IPC was founded in 1957 as the Institute for Printed Circuits. Over time the name was changed to the Institute for Interconnecting and Packaging Electronic Circuits, still trying to maintain the IPC acronym. By the 1990s, most people in the industry could not remember the full name and/or did not agree on what the words in the name meant. Members expressed overwhelming approval for keeping the initials IPC but indicated that there was no one word or expression that adequately describes IPC's constituency. The IPC Board of Directors agreed to make IPC the formal name of the organization.
OSAKA, JAPAN — December 2020 — Nihon Superior Co. Ltd., an advanced joining material supplier, is pleased to announce that Keith Sweatman, Senior Technical Advisor, will participate in a panel discussion on Tuesday, Dec. 8, 2020 at 7:30 a.m. PCT / 10:30 a.m. EST / 3:30 p.m. GMT / 4:30 p.m. CET. The panel discussion is entitled “Low temperature solders – revisited.”
San Diego — December 2020 —— KIC is pleased to announce the appointment of ROCKA Specialty Solutions SA de CV as its manufacturers’ representative throughout Mexico.
Data I/O’s new SentriX Product Creator tool for OEMs simplifies IoT security deployment for mission critical applications with support for Infineon OPTIGA TPM with pre-configured security use cases
Indium Corporation’s newest jetting and microdispensing solder paste, Indium12.8HF, has been officially recommended by NSW Automation for use with their newest microfluid dispenser, SD1.
• Popular selective soldering systems used in electronics manufacturing are highlighted