ROSEMONT, IL – This month, the SMTAi 2018 conference was held at the Rosemont Convention Center, Rosemont, IL.  One notable topic pertained to the board level reliability of low temperature or “lower-temperature” alloys.  LTS assembly is of interest for multiple reasons including lower power consumption, less warpage and higher assembly yields, and a possible path to more complex assemblies.  Much work is being performed to compare the reliability of LTS with conventional SAC alloy and some of that work was presented at the conference.

October 2018 — optical control GmbH is pleased to announce plans to exhibit at electronica 2018, scheduled to take place Nov. 13-16, 2018 at the Messe Munchen in Munich, Germany. The company will demonstrate the OC-SCAN®CCX.3 component counter with automatic loading and offline station in the joint pavilion “Cluster Mechatronik & Automation Management GmbH,” Hall A2 Booth 337.

EAST HANOVER, NJ – At the IPC’s APEX EXPO, Zymet will be featuring a reworkable edgebond adhesive that has recently been shown to be capable of significantly enhancing the board level reliability (BLR) of low temperature solder (LTS) assemblie. 

Heraeus Electronics has opened a new Innovation Center in Shanghai to develop and test material systems.