NASHVILLE — August 2019 — KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, is pleased to announce that T.C. Loy, KYZEN Sdn Bhd’s Technical Sales Manager, will present at the 2019 IPC Southeast Asia High Reliability Conference – Thailand, scheduled to take place Aug. 16, 2019 at The Grand Fourwings Convention Hotel. Loy will present: “Developing Cleaning Process Parameters.”

OSAKA, JAPAN — August 2019 — Nihon Superior Co. Ltd., an advanced joining material supplier, today announced plans to exhibit in Booth #1G08 at the NEPCON ASIA (NEPCON SOUTH CHINA) Show, scheduled to take place Aug, 28-30, 2019 at the Shenzhen Convention & Exhibition Center in China. The company will celebrate the achievements produced by the well-known SN100C® lead-free alloy. TipSave N flux-cored solder wire will be introduced and SN100CVTM P608 D4 solder paste will be shown.

EAST HANOVER, NJ – At the SMTA International 2019 technical conference, Portland State University and Zymet will present their investigations on enhancing the board level reliability of large WLP’s, for harsh environment applications.  WLP’s, which include WLCSP’s and FO-WLP’s, offer a path to lower weight, smaller formfactor, and higher performance.  However, their low coefficient of thermal expansions are not well matched to that of commonly used organic substrates. 

Scanfil, a Global Contract Manufacturer and Systems Supplier, has together with its strategic partner Sigma Connectivity won a development & manufacturing business within the field of connectivity to a global leader within Logistic & Material Handling.