Plymouth, WI — March 2018 — Kurtz Ersa North America, a leading supplier of electronics production equipment, today announced that it will hold an ERSA Versaflow 3 Selective Soldering Level II Maintenance Training Course from Monday, April 16, 2018 at 1 p.m. to Wednesday, April 18, 2018 at 12 p.m. at its Plymouth office. The two-day class will provide the knowledge and hands-on experience required to maintain and troubleshoot issues on the Versaflow 3 machines.
CHATSWORTH, CA – March 13, 2018 – NEO Tech, a leading provider of manufacturing technology and supply chain solutions for brand name OEMs in the industrial, medical and aerospace & defense markets, announces that it recently produced and published new and expanded guidelines for the manufacture of Low-Temperature Co-fired Ceramic (LTCC) and Aluminum Nitride (AlN) packaging solutions.
Enhances Customer Engagement through China Demo Center
SINGAPORE--(BUSINESS WIRE)--Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke & Soffa”, “K&S” or the “Company”), announced today the official opening of their China Demo Center in its Suzhou manufacturing facility. K&S Suzhou was established in 2002, spanning over 17,000 square meters, encompasses the company’s equipment software and process engineering, R&D as well as production lines for consumables products such as capillaries, blades and wedge bonding tools.
Rosenheim (Germany), March 2018: Multitest has been the market leader for MEMS/sensor test and calibration equipment for more than 15 years. Multitest has now launched the next generation of its 6DOF gyro test module for singulated packages, which provides significant production benefits resulting in even lower cost of test, enhanced test accuracy and higher daily output.
Milwaukee, WI – Milwaukee Electronics Company, today announced that Rick McClain had been promoted to president. McClain has served as the Company’s chief operating officer (COO) since 2016. P. Michael Stoehr, who previously served as president and chief executive officer (CEO), will continue as CEO.
Irvine, California, USA – TopLine will once again be the premier sponsor of the upcoming IMAPS Wire Bonding Conference. In making the announcement, TopLine CEO Martin Hart stated that he is delighted to support the conference as the leading sponsor for the second time. The Wire Bonding workshop and tabletop exhibition will be held October 8, 2018 in California at the Pasadena Convention Center. The event is co-located with the IMAPS 51st Symposium on Microelectronics.