January 5, 2022 - Haverhill, MA USA - The phenomenon of tin whiskers in printed circuit board assembly is a failure mechanism associated with electronic devices that use various lead-free solder alloys containing low melting point elements such as tin, cadmium, or indium.

Redmond, WA, January 5, 2021 – Data I/O Corporation (NASDAQ: DAIO), the leading global provider of advanced data and security deployment solutions for flash, flash-memory based intelligent devices and microcontrollers, announced that Dr. Cheemin Bo-Linn will be joining the Board of Directors of Data I/O.  Dr. Cheemin Bo-Linn is the CEO of Peritus Partners, a valuation accelerator, for industry sectors including automotive, electronics, consumer, and medical sectors with integrated security.

SAN JOSE, CA ― January 2022 ― SHENMAO America, Inc. is pleased to announce plans to exhibit in Booth #2534 during the 2022 IPC APEX EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center in California. The company will highlight its PF918-S High Reliability Solder Sphere and PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy design with high thermal impact reliability.

DALLAS, TX ― January 2022 ― XDry Corp., a leading supplier of humidity-controlled storage cabinets for manufacturing, laboratories and preservation, today announced that Analogic purchased a Dry Box.