The requirements for electronic assemblies are becoming more and more demanding. This is not only due to an increase in packaging density and progressive miniaturization, but also to an increase in areas of application. For example, reliable bonding and sealing processes are becoming more important in electronics manufacturing, due to electric vehicles and the associated integration of touch displays, highly sophisticated security and sensor systems or the increased installation of cameras. Therefore, plasma as a pre-treatment for bonding and sealing is moving into the focus of developers, production specialists and quality managers.

Hilpert electronics AG is the sales partner of the Japanese company Avio for the DACH region, Northern and Eastern Europe and usually operating in the electronics manufacturing sector. But Avio's ultrasonic welding equipment can also be used in the production of medical products, for example face masks. Here they can simplify and accelerate the manufacturing process.

MULLICA HILL, NJ ― April 2020 ― Insituware LLC, the provider of the first smart in situ measurement solution with integrated machine learning technology, announces the appointment of Denis Barbini, Ph.D. as Chief Scientist.

April 6, 2020 – ECD today announced that Mike Hayward will lead the company’s operations in the EMEA region where he will oversee product sales, channel partnerships, customer technical support and strategic relationships. Hayward, who has an extensive technical background and has worked in the electronics industry for over 35 years, previously held a similar role with ECD and is delighted to re-join the company to help lead growth initiatives as the Director of EMEA Operations.