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Press Releases

Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, announces that it will host a live webinar on Thursday, Aug. 27, 2020. The webinar will be offered in two session at 7 a.m. and 10 a.m. CST, and will be available to join at: https://essemtec.com/live-online-webinar.

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FREMONT, CA ― August 2020 ― AQS, Inc., a state-of-the-art EMS provider located in Silicon Valley, is pleased to announce that it recognized two employees at its Fremont facility for 15 years of service. Manual Rodriguez and Maribel Arrez were presented with one week of additional paid vacation and Bento-Boxes were provided to all employees. Their names were added to a plaque that is displayed in the company’s lobby in recognition of this milestone.

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Moriah Root, Quality Manager at Z-AXIS, has won a “Millennials in Manufacturing” Award from FuzeHub, the statewide Manufacturing Extension Partnership (MEP) center for New York State.

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Seoul, Korea  – Industry leader Koh Young announces it has joined forces with Mentor, a Siemens business, to deliver an enhanced programming solution, which will benefit the printed circuit board assembly market. Building on the AI-powered Koh Young Auto Programming software (KAP), Mentor integrated its Valor Process Preparation Software to further simplify Automated Optical Inspection (AOI) programming and reduce production costs by saving time through the implementation of Mentor’s Open Product Model.

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Enics is driving sustainable success of customers by delivering innovative turnkey solutions in industrial electronics. New appointments, Mr Mahmut Bertan as Chief Business Officer and Enics Management team member and Mr Rami Aro as Director, Services, are strengthening Enics’ drive in strategic focus areas: Customer excellence and service business.  

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Advanced Assembly, the pioneers of the quick-turn PCB assembly services, announced the installation of its new selective solder machine, the Juki iCube. This new robust system provides the company with a unique ability to perform selective soldering on through-hole mounted components faster and with more repeatability than before.

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