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Press Releases

Atlanta, GA – Koh Young, the industry leader in True3D™ measurement-based inspection solutions, will participate in a free panel discussion with other industry experts on establishing a Design for Manufacturing strategy with a digital twin on Tuesday, 22 March 2022 at 10:30AM EST. Register today to secure your seat in the virtual event and understand the importance of a digital twin in a smart factory.

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Tom Baro will be on-site to discuss how Hentec/RPS selective soldering, lead tinning and solderability test equipment can improve your production quality.

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Alzenau, Germany – Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will highlight an array of award-winning inspection and measurement solutions at SMTconnnect in booth 4.A-233 on the NürnbergMesse event grounds during 10-12 May 2022. The following is just a glimpse into what Koh Young will have in store for our visitors at the tradeshow:

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March 2022  EVS International, the leader in solder recovery, is pleased to announce that it entered a new manufacturers’ representative agreement with TechSystems. Under the agreement, Chris Putney, President of TechSystems, will represent EVS’ solder recover systems throughout Northern California and Western Nevada.

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JALISCO, MEXICO ― March 2022 ― SMarTsol Technologies, a technical services and equipment provider for Mexico and the US, today announced plans to exhibit at the SMTA Juarez Expo & Tech Forum, scheduled to take place Thursday, May 19, 2022 at the CIITA – IPN Chihuahua in Mexico. The company will showcase its Link Conveyor along with its 4-Axis Soldering Robot and Techman Robot Collaborative Robot. Additionally, SMarTsol is a major distributor for many leading brands, such as Nordson TEST & INSPECTION, PBT Works, KYZEN, ASM Assembly Systems and more.  

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BANNOCKBURN, Ill., USA, March 11, 2022 — The U.S. Senate last night approved an FY 2022 spending package that contains $7.5 million for further research and development on lead-free electronics in defense and high-performance applications, sending the measure to President Biden for his expected signature.

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