10.01.2019 – Atlanta – During a two-day technical workshop in New England, Koh Young America will discuss the important role of solder paste inspection (SPI) to understand and then optimize the solder paste print process to improve printed circuit board assembly production yield. Additionally, Panasonic will discuss how the proven connectivity between its printers and mounters and the Koh Young SPI and Automated Optical Inspection (AOI) equipment will benefit manufacturers with Advanced Process Control (APC). The 2-day Print Process Characterization workshop is scheduled for 23-24 October 2019 at the Westford Regency with live machine demonstrations at the Assembly Products Lab in Chelmsford, MA.

New solution expected to help triple production volumes, expand market opportunities for growing EMS.

SAN JOSE, Calif.--(BUSINESS WIRE)--Flex (NASDAQ: FLEX) today announced that Lynn Torrel has been named chief supply chain and procurement officer, responsible for direct and indirect materials, transportation and logistics, business operations, materials management, and strategic supply chain management.

St. Louis Park, MN – Master electronics industry representative e-tronix, the exclusive North American representative for tin and alloy leader Nathan Trotter, announces that independent testing results have confirmed the composition of NT100Ge solder bar and wire products to be equivalent to that of well-known SN100C® solder. The analysis, commissioned by e-tronix and performed by respected independent test laboratory DfR Solutions, evaluated NT100Ge alongside the two most prevalent SN100C brands.