Irvine, California – At next month’s IPC APEX EXPO electronics event in San Diego, CA, Henkel’s exhibit and conference participation will highlight the materials leader’s latest innovations and the scope of its portfolio, which offers ‘solutions across the board’ for multiple applications. Henkel’s aggressive product development initiatives have resulted in advanced thermal management materials for next-generation 5G infrastructure systems, semi-sintering materials that address demanding aerospace reliability requirements, and low voiding solder pastes that help ensure electrical and mechanical reliability for power electronics.

Here come previously impossible devices and structures. The new IDTechEx report, “Smart Material Opportunities in Structural Electronics 2020-2030” analyses and forecasts a remarkable $200 billion materials opportunity by making dumb structures smart.

Cypress, CA — January 2020 — Techcon, a leader in precision fluid dispensing technologies, plans to exhibit in Booth #2247 at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020 at the San Diego Convention Center in California. The company will showcase its new TS9800 Series Jet Valve Dispensing System in the Metcal booth.

U.S. Chamber Applauds Senate Passage of the USMCA