Indium Corporation’s Miloš Lazić, product development specialist, will share his industry insight on the next generation of metal thermal interface materials (TIMs) during ThermalLive™, to be held virtually, Oct. 18-19.

For many years, metals have been used as TIMs in the industry. Due to their high reliability and high thermal conductivity, the metal TIMs have been great solutions, especially for the most challenging applications. Thermal conductivity and interfacial resistance are the most important properties of a TIM. One of the biggest obstacles for using metal TIMs in applications is the interfacial resistance. Most of the current metal TIMs are quite stiff and require pressure to form seamless connection between materials and surfacing, to lower interfacial resistance. With devices becoming smaller, consuming more power, and producing more heat, finding the right TIM becomes one of the most critical steps in any application.

In The Next Generation of Metal Thermal Interface Materials – Liquid Metal Pastes, Lazić will discuss the development—and advantages—of liquid metal pastes (LMPs). LMPs provide an enhanced metal TIM solution that combines high thermal conductivity and lower interfacial resistance, compared to common metal TIM options in the market. Furthermore, it offers additional benefit as it is liquid metal in nature but better performing: it allows low and controlled bondline thickness, can be applied by jetting or dispensing, and a higher viscosity that survives pressure without leaking.

Lazić provides technical support, including guidance and recommendations to customers related to process steps, equipment, techniques, and materials. In addition, he delivers technical training to staff and industry partners. Lazić attended the University of Nis, School of Electronic Engineering, where he earned his bachelor’s degree in electrical engineering and master’s degree (M. Eng.) in electronic engineering. Lazić is a founder of the non-profit organization “Urban Youth Forum,” which encourages students to plan, develop, and execute projects involving environmental protection through the recycling of electronic waste.

About Indium Corporation

Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.

About ThermalLive™

ThermalLive™ is a free online event for electronics and mechanical engineers to learn the latest in thermal management techniques and topics. Produced by Electronics Cooling magazine, Thermal Live features webinars, whitepapers, and product demo videos.

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