BANNOCKBURN, Ill., USA, April 12, 2018 — Don Dupriest, Lockheed Martin Missiles & Fire Control, has been elected chair of the IPC Technical Activities Executive Committee (TAEC) for a two-year term. Dupriest succeeds Chris Mahanna of Robisan Laboratory, Inc., who held the role for IPC's top standards development oversight committee for the past two years.

Saint-Egrève, France, April 2018 — Vi TECHNOLOGY, a leading provider of 3D inspection solutions for PCB assembly and a member of Mycronic Group, today announced that its products will be showcased at NEPCON China, scheduled to take place April 24-26, 2018 at the Shanghai World EXPO Exhibition & Convention Center.

April 16th, 2018 ― Cranston, Rhode Island USA - AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the appointment of Eric Moen to the position of Business Development Manager.

SMTA Europe
Electronics in Harsh Environments Conference
Amsterdam, Netherlands
April 24, 25 & 26, 2018