Leader in Inspection Technology,’ will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1841 at the 2023 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Jan. 24-26, 2023, at the San Diego Convention Center in California.

“We are very excited about the products that we will be presenting at APEX 2023,” stated Brian D’Amico, President of MIRTEC’s North American Sales and Service Division. “MIRTEC will feature a total of five (5) Inspection Systems specifically designed to address the full spectrum of inspection requirements associated with the Electronics Manufacturing Industry.”

MIRTEC’s Award-Winning MV-6 OMNI 3D AOI Series feature our exclusive OMNI-VISION ® 3D Inspection Technology which combines either a 15MP or 25MP CoaXPress Camera with MIRTEC’s revolutionary 12 Projection BLUE Moiré 3D Technology in a cost-effective platform. MIRTEC’s proprietary Ultra-High resolution CoaXPress Vision System is designed and manufactured by MIRTEC for use with our complete product range of 3D inspection systems. MIRTEC’s 12 Projection Digital BLUE Moiré Technology provides true 3D inspection to yield precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured MIRTEC’s MV-6 OMNI machines feature four 10MP or 18MP Side-View Cameras in addition to the Top-Down Camera, a Multi-Focus Programmable Z-Axis System, an Internal PCB Flipper Conveyor, and Multi-Function AOI/SPI Fusion Technology.

MIRTEC’s Award-Winning MV-3 OMNI Desktop 3D AOI Series features the same hardware and software as MIRTEC’s in-line OMNI-VISION ® 3D Inspection Systems providing 100% compatibility across our entire 3D AOI product line. These systems feature our exclusive OMNI-VISION ® 3D Inspection Technology which combines either a 15MP or 25MP CoaXPress Camera with MIRTEC’s revolutionary 12 Projection BLUE Moiré 3D Technology in a cost-effective platform. MIRTEC’s proprietary Ultra-High resolution CoaXPress Vision System is designed and manufactured by MIRTEC for use with our complete product range of 3D inspection systems. MIRTEC’s 12 Projection Digital BLUE Moiré Technology provides true 3D inspection to yield precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured MIRTEC’s MV-3 OMNI machines feature four 10MP or 18MP Side-View Cameras in addition to the Top-Down Camera, a Multi-Focus Programmable Z-Axis System and Multi-Function AOI/SPI Fusion Technology. Without question, the MV-3 OMNI is the most Technologically Advanced Desktop 3D AOI machine ‘On the Planet!’

AI Powered Smart Factory Automation Solution

MIRTEC’s Smart Factory Automation solution, ‘INTELLI- PRO’, is an AI based Software Suite specifically designed for the purpose of improving the performance and convenience of MIRTEC’s complete line of AOI machines. INTELLI-PRO consists of a proprietary Deep Learning based Automatic Part Search and Teaching function, and AI based; Automatic Parameter Optimization, Character Recognition (OCR), Foreign Object Detection (FOD), Placement Inspection Algorithms and an Automatic Defect Type Classification function.

MIRTEC’s Award-Winning MS-11e 3D SPI Series feature our exclusive 15MP or 25MP CoaXPress Camera Technology, providing enhanced image quality, superior accuracy, and incredibly fast inspection rates. The MS-11e 3D SPI is also available with a cost-effective 4MP Camera Link option. These machines uses Dual Projection Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste depositions on PCBs post screen print for insufficient/excessive solder, shape deformity, shift of deposition and bridging. All MIRTEC 3D SPI machines are CFX complaint and feature upstream and downstream Closed Loop Feedback.

MIRTEC’s Award-Winning GENESYS-PIN Hybrid 3D AOI Series is specifically developed for the Automotive Electronics Market. This extraordinary system is configured with a 12 Megapixel CoaXPress High-speed Camera System, a 15um Precision Telecentric Lens, an advanced nine (9) Phase RGB Color Lighting System, a Programmable Multi-Focus Z-Axis System, and four (4) Programmable Multi-Pattern Digital Projectors which are an integral part of MIRTEC’s proprietary Hybrid 3D Measurement Technology. With this revolutionary optical system, the GENESYS- PIN machine can measure up to 50mm tall connector pins with extreme accuracy. The GENESYS-PIN machine detects defects such as missing pins, pin offset as well as measurement of distance between pins and inner/outer dimensions of forked pins.

New to APEX 2023, MIRTEC will be displaying our GENESYS-CC AI Based Conformal Coating AOI Series. These revolutionary systems are configured with MIRTEC’s Exclusive 15MP CoaxPress Camera Technology, four 18MP Side-Angle Cameras and an optional Internal PCB Flipper Conveyor for Double Sided PCB Inspection. The GENESYS-CC machine inspects for Presence/Absence of Conformal Coating, AI Based Bubble Inspection and Lateral Side Component CC Inspection using the 18MP Side Cameras. The system is also fully capable of standard PCB inspection, providing maximum flexibility to the Electronics Manufacturing Environment.

MIRTEC is Leading the Way to Industry 4.0

MIRTEC’s Total Remote Management System (TRMS) is a fully integrated Industry 4.0 Solution which combines remote management with real-time data monitoring and analysis for each system within the SMT production line. MIRTEC’s TRMS provides real-time remote monitoring of status information and statistical data such as equipment operation status, production yield, PC resources, temperature, humidity, etc. The combination of MIRTEC’s 3D Inspection Systems and TRMS provide a vast improvement in production process management. The TRMS Module is a key part of MIRTEC’s Intelligent Factory Automation System, INTELLISYS ® . This powerful software suite was designed and developed by MIRTEC to provide manufacturers with a clear view into the manufacturing process, thereby helping them achieve higher operating efficiencies and improved quality.

“IPC APEX has earned a reputation as North America’s largest and most comprehensive Electronics Manufacturing Exhibitions,” continued D’Amico. “We look forward to welcoming visitors to our Booth #1841 for a detailed demonstration of our Award-Winning Inspection Technology”

TORRANCE, CA — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announced its product line up for the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. Seika plans to demonstrate the new SAYAKA PCB Router SAM-CT34XJ Stand Alone & In-Line Solution, Kyowa MRS-100 Strain Gauge Monitor, Sawa Ecobrid, McDry DXU-1001A with Data Logger, Malcom RCX Modular profiling system and more in Booth #2732.

The SAM-CT34XJ features a slide table for fast and easy loading/unloading of PCBs, repeatability ±0.01mm and low maintenance. The color CCD camera makes it easy to program, along with an automatic QR code reading and uploading program. The system offers broken/slip bit detection and extended bit life with automatic bit position control.

The Kyowa MRS-100 series quickly connects strain-gauge sensors wirelessly. The telemeter measures high-speed phenomena in experimental and research fields, such as the automotive industry, and transmits the test data in almost real-time. The MRS-100 series also connects the load sensors and pressure sensors for quality controlling wirelessly by mounting it in manufacturing lines and improves the productivity.

The Sawa Ecobrid stencil cleaner provides a fast tact time in both cleaning and drying at under 10 minutes. It also offers low solvent usage, energy consumption and running costs. The fully automatic cleaner features easy-to-use touch panel operation and uses cleaner features easy-to-use touch panel operation and uses a low-VOC solvent, making it environmentally-friendly and resulting in little to no flash point concerns.

The McDry DXU-1001A cabinet will be available with the optional Data Logger. By adding a Data Logger to McDry cabinets, users can schedule recurring reports right to your inbox. Also, get email, text and phone alerts when temperature or humidity is out of specification. Charts are downloadable as evidence for traceability, and Data Loggers are Ethernet based, Wifi and networking capable.

The Malcom RCX Modular profiling system with onboard video camera will be on display with the new vibration monitoring module! The Malcom RCX Series Modular Reflow Oven Profiling System offers complete profiling of reflow ovens, including oven temperature, video imaging, O 2 concentration and convection air velocity. It verifies that ovens are performing at optimal conditions and enables users to troubleshoot problem areas.

Additionally, the Malcom SWB-2 wettability tester will be on display and available for demonstrations.

Ask for a competitive quotation on any Seika equipment and place an order while supplies last. Contact Michelle Ogihara at 310-540-7310; e-mail michelle@seikausa.com; or visit www.seikausa.com