EAST HANOVER, NJ – At the SMTA International 2019 technical conference, Portland State University and Zymet will present their investigations on enhancing the board level reliability of large WLP’s, for harsh environment applications.  WLP’s, which include WLCSP’s and FO-WLP’s, offer a path to lower weight, smaller formfactor, and higher performance.  However, their low coefficient of thermal expansions are not well matched to that of commonly used organic substrates. 

Scanfil, a Global Contract Manufacturer and Systems Supplier, has together with its strategic partner Sigma Connectivity won a development & manufacturing business within the field of connectivity to a global leader within Logistic & Material Handling.

Tokyo, Japan – Yamaha Motor Robotics Holdings Co., Ltd. (YMRH) has recently been formed around the acquisitions and integration of Shinkawa Ltd., and APIC Yamada Corporation. YMRH now joins the family of Yamaha Motor Co., Ltd.

Electronic Assemblies for Communication and Navigation Program

TAMPA, Fla.--(BUSINESS WIRE)--Sypris Electronics, LLC, a subsidiary of Sypris Solutions, Inc. (Nasdaq/GM: SYPR), announced today that it has recently received a multi-year contract award from Northrop Grumman Corporation (NYSE: NOC) to manufacture a variety of mission-critical electronic assemblies for one of the largest Government DoD programs. Terms of the agreement were not disclosed.