Circuits Assembly Online Magazine - Current

Press Releases

Atlanta, Georgia – In support of the SMTA and its local chapters, Koh Young will be presenting on March 19, 2020 at the events in Dayton, Ohio and Anaheim, California. Based on its award-winning portfolio of inspection and smart factory solutions, Koh Young selected two different technical presentations encompassing the solder paste inspection (SPI) and automated optical inspection (AOI) processes.

CALGARY, Alberta, March 02, 2020 (GLOBE NEWSWIRE) -- Eguana Technologies finalized the transition of its Enduro product line to contract manufacturing to support European growth and regional expansion including France, United Kingdom and Ireland, and the Scandinavian countries.

New SMT lines double the company’s capacity for surface mount technology (SMT) PCB assembly; address growing demand for electronics manufacturing services in the USA

Manassas, VA – March 2, 2020 ZESTRON, the global leading provider of high precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that it will host “Should You Clean PCBs?” on Thursday March 26th, from 1:30 PM to 2:30 PM EDT. This is the first installment of the ZESTRON Academy 2020 Cleaning Webinar Series, and will be presented by our industry expert, Umut Tosun, M.S.Ch.E, Application Technology Manager.

Plymouth, WI — March 2020 — Kurtz Ersa Inc., a leading supplier of electronics production equipment, will hold an ERSA Versaflow 3 Selective Soldering Level II Maintenance Training Course from Monday, March 30, 2020 at 1 p.m. to Wednesday, April 1, 2020 at 12 p.m. at its Plymouth office. The two-day class will provide the knowledge and hands-on experience required to maintain and troubleshoot the Versaflow 3 machines.

Shingle Springs, CA — March 2020 — PDR, a leading manufacturer of BGA rework systems, test and inspection equipment since 1985, is pleased to announce that it offers courses through its PDR Alliance Network for the new IPC 7711/21C standard – The Rework and Repair of Electronic Assemblies – which includes focused infrared technology as a method for the removal and replacement of components.