Flex (NASDAQ: FLEX) announced the appointment of Dr. Todd M. Fruchterman as president of the Reliability Solutions segment, effective November 30, 2020. As part of the company’s succession planning, Dr. Fruchterman’s appointment follows Paul Humphries’s notice of his retirement, effective November 30, 2020 with a transition period ending March 31, 2021.
TEMPE, Ariz., November 19, 2020 /PRNewswire/ -- Amtech Systems, Inc. (NASDAQ: ASYS), a manufacturer of capital equipment, including thermal processing and wafer polishing, and related consumables used in fabricating semiconductor devices, such as silicon carbide (SiC) and silicon power devices, analog and discrete devices, electronic assemblies and light-emitting diodes (LEDs), announced today that its subsidiary, BTU International, Inc., achieved record sales for its PYRAMAX reflow systems sold into advanced packaging applications in fiscal year ending September 30, 2020.
The SMTA China cordially invites you to participate in SMTA China East Conference held on 21-22 April 2021 in Shanghai. This event, held in conjunction with NEPCON China 2021, will as usual address the industry’s most pressing issues in Advanced Packaging/Components, Assembly Business/Supply Chain, Emerging Technologies, Harsh Environment Applications, PCB Technology, Process Control and Soldering Processes.
Global tin industry association ITA is pleased to announce that Brazilian tin producer White Solder has joined it membership. Representing the world’s major tin producers, ITA is the world authority on tin and at the forefront of responsible sourcing standards implementation.
BANNOCKBURN, Ill., USA, November 19, 2020 — To help the electronics manufacturing industry harness the full potential of smart factory/Industry 4.0 technologies, IPC has launched its Factory of the Future initiative. The framework is intended to drive the industry forward by promoting and accelerating modernization; helping to Build Electronics Better.