August 13th, 2019 ― Cranston, Rhode Island USA ― AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Flopy Feng will present at the 2019 SMTA China South Technical Conference at the Shenzhen Convention & Exhibition Center in Shenzen, China. Flopy’s presentation, “An Update on High Reliability Lead-Free Solder Alloys,” is scheduled for Thursday, August 29th, 2019 from 14:55-15:30.

GARLAND, TX ― August 2019 ― National Circuit Assembly, a provider of PCB, cable and electro/mechanical manufacturing and test services to leading OEMs, today announced the appointment of Mr. Mark Cottam as the new Vice President of Sales & Marketing.

Cypress, CA — August 2019 — Techcon, a leader in precision fluid dispensing technologies, today announced plans to exhibit at NEPCON Asia, scheduled to take place Aug 28-30, 2019 at the Shenzhen Convention and Exhibition Center. The company will showcase its TS8100 Series Progressive Cavity Pump, TS5000DMP-DCX Auger Valve, Smart Valve Controller Series and TSR2000 Smart Dispensing Robots in Booth 1E25. Additionally, attendees will be the first to preview the new Techcon Jet Valve and Controller, scheduled to launch later this year.

Alcester, Warwickshire, UK, 12 August 2019: Quanta Dialysis Technologies Ltd (“Quanta” or the “Company”), a pioneering British medical technology company developing a personal haemodialysis system (SC+) for patient use at home and in the clinic, announces that it has selected Benchmark Electronics Inc. (“Benchmark”) (BHE), a global provider of manufacturing, engineering and design services, as its production partner for the SC+ haemodialysis machine.