May 2018 — The Balver Zinn Group announces that it will exhibit in Hall 4, Booth #231 at SMT Hybrid Packaging scheduled to take place June 5-7 in Nuremberg, Germany.

Pasadena, California, USA – Members of the NASA Technology Licensing and Commercialization Team visited the TopLine exhibit at the recent 2018 Space Tech Expo show in Pasadena, California, USA, where they awarded a NASA lapel pin to TopLine CEO Martin Hart in appreciation of TopLine’s efforts to develop a business model around PID (Particle Impact Damper) technology.

Fontana, California, May 2018: Everett Charles Technologies’ (ECT’s) LFRE plated probes successfully passed extensive qualification testing verses an incumbent probe at a major US based OEM for power infrastructure equipment.

Seoul, South Korea – Koh Young Technology will exhibit “True 3D Smart Factory solutions powered by the AI platform” in booth 4C-20 at the upcoming JPCA show scheduled for June 6-8, 2018 at the Tokyo Big Sight in Japan.