NORTH BILLERICA, Mass., August 2019 — BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, today announced that it will exhibit at the NEPCON ASIA (NEPCON SOUTH CHINA) Show, scheduled to take place August 28-30, 2019 at the Shenzhen Convention & Exhibition Center in China. The company will demonstrate a PYRAMAX 150A 12-zone reflow oven with the Profile Guardian Redundant Process Monitor in Hall 1, Booth 1M45.

Dr. Jack Zhao shares data for WLP improvements with plasma treatment

Concord, California, USA - 7 August 2019 - Nordson MARCH, a Nordson company (NASDAQ: NDSN), a global leader in plasma processing technology, will present the paper, "Plasma Applications for Wafer Level Packaging, Part 1," at the 20th annual International Conference on Electronic Packaging Technology (ICEPT) in Hong Kong 11-15 August 2019. The session will be held on August 14 at 11:55 AM.

AUSTIN, TX — August 2019 — Optel Software, a global provider of smart software solutions for the electronics assembly industry, will exhibit with Wong’s Kong King Int’l (Holdings) LTD. (WKK Distribution Ltd.) in Booth 1J65 at the NEPCON ASIA (NEPCON SOUTH CHINA) Show, scheduled to take place Aug. 28-30, 2019 at the Shenzhen Convention & Exhibition Center in China. WKK represents Optel Software.

CYPRESS, CA ― August 2019 ― Metcal today announced plans to exhibit in Booth 1E25 at NEPCON Asia, scheduled to take place Aug 28-30, 2019 at the Shenzhen Convention and Exhibition Center. Representatives from Metcal will demonstrate its new Robotic Soldering System, the Connection Validation (CV) Soldering System with new hand-pieces, AC-STC Tip Cleaner, HCT2-200 Hot Air Pencil and VFX–1000 Fume Extraction unit.