Visit Nordson SELECT at IPC APEX Expo Booth 1619 to see advanced selective soldering solutions for every application
MADISON, AL – January 2020 – STI Electronics, Inc. is an award-winning multifaceted technical organization whose goal is to provide support through engineering and training resources. STI uses the most advanced, state-of-the-art equipment to successfully meet the challenges and issues facing today’s electronic manufacturing. STI is proud to announce its corporate sponsorship of the 25th Annual Pan Pacific Microelectronics Symposium, which will be held February 10-13, 2020, on Big Island, Hawaii.
MENTOR, OH ― January 2020 ― Libra Industries, a privately held electronics manufacturing services (EMS) provider, is pleased to announce that David Chavez has joined the company as the New Vice President of Integrated Business Development. In his new role, Chavez will help lead, develop and grow sales, targeting customers that need full integrated systems including electronics, machining, final assembly and test capabilities.
The ProtectoXC dispensing system and the CondensoXC vapour phase soldering system will be presented at the trade fair Rehm Thermal Systems is starting its 2020 trade fair attendances with APEX EXPO IPC in San Diego, US. As an established manufacturer of reflow soldering systems, as well as drying and coating systems, Rehm has also made a name for itself on the American electronics market, especially in recent decades.
ENCINITAS, CA ― January 2020 ― inspīre solutions LLC announces that it will produce custom SMT machine tooling at Booth #951 at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020 at the San Diego Convention Center in California.
Irvine, California – At next month’s IPC APEX EXPO electronics event in San Diego, CA, Henkel’s exhibit and conference participation will highlight the materials leader’s latest innovations and the scope of its portfolio, which offers ‘solutions across the board’ for multiple applications. Henkel’s aggressive product development initiatives have resulted in advanced thermal management materials for next-generation 5G infrastructure systems, semi-sintering materials that address demanding aerospace reliability requirements, and low voiding solder pastes that help ensure electrical and mechanical reliability for power electronics.