bintel AB and Scanfil Vellinge AB have signed a manufacture and product supply agreement. The agreement strengthens bintel’s ability to scale up the supply of smart sensors meeting the increasing demand within the waste management industry.
It’s Smart Made Simple
Based in Nottingham, Smart Made Simple (SMS) serves high-tech customers based mainly in the UK with UK markets. Their market sectors include industrial, medical, space, security, transportation, communication and gaming. Their clients range from established companies to start-up ventures.
MicroCare LLC, experts in critical cleaning solutions, has announced that it has received registration from the U.S. Food and Drug Administration (FDA) for its new Stereze Hand Sanitizer Wipes, Gel and Spray. Launched at the end of 2020, Stereze Hand Sanitizers are safe and compliant for cleaning hands and are an important part of an effective hand hygiene program at work and at home.
Europlacer has appointed a veteran of the electronics industry to head up the company’s marketing, business development and communications strategy worldwide. Bringing substantial expertise from leadership roles in major corporations and mid-sized companies, François Erceau joined the Europlacer Executive Management Team in December 2020 as Group Strategic Direction and Marketing Officer.
2020 has been a mixed bag for all, both personally and professionally. Manufacturing was seen as a critical industry, so it was supposed to be ‘business as usual’, yet of course nothing was ‘business as usual’.
Kempen, 19 January 2021 - Peters underlines the significance of the thermal management of assemblies. The supplier of coatings for the electronics industry offers solutions. Higher component densities and the use of high tech components make a thermal management increasingly more relevant. Local thermal load may exceed the maximum permissabilities of the individual assemblies. Decisive, states the supplier of coatings for protection of assemblies and electronic components, is not only the rapid heat dissipation away from the point of origin, the high-performance component, but also the thermal dissipation away from the entire assembly.