SUWANEE, GA – Although the processing of odd-shaped components at the end of the line usually accounts for only about ten percent of the entire SMT process, it represents the majority of the challenges in placement operations. With a smart high-performance solution from technology leader ASMPT, the company’s SIPLACE TX high-speed placement systems can now also be used as end-of-line machines for the automated processing of odd-shaped components (OSCs), replacing expensive and slow robotic solutions or manual work. The SIPLACE Tray Unit enables the automatic, uninterrupted feeding of components from up to 82 JEDEC trays. And the associated seamless traceability of products, components and batches ensures total auditing security, which is particularly important in sensitive areas such as the automotive sector.
“With its proven Waffle Pack Changer and Matrix Tray Changer, ASMPT has long offered the option of automatically supplying odd-shaped components (OSCs) to the highly flexible SIPLACE SX and the high-volume SIPLACE X S. Due to design limitations, this was previously not possible for the SIPLACE TX,” explains Petra Klein-Gunnewigk, Senior Product Manager at ASMPT. “With the new SIPLACE Tray Unit we fulfill the wish of many electronics manufacturers to make this machine, which is highly valued for its impressive floorspace performance, fit for automated, highly efficient and more productive end-of-line processing. As a result, SIPLACE TX users can now balance their lines even more effectively while gaining valuable space on the shop floor and increasing their flexibility by integrating processes that previously had to be handled offline – with all the advantages that our Open Automation concept delivers.”
Ready for OSC processing
To ensure the correct processing of odd-shaped components in a single step, the SIPLACE TX can now be equipped with two stationary high-end camera systems for use with two TwinHeads or a placement head combination of a CPP and a TwinHead. With its great selection of special nozzles and grippers, the TwinHead makes it possible to place OSCs measuring up to 200 mm × 110 mm × 25 mm (L × W × H) and weighing up to 160 grams. And with the optional OSC Package, the OSC placement capabilities are expanded even further.
Powerful feeding solution
To operate as an end-of-line machine, the SIPLACE Tray Unit is now available for the SIPLACE TX. It uses carriers that can each hold two JEDEC trays. Depending on the size of the components, up to 82 JEDEC trays or 41 trays measuring up to 355 × 275 mm are possible. As a special feature, new trays can be refilled without having to interrupt the production because the magazine is split into a buffer zone for the continuous supply and the main storage area, which can be refilled with new trays.
Perfect fit for more space on the shop floor
The SIPLACE TX is the placement solution of choice for mobile devices, increasingly complex automotive solutions, and many more applications. Whenever manufacturers wanted to integrate the processing of OSCs into the line, they previously had to resort to alternative end-of-line solutions, which take up significantly more space, as shown in this simple example: Three SIPLACE TX and one SIPLACE SX with a Waffle Pack Changer occupy an area of 13.76 square meters. Four SIPLACE TX machines, on the other hand, the last being equipped with the new SIPLACE Tray Unit, take up only 9.92 square meters – a whopping 27.5 percent less. And the SIPLACE Tray Unit protrudes less than 13 centimeters from the front of the machine.
A more balanced line
Automated OSC processing makes the entire SMT line much more balanced because it drastically accelerates the slowest placement process. It increases the line’s productivity considerably and minimizes the robot-supported or manual processing of OSCs or eliminates it completely. Another contributor to an optimally balanced line is the powerful CP20 placement head, the latest generation of which can process components that are one millimeter taller. This makes it possible to process a higher range of components at the beginning of the line, which in turn relieves subsequent machines.
Automation for the integrated smart factory
Integrating the placement of OSCs into the SMT line also enables this process to benefit from the wide-ranging capabilities of ASMPT’s flexible and manufacturer-independent Open Automation concept. In contrast to downstream manual processes, all production, product and component data is automatically recorded during the placement process and transmitted to the IT systems for seamless traceability and documentation. In addition, the productivity- and efficiency-enhancing applications of the WORKS smart shop floor management suite can also be used to their full extent for the OSC process – another important step toward the integrated smart factory.
End-of-line processing in the ‘Facts on Open automation’ livestream
What the ideal end-of-line machine must look like is the subject of our ‘Facts on Open Automation’ livestream on March 29, 2023. Host Laszlo Sereny and his studio guests will explain why component diversity and standardization are not mutually exclusive and prove this with illustrative examples from practical applications.
This ASMPT show format offers viewers each month a roughly half-hour English-language livestream around ASMPT’s Open Automation concept with live feeds from international SMT hot-spots, interviews with experts, practical examples from SMT productions, and much more.
More information about the “Facts on Open Automation” series of livestreams is available at https://facts-on-open-automation.smt.asmpt.events/.
NEUSS, GERMANY – Yamaha Motor Robotics Business, SMT Section held its annual distributor meeting at the Company headquarters in Neuss, Germany, February 7-9. Partners from across the European network gathered to discuss business performance, enhance their product knowledge and focus their energies for the coming year.
“We continue to strengthen our position in the market, thanks to the dedication of this great team,” said Daisuke Yoshihara, General Sales Manager, noting particularly positive response to the 1 STOP SMART SOLUTION that enhances cohesion between printing, placement, and inspection processes.
The delegates also benefited from learning opportunities, through practical demonstrations of the latest equipment features. They included a preview of forthcoming enhancements to the YSUP graphical software for machine control and factory management.
Moving to the prestigious Hotel De Medici in Dusseldorf for day two, the meeting brought everyone up to speed with Yamaha’s product and sales strategies for the coming year.
The event closed by presenting the annual distributor awards, which recognise outstanding performances over the past year. Mancini Enterprise, Yamaha’s distributor in Italy, Albania, and Croatia, received the Most Valuable Distributor Award 2022 for its excellent annual sales.
Mindaugas Pališaitis from Etama received the Best Service Award 2022, recognising the team’s support for customers in Latvia and Lithuania. Thomas Metz, Yamaha’s SMT Manager Operations presenting the award, highlighted the long-term value gained from nurturing customer confidence thanks to a knowlegable team.
Slawomir Florian, Yamaha Area Sales Manager for East Europe presented the Special Achievement Award 2022 to Amtest. The distributor for Bulgaria received the commendation for growing the local market, both for Yamaha’s YS-series printing, placement, and inspection machines as well as complete 1 STOP SMART SOLUTION lines.
NEWMAN LAKE, WA – Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, component lead tinning and solderability testing equipment, is pleased to announce the addition CAPTEC as their exclusive sales representative for their entire product line for the territory of Northern California and Northern Nevada. “We are pleased to have Kevin McClay and his entire group of CAPTEC join our sales team”, stated Tom Baro, North American Sales Manager for Hentec Industries/RPS Automation. CAPTEC has a wealth of experience in the electronic assembly industry including precision dispensing, robotic soldering, and vapor phase soldering, BGA rework and BGA re-balling, as well as flying probe and boundary scan testers, and X-ray inspection systems.
Kevin McClay, President of CAPTEC added, “Our entire team is excited to join Hentec/RPS and add our sales and service support expertise along with our IPC and SMTA industry relationships.” McClay added, “Our mission is to provide capital equipment, electronic assembly supplies and technologies to the electronic manufacturer via high quality differentiable sales and services support.”
WANCHAI, HONG KONG – A Chairpersons View, listening to customers, shaping the direction, upholding Ryder's vision, mission and values.
When I reflect on 2020 into 2022 and throughout, I need to state that COVID-19 and variations of, were gentle with Ryder. To put that into context, the team carried out a magnificent job to mitigate risk.
We applied strict controls of “Zero COVID” and fortunately experienced no casualties. During this time, we focussed on maintaining our own personal health and wellbeing as well as that of our company. We reflected on what lessons we learned. We developed, and as a positive result, sales grew.
In stark contrast to others in the Electronics Manufacturing Industry (EMS), our supply chain continued to flow well, albeit demanding a lot of hard and smart work from both our intelligent in-house supply team experts, as well as our established and reliable network of Original Component Manufacturers (OCMs). To test our resilience, we experienced only one state-ordered lockdown, but being proactive, this didn’t stop our team from manufacturing. We proficiently and rapidly opened our own on-campus accommodation and kept on making with our supply chain moving.
Like everyone else across the globe during COVID-19, we had a reliance on a new way of doing business, via online communication portals, and again, I must sing the praises of our team who adapted quickly to this new world. Training and development took place as we learned how to showcase to our OEM customers our ability to remotely design, engineer, develop, manufacture, and deliver from product introduction, to realisation, to fulfilment. This demonstratable evidence has led to new and existing opportunities, repeat business, and new contracts being awarded to Ryder. A true testament to how flexibility, and a can-do attitude helps in challenging times.
Taking this time to think strategically with our minds positioned for growth, we moved a large part of our manufacturing capability to our Inland facility. As planned, this freed up significant space within our Coastal plant, which is in the world-class engineering city of Shenzhen, for our exciting new Advanced Manufacturing Hub. Here, we will focus on materials, components, processes, and skills and we’re pleased to say that we’ve already seen positive signs with one of our OEM customers. We’ve gained significant market share thanks to our custom development team engineering a unique and tailored solution based on their individual market needs.
As I discuss our different facility locations, I am acutely aware that the term “Geopolitical risk” has risen in prominence these days and is gaining increased international attention. The “Geo” part is not a challenge for Ryder, as our plants are in a seismic quiet zone, they are 450km (300 miles) apart, and they access multiple seaports. We are also incredibly proud to be embedded in China’s extensive and robust industrial supply base. The “political” dimension is being addressed by a dual effort, for electronics, Ryder runs a four-year-old partnership within Thailand, which satisfies the United States import controls, and a plastics solution is being prepared. During 2023 we will be able to comment on this further and share our solution with you.
We can’t say for certain whether COVID-19 has made companies more environmentally aware, but regardless, we are pleased that ESG (Environmental, Social and Governance) is getting more attention worldwide, and that companies are being assessed on these principles.
At Ryder Industries, we have been putting Environmental principles into practice since we opened our inland plant in 2012, with six new systems for energy and water conservation. With those years of experience, we extended these in our 2021 expansion, and they have worked very well for us.
And it’s not all about the ‘environmental’ part of this program, at Ryder we have been pushing ahead with our Social dimension too, running a dual-option six-month paid maternity leave policy. The “glass ceiling” received attention, too. Not simply with quotas, but with consultation, development training, and dynamism, resulting in near perfect female numerical parity of managers.
I’d like to conclude with a message to our team to ensure that they fully understand how much they are valued, not only through the challenging times, but we do applaud their extraordinary performance during these testing times. The exciting years ahead bring new projects and new opportunities for us all.
By Eric Winkler, Chairman
REDMOND, WA – Data I/O Corporation (NASDAQ: DAIO), the leading global provider of advanced security and data deployment solutions for security ICs, microcontrollers and memory devices announces Noa Leading Co., Ltd will offer SentriX® security provisioning services in Japan. Noa Leading Co. is Data I/O’s exclusive sales distribution partner in Japan and is an established supplier of programming services to the Japan market. Security provisioning will be available to customers effective immediately.
“Mass-market adoption of IoT devices is driving demand for OEMs (Original Equipment Manufacturers) to design and manufacture secure products. Data I/O is excited to work with Noa Leading to establish the first SentriX security provisioning service in Japan,” states Anthony Ambrose, president, and CEO of Data I/O Corporation. “Noa Leading is well respected in the Japanese market with strong established relationships with semiconductor partners and has demonstrated a strong capability for high-quality product, service, and technical support. Noa Leading is well positioned to represent Data I/O in Japan’s electronics market.”
“Over the past 8 years Noa Leading Co., Ltd. has successfully programmed millions of devices through our programming service utilizing PSV7000 systems from Data I/O,” states Shosei Tamayama, president and CEO of Noa Leading Co., Ltd. “Noa Leading is excited to expand our data programming service to offer security provisioning to our Japanese customers. By upgrading our PSV7000 to add Data I/O’s SentriX security provisioning capability, implementing physical security at our facility, and achieving ISO 27001 certification Noa can deliver simplified IoT security and data programming solutions to OEMs of any size cost-effectively.”
The SentriX security deployment platform enables Noa Leading and OEMs to easily define security profiles and provision microcontrollers and authentication ICs “integrated circuits” at the chip level before shipping the device to the manufacturing line for board assembly. Because the SentriX platform supports many security use cases and is scalable, this capability is available to OEMs with low volume but is also cost-effective for high-volume production.
About SentriX Security Deployment Platform
SentriX secures the global electronics supply chain and protects IoT device intellectual property from point of inception to deployment in the field. Data I/O’s SentriX security deployment platform provisions security objects and secrets into semiconductor devices for low volume prototyping applications and high-volume production. SentriX integrates a FIPS 140-2 Level 3 compliant HSM (Hardware Security Module) into an automated programming system which enables secure provisioning of credentials into security ICs and microcontrollers in high-volume. Data I/O’s PSV7000 and PSV5000 can be upgraded in the field to support security provisioning.
SentriX Product Creator is the software tool suite used by OEMs, silicon vendors and programming facilities to define and collaborate on security features provisioned on SentriX. The SentriX Product Creator tool offers OEMs two flexible security deployment models: fully customizable and SentriX GO™ pre-configured security profiles saving time, effort and avoiding potential pitfalls during security deployment definition. The profile definitions completed using the SentriX Product Creator tool are secure at rest and transferred for device provisioning on the SentriX security deployment platform at a secure programming location. OEMs of any size can now securely provision devices from early samples all the way to high-volume production prior to shipping chips to a manufacturing line using a cost-effective as-a-service model. The SentriX Product Creator is available today.
Learn more about SentriX at www.dataio.com/SentriX
CLINTON, NY – Indium Corporation® will feature its metal thermal interface materials (TIMs) for burn-in and test at TestConX, March 5-8 in Mesa, Ariz., U.S.
As an industry leader in high-performance metal thermal interface materials (TIMs), Indium Corporation will feature selections from its portfolio of innovative high-performance metal TIM solutions.
Indium Corporation’s indium-containing TIMs for burn-in and test offer superior thermal conductivity over non-metals—with pure indium metal delivering 86W/mK. Its indium-containing TIMs are available as pure indium, indium-silver alloys, and indium-tin, among others. The pure indium TIM can be clad with a thin aluminum layer on the side facing the device under test (DUT) to prevent the indium from adhering to the surface. Indium Corporation’s suite of Heat-Spring® solutions, featuring a compressible interface between a heat source and a heat-sink, include:
Heat-Spring® Preforms
Heat-Spring® HSK
Heat-Spring® HSD
To learn more about Indium Corporation’s metal TIMs for burn-in and test, visit us at booth #45 at TestConX or online at www.indium.com/TIMs.