SAN FRANCISCO--(BUSINESS WIRE)--Aug 19, 2020-- Tempo Automation, the leading software-enabled manufacturer for quick-turn prototyping and low-volume production of printed circuit board assemblies (“PCBA”), today announces that Ryan Benton has joined the management team as its Chief Financial Officer reporting to Tempo Automation’s Chief Executive Officer, Joy Weiss.

Indium Corporation’s Andreas Karch, Regional Technical Manager, Germany, Austria, and Switzerland, will host an InSIDER Series webinar focused on solder paste attributes and their impact on increased product service life reliability requirements. The webinar will be presented on Webex, Wednesday, Sept. 2 at 9 a.m. Eastern Time (2 p.m. British Time/9 p.m. Malaysia Time).

PITTSBURGH--(BUSINESS WIRE)--Intervala LLC, a full-service manufacturer of high-reliability, precision electronic and electromechanical products, announced today that Eric Sicard has joined the Company as senior business development manager. A 20-year veteran of the electronics manufacturing services (EMS) industry, Sicard is responsible for cultivating customer relationships and new business opportunities for Intervala.

(Waterbury, CT USA) – August 18, 2020 - The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will be presenting two technical papers; “Methods of Reducing or Eliminating Voids in BGA and BTC Devices” and “Can Low Cost Silver Free Alloys Be Used in Type II and III Assemblies?” at the SMTA China South Technical Conference taking place from August 26-27 in Shenzhen, China.