CLINTON, NY – Indium Corporation® is set to showcase its advanced metal thermal interface materials (TIMs) for burn-in and test at TestConX 2024, March 3-6 in Mesa, Ariz., U.S.

As a global leader in high-performance metal thermal interface materials (TIMs), Indium Corporation will showcase selections from its array of high-performance metal TIM solutions.

Renowned for their superior thermal conductivity compared to non-metals, Indium Corporation’s indium-containing TIMs for burn-in and test stand out, with pure indium metal delivering 86W/mK. These TIMs are available in various forms, including pure indium, indium-silver alloys, and indium-tin. The pure indium TIM can be optionally clad with a thin aluminum layer on the side facing the device under test (DUT) to prevent indium from adhering to the surface. Indium Corporation’s suite of standard Heat-Spring® solutions, which feature a compressible interface between a heat source and a heat-sink, include:

Heat-Spring® HSD

• The original and best standard option for interfaces with flat, smooth and parallel surfaces.
• Designed for interfaces with tight surface control >30psi

Heat-Spring® High Profile Preforms

• Patterned to optimize contact with non-planar surfaces delivering 86W/mK
• Ideal for assemblies with an extruded, unfished heatsink
• Recommended for immersion cooling and Burn-In applications
• Provides uniform contact between the burn-in head and the DUT
• Provides more uniform thermal conductivity
• Recyclable and reclaimable

Heat-Spring® HSK

• Recommended specifically for burn-in applications where multiple insertions are required
• Provides uniform contact with low resistance for high-density heat loads
• Typically clad with a thin diffusion barrier, which serves as the contact surface for burn-in and test applications
• No staining or cracking

To learn more about Indium Corporation’s metal TIMs for burn-in and test, visit our experts at booth #45 at TestConX or online at indium.com/TIM

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