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Indium Corporation is pleased to announce that Shital Rijal has joined the company as a product specialist.

In this role, Rijal supports the high-purity metals, compounds, and alloys business, focusing on growth for indium, gallium, germanium, and tin-containing products. He serves as an informational resource to both internal and external stakeholders through blog posts, conferences, trade shows, and launch events. His responsibilities also include preparing and monitoring technical data sheets and product web pages, building and nurturing customer relationships, and supporting the Sales and Marketing teams.

Prior to joining Indium Corporation, Rijal worked for four years as a research assistant, where he was involved in several projects that examined charged silica colloids, rate amplification of heterogeneous electrochemical reactions, and metal and crystal deposition. In that role, he was responsible for simulating and designing experiments; data acquisition, analysis, and documentation; and spectroscopic characterization. He also worked as a physics lecturer, teaching theory to and supervising laboratory classes of high school students. Rijal holds a Master’s of Science degree in physics from Kansas State University.

About Indium Corporation

Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®.

Indium Corporation is pleased to announce that Dr. Richard McDonough has been named Material Research Scientist.

In his new role, Dr. McDonough is responsible for developing new thermal materials and products, and providing solutions for customer challenges and applications. He also develops new testing methods to evaluate power and thermal products, and gathers data on new and existing products for marketing presentations.

Dr. McDonough joined Indium Corporation in August 2018 as a Product Specialist, most recently supporting the Semiconductor product line as a Senior Product Specialist. He has aided in the development of new products and the improvement of existing processes during his time with the company. Most notably, he assisted with the development of PicoShot® and Indium12.8HF solder pastes for dispensing and jetting applications; helped to progress the development of sintering materials; and served as a dispensing expert for Indium Corporation.

Prior to joining Indium Corporation, Dr. McDonough worked as an Analytical Chemist for Bristol Myers Squibb and as a Nuclear Engineering Officer in the U.S. Navy. He earned his bachelor’s degree in chemistry from West Virginia University; his master’s degree in physical chemistry from Syracuse University; and his Ph.D. in physical chemistry/biochemistry from Syracuse University.

About Indium Corporation

Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

CLINTON, NY — Indium Corporation is pleased to announce two updates to its team based in Suzhou, China—Fiona Chen has been promoted to the position of Senior R&D Manager and Demi Yao has been promoted to the position of R&D Sintering Project Manager.

In her new role as Senior R&D Manager, Chen assists with the development and implementation of departmental vision, pillars, and best practices to achieve Indium Corporation’s mission of developing world-class materials. Additionally, she is responsible for building and managing the R&D staff at the company’s Suzhou facility. She leads her team in designing and performing laboratory R&D work to develop products on a timely basis to increase customer satisfaction and sales.

Chen joined Indium Corporation in 2008 as a Research Chemist. In 2014, she was promoted to R&D Manager, where she led her R&D team to success in the development of ultra-low-voiding Indium10.1HF solder paste and Cu sinter paste. Chen received her master’s degree in polymer science from Soochow University in China.

In her new role as R&D Sintering Project Manager, Yao manages the research and development of advanced sintering projects by identifying opportunities to collaborate with customers. She collaborates with, and uses input from, marketing and sales team members, as well as customers, to design and develop new materials.

Yao joined Indium Corporation in 2015 as a Research Scientist for sintering materials. In this role, she successfully developed Nano/MicroCu Sintering paste. Yao earned her Ph.D. from Central China Normal University in Wuhan. She was a member of the Chinese-American exchange Ph.D. program, where she studied at the University of Kentucky during the first year of her Ph.D. program. In 2017, Demi was awarded the IMPACT “Best Paper Award.”

NORTH BILLERICA, MA — BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, today announced the appointment of Assembly Resource as its new exclusive distributor for reflow soldering systems in Northern California and Northern Nevada.

Leigh Jackson and the team at Assembly Resource will provide sales, technical and after sales support for BTU’s high-performance reflow ovens and custom furnaces. Since 1950, BTU has been the partner of choice for manufacturers facing the most complex thermal processing challenges.

“BTU’s reflow ovens are widely recognized as the best performing ovens available in the market today,” said Leigh Jackson of Assembly Resource. “We are excited to take BTU’s products into new applications and projects in our territory.”

As one of the established manufacturers’ representatives in the vital Northern California, Northern Nevada and Silicon Valley territories, Assembly Resource is focused on providing superior sales representation and support for its customers and principals. As technology and equipment for Micro-Electronics, Semiconductor Packaging and SMT Assembly become more closely aligned, Assembly Resource’s product offerings and expertise take advantage of this newly developing synergy to provide timely solutions and valuable knowledge.

“We look forward to partnering with Assembly Resources in Northern Cal and Nevada,” said Chris Heesch, Regional Sales Manager at BTU. “Leigh and his team take excellent care of their customers and have excellent process knowledge to foster success in this important high-tech region.”

With more than 20 years’ experience in PCB Surface Mount Technology (SMT), through-hole, Micro-Electronics and Semiconductor Assembly, Mr. Jackson has a significant background of sales success, detailed product demonstrations and assembly process consulting. He has worked directly for many leaders in the electronics industry and as a manufacturers’ representative providing direct sales, product demonstration, process and marketing consulting.

For more information about Assembly Resource, email Leigh@AssemblyResource.com or visit www.assemblyresource.com

To learn more, visit www.btu.com

WASHINGTON — The Semiconductor Industry Association (SIA) today released the following statement from David Isaacs, SIA vice president of government affairs, regarding the inclusion of additional funding for key research agencies in the fiscal year 2023 (FY2023) Omnibus. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.

“Building off the important investments made by the CHIPS and Science Act, SIA applauds increased funding for research and workforce development in the FY2023 Omnibus. Once passed, these investments will help advance innovation, strengthen the American STEM workforce, promote economic growth, and maintain national security by reinforcing the National Science Foundation (NSF), regional technology hubs, and the National Institute of Standards and Technology (NIST) manufacturing programs. While the funding is below the authorization levels in the CHIPS and Science Act, it nonetheless represents a positive step in enhancing the U.S. research enterprise and workforce development. We look forward to working with the new Congress and the administration next year to further prioritize American science and technology leadership for the future.”

MINNEAPOLIS, MN – The SMTA has announced the accepted speakers for the Wafer-Level Packaging Symposium (WLPS). The symposium will be held February 14-16, 2023 at the Marriott Fremont Silicon Valley in Fremont, California.

Packaging technology expert John Lau, Ph. D., will kick off the program Tuesday afternoon with a Professional Development Course on February 14, 2023. The lecture course is titled, “Advanced Packaging: Fan-out, Chiplet, and Heterogeneous Integration”.

The Technical Program consists of over 20 presentations addressing wafer-level packaging (WLP), 3D packaging, and advanced manufacturing and test technologies. The program will conclude with a “Wafer-Level versus Panel Level” panel discussion moderated by Jan Vardaman. View the full program here.

Registration for WLPS is now available online. Discounted rates are available for conference registration made on or before Wednesday, January 25, 2023. All presentations along with the PDC are included in standard registration this year. Visit https://smta.org/wafer for more information. If there are any questions, please call +1-952-920-7682 or email wafer@smta.org.

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