SAN FRANCISCO — Tempo Automation Holdings, Inc. (Nasdaq: TMPO) (“Tempo Automation” or “Tempo”) announced today that Blur Product Development (“Blur”), a leading medical device design and development partner, has elected to leverage Tempo’s Accelerated Electronics Manufacturing Platform to speed up product development timelines for its clients.

Recognizing that delays can result in significant costs to their clients as a result of extra work and delayed or lost revenues, the team at Blur has opted to rely on Tempo’s first-time-right printed circuit board assemblies (“PCBAs”). The Tempo platform supports Blur’s acceleration efforts through prototyping and into production, ultimately bringing clients’ projects to market more quickly.

Blur recently ran the same 50-board project through both Tempo and another PCBA vendor that promised quick turn times. While both manufacturers were able to deliver boards quickly, Tempo’s quality stood out.

“With the other vendor, who was lower priced, we had almost 50% fallout on 50 circuit boards,” said Jeff Rosino, Partner at Blur. “We had 0% fallout when running the same order through Tempo.”

With exceptionally high acceptance rates and fast shipments, it is an easy decision to continue to partner with Tempo. “Tempo’s quality paired with speed blows us away,” said Rosino.

Additionally, Blur looks for flexibility in its partners, which comes down to the ability to make changes quickly. “We value Tempo’s ability to adapt purchase orders to meet changing needs, especially given current component availability constraints,” said Rosino.

Joy Weiss, CEO of Tempo Automation, said, “Tempo has focused its manufacturing platform to serve the unique needs of early stage electronic product development. Like Blur, our goal is to help get our customers’ products to market as quickly as possible.”

OSAKA — Nihon Superior Co. Ltd., a supplier of advanced joining materials, is pleased to announce that it will exhibit its TempSave series in Booth #1433 at the IPC APEX Exposition, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in San Diego, CA. The company also will showcase LF-C2 P608 solder paste.

Nihon Superior’s TempSave™ series of low temperature soldering materials has been designed to address the industry’s goals of reduced peak reflow temperature to reduce defects contributing to package warpage, reduce energy consumption during the reflow process, and avoid potential damage to temperature sensitive devices. TempSave B58 is a eutectic SnBi alloy with a melting point of 139°C while TempSave B37 is a ductile hypoeutectic SnBi alloy and does not contain Ag.

High bismuth containing alloys are known to be brittle and therefore poor in drop shock performance. However, TempSave B37 has outstanding drop performance, even dramatically outperforming SAC305. The halogen-free P610 flux medium is specifically designed for Bi alloys. The TempSave B37 P610 solder paste can be reflowed with a peak temperature of 190°C. Additionally, a high speed jetting paste version is available, TempSave B37 P611 which provides consistent dot sizes.

LF-C2 P608 is a completely halogen free, lead-free, low voiding solder paste. The demand of the automotive industry for solder alloys that deliver long life in conditions of extreme thermal cycling has resulted in the development of alloys that are very hard. While these hard alloys are resistant to the plastic deformation that drives failure in thermal cycling, the trade-off is that their hardness means that they have a tendency to crack when exposed to the other stresses to which automotive electronics is subjected in service. Nihon Superior’s LF-C2 strikes a balance between these two requirements, delivering long life in thermal cycling but with a compliance that means that it is resistant to cracking under other loading conditions. With a liquidus temperature of 213°C it can be reflowed at a lower temperature than SAC305.

SN100CV ® P608 is a completely halogen free, lead-free, no-clean solder paste. Unlike silver- containing alloys that derive their strength from a dispersion of fine particles of eutectic Ag 3 Sn, SN100CV gains its strength from solute atoms in the tin matrix of the joint. Although silver-free, in tensile tests the SN100CV alloy matches the strength of SAC305.

The P608 flux medium provides wetting comparable with that of halogen containing paste even though it is completely halogen-free. SN100CV P608 and LF-C2 P608 both deliver excellent performance over a wide range of component types and process parameters.

Nihon Superior continues to offer solutions to the challenges facing the electronics industry, such as improvements in reliability, thermally stable joining, and lead-free die attach. For more information about Nihon Superior’s new alloys, solder pastes and lead-free products, please visit us at www.nihonsuperior.co.jp/english

LAKEVILLE, MN – ITW EAE will be showcasing its latest developments at IPC APEX, January 24-26 in San Diego. The ITW EAE booth #1106 will have MPM, Camalot, Electrovert and Vitronics Soltec Applications Experts on hand as well as Sales and Management to answer questions and offer solutions.

Camalot will be presenting live demonstrations of its Advanced Tilt and Rotate dispensing system. This new and innovative system reduces wet out areas and improves capillary flow for underfill and provides access to dispense on side walls, underneath, or around tall components.

Camalot will also feature a new syringe cooling option that increases the “pot-life” of underfill materials by maintaining the syringe at controlled temperature within the heated machine environment. This innovative solution reduces material waste, reduces downtime, and increases process stability. Depending on the material properties and internal machine temperature, underfill material will last 3-5 times longer when using the syringe cooling system.

Electrovert will demonstrate the new Auto Adjust Exit Wing that is being introduced for its wave soldering machines. It automatically adjusts laminar wave flow to match board velocity for reduced defects. The Auto Exit Wing provides highly repeatable, precisely controlled exit wing adjustment that has been proven to deliver up to a 70% reduction in bridging defects and improved topside hole fill. Adjustments are made on-the-fly, eliminating the need for skilled labor to adjust the exit wing manually during product changeover.

MPM will conduct live demonstrations on the Momentum II Elite printer. This proven, highly-productive printer features enhanced technologies that provide further improvement in machine productivity, yield, ease of use, and flexibility.

Vitronics Soltec will feature the ZEVAm+ Selective Soldering solution with the patented Bridge Prevention Technology integrated with the n2 cone. The nozzle is 3D printed out of stainless steel and is then hard chromized for an infinitely long service life.

Vitronics Soltec will also showcase the Centurion™ Reflow Oven with True N2 to Air Switching. This is an option that no one else offers. With the push of a button you can automatically switch between true air environment and true nitrogen environment.

ATLANTA — Koh Young Technology, the industry leader in True3D measurement-based inspection solutions and the Premier Sponsor of IPC APEX EXPO, will deliver live demonstrations of its award-winning inspection and measurement solutions during the live tradeshow in the San Diego Convention Center on January 24-26, 2023, in San Diego, California. Koh Young will highlight several award-winning solutions at the Koh Young America booth (1116). The following is just a glimpse into what Koh Young will have in store for our visitors.

Solder Paste Inspection (SPI)

In 2002, we introduced the concept of 3D measurement-based solder paste inspection – and it revolutionized the inspection industry. Today, manufacturers recognize the value of the 3D measurement data and use the data to improve the print process, in turn, improving production yield and quality. Today, 3D SPI has become a standard requirement for SMT lines – it is no longer optional. The KY8030-3 is our SPI workhorse, and the most popular SPI solution in the electronics manufacturing market. With a patented dual-projection technology, we deliver trustworthy and repeatable measurement data, which manufacturers can use to reliably optimize the print process.

• KY8030-3: Industry’s Fastest True3D SPI Solution with Integrated Auto-Repair Dispenser
• aSPIre3: Industry’s Highest Performing True3D SPI Solution

Automated Optical Inspection (AOI)

The Koh Young 3D AOI Zenith delivers perfect inspection performance with True3D measurement technology. In the 2D inspection world, false calls and escapes are unavoidable. To solve this problem, we took a different approach. We based our solution on full 3D measurement technology, not 2D technology and its inherent shortcomings or 2D with some 3D capabilities bolted-on to help. At Koh Young, the Zenith measures all components in True3D. We find the component body based on true 3D profilometric information. Using this approach, we provide trustworthy inspection results, regardless of component or board color variations. When our 3D measurement data meets artificial intelligence, we can deliver even more advantages to manufacturers.

• Zenith Alpha: Best Value True3D Automated Optical Inspection Solution
• Zenith UHS: Industry’s Fastest True3D AOI Solution
• Zenith 2: Revolutionary True3D AOI Delivering Incomparable Capabilities
• Meister D: Industry’s Leading Inspection Systems for Advanced Packaging & Semiconductors

Automated Pin Inspection (API)

Built on its world-class True3D™ AOI technology, new enhancements help it break through barriers associated with inspecting products with a mix of both Pins and SMDs. The complete KY-P3 lineup provides an automated back-end solution combining advanced high-resolution optics and innovative AI-powered vision algorithms for single pin, press- fit, and Final Optical Inspection, as well as for pins inside a connector shroud, while also inspecting traditional SMDs on the same product. Because of its quantitative measurement-based approach, accuracy and repeatability is unsurpassed.

• KY-P3: Industry-awarded breakthrough in 3D Automated Pin Inspection

Dispense Process Inspection (DPI)

The award-winning Neptune is the industry’s first 3D optical measurement solution for transparent material inspection. Using Koh Young LIFT technology (Laser Interferometry for Fluid Tomography), the Neptune delivers non-destructive 3D inspection to precisely measure and inspect fluids – wet or dry. With its Machine-Learning algorithm, the Neptune accurately measures materials for coverage, thickness, and consistency with a user-defined threshold setting. It also identifies bubbles, cracks, and other defects in coating. It also measures underfill, epoxy, bonding, glue, potting, flux, and more to deliver an exact measurement of transparent and translucent materials.

• Neptune T: Industry’s First 3D Optical Measurement Instrument for Transparent Materials
• Neptune C+: Award-winning True3D In-Line Dispensing Process Inspection (DPI) Solution

Process Control Software

AI-powered KSMART solutions help automate process control, while focusing on data management, analysis, and optimization. It collects data from across the factory for defect detection, real-time optimization, enhanced decisions, and traceability to improve production, increase quality, and lower costs by eliminating variances, false calls, and escapes. Koh Young can help manufacturers solve significant business challenges by applying connectivity to modernize industry processes. By leveraging IPC-CFX with its AI-powered technologies, Koh Young successfully applies real-time data to improve the production process by converting data into process knowledge. Combined with IPC communication standards, Koh Young can open the gates to a smart factory for anyone.

• KSMART: Seamless Smart Factory Software Suite Turning Data into Insights

Process Optimization Software

The award-winning Koh Young Process Optimizer (KPO Printer) solution is an AI-based automatic print process optimizer. This system improves the printer offset, as well as critical printer parameters like squeegee speed, print pressure, and separation speed. KPO performs an automated DOE to determine the optimum printing parameters for the best print quality. As a result, manufacturers can optimize the print process, without the need for a dedicated print process expert. Furthermore, KPO monitors and perfects parameters in real-time to guarantee quality despite environmental changes.

• KPO Printer: Award-winning AI-powered print process control software

Art of the Possible Podcast

IPC APEX EXPO 2023 Edition with John W. Mitchell, IPC president and CEO gives you a sneak peek into what you can expect at the premier event for the electronics manufacturing industry. This year marks the 20th time Koh Young has exhibited at IPC APEX EXPO. “APEX is a lynchpin for our business success in the coming year. It is important to our growth potential, so we plan every aspect very carefully. It’s our Superbowl, so we make sure to prepare for it accordingly. The results can mean the difference between a good year and a great year!” explained Joel Scutchfield, General Manager of SMT Business Operations and Director of Sales at Koh Young America. Listen to our podcast at art-of-the-possible.simplecast.com/episodes/koh-youngs-20th-year-exhibiting-at-ipc-apex-expo

To learn more about how our solutions boost your quality, visit us at the IPC APEX EXPO in Booth 1116 at the San Diego Convention Center in California. You can register to attend the in-person conference and exposition at www.ipcapexexpo.org/2023-registration-options. If you cannot attend the show, you can still learn more about our best-in-class inspection solutions at our regional website www.kohyoungamerica.com