SAN JOSE, CA — NextFlex®, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, today announced $8.45 million in funding (including $4.25M in cost-share contribution from participants) for nine new projects as part of its Project Call 7.0 to further promote FHE development and adoption throughout the U.S. advanced manufacturing sector.

Project Call 7.0’s awarded projects represent a diverse and innovative set of companies and universities that are jointly focused on maturing the industry’s capabilities while leveraging the strong foundation established in prior Project Calls. Several projects in this latest round of funded projects focus on advancing additive manufacturing approaches for hybrid electronics and addressing critical needs in domestic advanced semiconductor packaging capabilities, which directly aligns with the needs described in the recently passed Creating Helpful Incentives to Produce Semiconductors (CHIPS) Act.

Project Call 7.0 also focuses on using hybrid electronics manufacturing processes and materials to improve environmental sustainability in electronics manufacturing. This will include using water-based inks and lower temperature processing, as well as assessing the manufacturing reshoring of low-cost single use medical devices that utilize more environmentally sustainable manufacturing approaches and materials.

This latest round of funding brings the total amount invested in FHE developments to more than $124M, including cost share contributions from Project Call participants.

“I am pleased to announce these important new projects, which will enhance the state of the art in hybrid electronics, support national efforts for semiconductor package manufacturing, and help to transition an increasing number of new capabilities into the U.S. industrial manufacturing sector for further advancement of the industry,” said Malcolm J. Thompson, PhD, Executive Director. “The NextFlex member community is accelerating FHE and additively manufactured electronics toward commercialization in a number of critical application areas addressed in these projects.”

Project Call 7.0’s awarded funding will go to:

• Development led by Lockheed Martin Advanced Technologies Laboratories for creation of FHE interposers for heterogeneous integration of a high-density fiber optic Multi-chip Module (MCM) for thinner interposers with finer feature capabilities.
• Development led by GE Research and Binghamton University for Radio Frequency (RF) Multi-chip Module (MCM) with embedded die, printed substrates, antennas, and interconnects for fast turn low loss, high thermal conductivity.
• Development led by Raytheon Missiles & Defense for printed interconnect solutions for microwave multichip packaging for improved die density.
• Development led by General Dynamics Mission Systems for additively manufactured, doubly curved multilayer circuits with active and passive components for embedded RF functionality in complex structures.
• Development led by Auburn University for sustainable, additively printed electronics through water-solvent inks, FHE repairability, and low temperature processing with high reliability.
• Development led by Auburn University for in-mold electronics interconnection and thermoforming for 3D-integrated applications including automotive, aerospace, and medical components and devices.
• Development led by GE Research and Binghamton University for manufacturing approaches for low-cost, sustainable single-use medical devices with cost and environmental life cycle assessment.
• Development led by UES, Inc. for creation of scalable manufacturing systems for ELMNT liquid metal inks for highly stretchable electronics applications.
• Development led by Sentinel Occupational Safety, Inc. for safety assessments of FHE wearable chemical and voltage sensors for risk-reduced industry adoption.

For more information about NextFlex and the Project Call program, please visit https://www.nextflex.us/project-call/

WATERBURY, CT — MacDermid Alpha Electronics Solutions, a global leader of integrated solutions for high performance electronics materials, design, and manufacturing, will highlight its latest polymer and solder paste offerings designed to meet the increasing demands for high reliability performance and protection at the upcoming SMTA Silicon Valley Expo taking place on December 8 at the Juniper Dome in Sunnyvale, California.

Featured solutions include MacDermid Alpha’s expanding portfolio of Electrolube and HiTech polymer materials engineered to meet the requirements for high reliability and protection for increasingly complex circuit boards. The Electrolube line of encapsulation resins, conformal coatings and thermal interface materials and the ALPHA HiTech line of underfills, adhesives and edgebonds are designed to deliver enhanced protection for assembled chip components for a broad range of applications including automotive, camera module and mobile.

Additionally MacDermid Alpha will promote ALPHA OM-565 HRL3, its latest low temperature solder paste which enhances electro-chemical performance over and above existing low melt point solders. This paste enables a reduction in peak reflow down to 175°C in order to mitigate common warpage induced defects such as Head-in-Pillow and Non-Wet-Open to improve assembly yields. Discover more about these and all the MacDermid Alpha product and services that support all steps of device manufacturing within every segment of the electronics supply chain at SMTA Silicon Valley on December 8 and visit MacDermidAlpha.com.

GREAT NECK, NY — Thermaltronics USA, Inc. is pleased to announce the appointment of BRL Marketing Sales Corp., a respected organization in the Midwest, as the new rep organization for the Midwestern states of Illinois, Wisconsin, Kansas and Iowa in the United States.

Bob Howe, Principal of BRL Marketing & Sales Corp., said, “Partnering with Thermaltronics and getting access to the range of unique “Curie Point” soldering systems and the award-winning solder robots provides his organization with the resources necessary to satisfy the growing needs of my customer base.”

Ed Zamborsky, Regional & Technical Support Manager for Thermaltronics, commented that Bob is especially excited about the solder robots because they incorporate vision, mapping and dynamic laser height control. These features are important for accuracy, repeatability and yield.

Additionally, he feels that the “dual head” operation of the robotic systems will enable 3D soldering applications to be included, which is something that other single head robotic systems cannot accomplish.

For more information about Thermaltronics’ products or to request a visit, e-mail the company at info@thermaltronics.com or visit www.thermaltronics.com.

CHINO, CA — Scienscope International, a leading American supplier of cabinet-style micro-focus X-ray systems, is pleased to announce its continued growth with new support personnel. The company recently hired George Fanut as its newest European Service Engineer.

Fanut received his bachelor's degree, specializing in Machines Construction Technology, and had the opportunity to enroll in a robotics project, where he realized his passion for the robotics industry. "I chose to continue my studies with a master's degree in Robotics and Mechatronics at the Polytechnic University of Timisoara, and am now in my second year of study," stated Fanut.

When he enrolled in themaster's program, Fanut applied for his first job to develop his skills in the electronics industry. He started out with Ami Trade, a company that specializes in distributing electronic components and electromechanical components for the electronic industry as a primary domain of activity. There he started as a technician on the SMT line, responsible for maintaining the continuous flow of board production, preventing errors that can stop the production line, testing all PCBs, and if needed, repairing them.

"I am excited to start my new role at Scienscope and this significant step that will help me develop my skills in the electronics industry,” added Fanut.

With expertise in machine vision, X-ray and automation, Scienscope is a one-stop solution provider for warehouse automation and optical and X-ray inspection. Scienscope also offers customization based on your facility needs.

For more information, please email Scienscope at info@scienscope.com, call 1-909- 590-7273 or visit www.scienscope.com.