NASHVILLE — April 2018 —KYZEN announces that Tom Forsythe, Executive Vice President, will present during the eSMART Factory Conference, jointly organized by Global SMT & Packaging magazine and SMTA, on Thursday, May 24, 2018 at the Plug ‘n Play Tech Center in Sunnyvale, CA. Forsythe will present the paper entitled, “Applying Industry 4.0 Methods to Electronic Assembly Reflow and Cleaning Process.”

Saint-Egrève, France, April 2018 — Vi TECHNOLOGY, a leading provider of 3D inspection solutions for PCB assembly and a member of Mycronic Group, today announced that it will exhibit with its representative at the S.E.E. Scandinavian Electronic Event, scheduled to take place April 24-26, 2018 at the Kista Expo Center in Sweden. Wretom will showcase the PI Series 3D SPI in Booth C02:30.

April 2018 — optical control GmbH & Co. KG, a world leader in automated component counting technology, today announced that it has signed on with The Murray Percival Company to represent its technology throughout the Midwest.

Irvine California, USA – TopLine will exhibit for the 5th straight year at NEPCON China in Shanghai, in Stand #1A21. Featured products will include CCGA - Column Grid Arrays and Daisy Chain BGA test vehicles. TopLine’s CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs) and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions. “Many people are still unaware of the benefits that solder columns provide to reduce stress caused by CTE mismatch when interconnecting area array packages and the PC board,” Hart adds. For more information, and a quick chart of TopLine CCGA products, visit http://www.topline.tv/CCGA.html.