CLINTON, NY – Indium Corporation® will feature selections from its portfolio of proven products for automotive and power electronics applications, including electric vehicle manufacturing, at APEC 2024, February 25‒29 in Long Beach, California.

Specifically developed for power module package-attach applications, Indalloy®301 LT is a new bismuth-free alloy that prevents thermal defects in the module without sacrificing reliability like traditional bismuth-containing, low-temperature alloys.

Available in InFORMS® configurations, Indalloy®301 LT offers a solution for consistent bondline thickness and improved strength to enhance thermal and mechanical reliability of the solder joint while reducing processing temperature and energy input during manufacturing. This enables complementary Pb-free high-reliability alloy technologies such as Indalloy®276 to be used in power module die-attach, component-attach, or interconnects without the risk of re-melt and degraded performance. Indalloy®301 LT is also available in preforms and ribbon configurations and can be offered flux-free or with Indium Corporation’s flux coating technology.

Additionally, drawing on its significant automotive industry expertise and an award-winning portfolio of proven products, Indium Corporation will feature:

• Award-winning InFORMS® – reinforced solder alloy fabrications which improve mechanical and thermal reliability, and are specifically designed to produce consistent bondline thickness for power module applications. They also address specific challenges for the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.
• InTACK™ – a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. Designed for use in no-flux reflow applications with formic acid, InTACK™ is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, reducing the dependency on tooling without compromising soldering or sintering quality.
• QuickSinter® – a new approach to sinter technology. This high-metal, low-organic content approach enables fast drying and sintering times for high throughput. Both silver and copper sinter pastes are available. The portfolio includes the InFORCE™ range of pressure sinter pastes and the InBAKE range of pressure-less sinter pastes. Applications include die-attach and substrate-attach in power electronics.
• Durafuse® HT – a novel design based on a novel alloy technology, designed to deliver a tin-rich, high-temperature lead-free (HTLF) paste, presenting the merits of both constituent alloys. Durafuse® HT delivers simplified processing, with no special equipment needed, and enhanced thermal cycling reliability equal to or higher than a high-Pb solder.
• Indium8.9HF Solder Paste Series – an industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to achieve high surface insulation resistance (SIR) and improve stability during the printing process for high-reliability automotive electronics.
• Heat-Spring® – a compressible, non-reflow metal TIM ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals—with pure indium metal delivering 86W/mK in all planes. Because of its sold metal state, Heat-Spring avoids pump-out and bake-out problems. It also offers a sustainable solution due to our indium reclaim and recycle program.

To learn more about Indium Corporation’s innovative products for EV and power electronics, visit us at booth #752 at APEC or online at indium.com

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